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Hybrid Multilayer High Frequency PCB Board Bulit On Rogers 20mil RO4003C and FR-4

Hybrid Multilayer High Frequency PCB Board Bulit On Rogers 20mil RO4003C and FR-4

MOQ: 1
Price: USD 2.99-9.99 PER PIECE
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Western Union
Supply Capacity: 45000 pieces per month
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-XXXX-V1.24
Number Of Layers:
4 Layer, 6 Layer, Multilayer, Hybrid Type (Mixed)
Glass Epoxy::
RO4350B Rogers
Final Foil:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Final Height Of PCB::
1.0-5.0mm
Surface Finish:
Bare Copper, HASL, ENIG, Silver, OSP,etc.
Solder Mask Color::
Green, Black, Blue, Yellow, Red Etc.
Colour Of Component Legend:
Green, Black, Blue, Yellow, Red Etc.
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 2.99-9.99 PER PIECE
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Western Union
Supply Ability:
45000 pieces per month
Product Description

Hello Guys,

The mixed high frequency PCB introduced today is 4-layer board on Rogers core of 20mil RO4003C pressed with FR-4.

Hybrid Multilayer High Frequency PCB Board Bulit On Rogers 20mil RO4003C and FR-4 0

 

Firstly, it's a 4 layer structure. Layer 1 to layer 2 is 20mil Rogers core, which are the main wiring layers for the signal lines.

Layer 3 to layer 4 is the FR-4 core, which is connected by the Prepreg of FR-4.

Each layer is connected by plated through holes. This is a better method to keep the board cost effective.

The inner layer and out layer of copper is 1 ounce.

 

Let's take a look at its microsection chart.

Hybrid Multilayer High Frequency PCB Board Bulit On Rogers 20mil RO4003C and FR-4 1

 

Here on the left is the PTH hole, the bottom is layer 1 to layer 2 which is high frequency material, the upper part is glass fiber material. The finished thickness of the plate is 1.6mm.

The color of solder mask and silkscreen are also commonly used in green and white. Surface finish on pads is immersion gold.

 

PCB Capability
PCB Type: Hybrid PCB, Mixed PCB
Mixed type: RO4350B + FR4;
  RO4003C + FR4;
  F4B + FR4;
  RT/duroid5880 + FR4;
  RT/duroid5880 + RO4350B
Solder mask: Green, Red, Blue, Black, Yellow
Layer count: 4 Layer, 6 Layer, Multilayer
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 1.0-5.0mm
PCB size: ≤400mm X 500mm
Surface finish: Bare copper, HASL, ENIG, Immersion tin, OSP
   

 

At present, the mature mixed pressing materials are as follows:

RO4350B + FR4;

RO4003C + FR4;

F4B + FR4;

RT/duroid5880 + FR4

RT/duroid5880 + RO4350B

 

We can provide you with prototype and mass production.

If you're interested in hybrid PCB, please feel free to contact us.

Thank you for your reading.

products
PRODUCTS DETAILS
Hybrid Multilayer High Frequency PCB Board Bulit On Rogers 20mil RO4003C and FR-4
MOQ: 1
Price: USD 2.99-9.99 PER PIECE
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Western Union
Supply Capacity: 45000 pieces per month
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-XXXX-V1.24
Number Of Layers:
4 Layer, 6 Layer, Multilayer, Hybrid Type (Mixed)
Glass Epoxy::
RO4350B Rogers
Final Foil:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Final Height Of PCB::
1.0-5.0mm
Surface Finish:
Bare Copper, HASL, ENIG, Silver, OSP,etc.
Solder Mask Color::
Green, Black, Blue, Yellow, Red Etc.
Colour Of Component Legend:
Green, Black, Blue, Yellow, Red Etc.
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 2.99-9.99 PER PIECE
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Western Union
Supply Ability:
45000 pieces per month
Product Description

Hello Guys,

The mixed high frequency PCB introduced today is 4-layer board on Rogers core of 20mil RO4003C pressed with FR-4.

Hybrid Multilayer High Frequency PCB Board Bulit On Rogers 20mil RO4003C and FR-4 0

 

Firstly, it's a 4 layer structure. Layer 1 to layer 2 is 20mil Rogers core, which are the main wiring layers for the signal lines.

Layer 3 to layer 4 is the FR-4 core, which is connected by the Prepreg of FR-4.

Each layer is connected by plated through holes. This is a better method to keep the board cost effective.

The inner layer and out layer of copper is 1 ounce.

 

Let's take a look at its microsection chart.

Hybrid Multilayer High Frequency PCB Board Bulit On Rogers 20mil RO4003C and FR-4 1

 

Here on the left is the PTH hole, the bottom is layer 1 to layer 2 which is high frequency material, the upper part is glass fiber material. The finished thickness of the plate is 1.6mm.

The color of solder mask and silkscreen are also commonly used in green and white. Surface finish on pads is immersion gold.

 

PCB Capability
PCB Type: Hybrid PCB, Mixed PCB
Mixed type: RO4350B + FR4;
  RO4003C + FR4;
  F4B + FR4;
  RT/duroid5880 + FR4;
  RT/duroid5880 + RO4350B
Solder mask: Green, Red, Blue, Black, Yellow
Layer count: 4 Layer, 6 Layer, Multilayer
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 1.0-5.0mm
PCB size: ≤400mm X 500mm
Surface finish: Bare copper, HASL, ENIG, Immersion tin, OSP
   

 

At present, the mature mixed pressing materials are as follows:

RO4350B + FR4;

RO4003C + FR4;

F4B + FR4;

RT/duroid5880 + FR4

RT/duroid5880 + RO4350B

 

We can provide you with prototype and mass production.

If you're interested in hybrid PCB, please feel free to contact us.

Thank you for your reading.

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