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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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TC600 Microwave PCB with 15mil 20mil 30mil 50mil 60mil Thickness TC600 High Frequency PCB with Immersion Silver

TC600 Microwave PCB with 15mil 20mil 30mil 50mil 60mil Thickness TC600 High Frequency PCB with Immersion Silver

  • TC600 Microwave PCB with 15mil 20mil 30mil 50mil 60mil Thickness TC600 High Frequency PCB with Immersion Silver
  • TC600 Microwave PCB with 15mil 20mil 30mil 50mil 60mil Thickness TC600 High Frequency PCB with Immersion Silver
TC600 Microwave PCB with 15mil 20mil 30mil 50mil 60mil Thickness TC600 High Frequency PCB with Immersion Silver
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-195-V1.17
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 9.99-99.99 PER PIECE
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T
Supply Ability: 50000 pieces per month
Contact Now
Detailed Product Description
Number Of Layers: 2 Glass Epoxy: TC600
Final Foil: 1.0 Final Height Of PCB: 0.6 Mm ±10%
Surface Finish: Immersion Silver Solder Mask Color: No
Colour Of Component Legend: No Test: 100% Electrical Test Prior Shipment

TC600 Microwave PCB with 15mil 20mil 30mil 50mil 60mil Thickness TC600 High Frequency PCB with Immersion Silver

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

Rogers' (Arlon) TC600 is a woven fiberglass reinforced, enhanced thermal conductivity ceramic filled, PTFE-based composite. It is designed to provide enhanced heat-transfer through“Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. The increased thermal conductivity (1.1 W/mk) provides higher power handling, reduces hot-spots and improves device reliability. Lower losses result in higher amplifier and antenna gains/efficiencies. Stable dielectric constant is across a wide temperature range (-75 ppm/oC -40°C to 140°C). It helps power amplifier and antenna designers maximize gain and minimize dead bandwidth lost to dielectric constant drift as operating temperature changes. It has low Z-Direction CTE and mechanical robustness is also greatly improved for the 6.15 dielectric constant market.

 

Features

1. Very Low Loss Tangent (0.002 at 10 GHz) provides Higher Amplifier or Antenna Efficiency

2. Mechanically Robustness improves processing and reliability, replaces brittle laminates that cannot withstand processing, impact or High Gain forces

3. Low coefficient of thermal expansion on X,Y and Z axis (9, 9 and 35 ppm/°C) matches active components for low stress solder joints

4. High Peel Strength for Reliable narrow lines

 

Benefits

1. Reduced Heat Generated through Transmission Line Loss

2. Heat Dissipation and Management

3. Replace Ceramic in Some Applications

4. Large Panel Sizes for Multiple Circuit Layout for lowered Processing Costs

 

TC600 Microwave PCB with 15mil 20mil 30mil 50mil 60mil Thickness TC600 High Frequency PCB with Immersion Silver 0

 

Our PCB Capability (TC600)

PCB Material: Ceramic Filled PTFE/Woven Fiberglass
Designation: TC600
Dielectric constant: 6.15 (10 GHz)
Dissipation Factor 0.002 (10 GHz)
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 500mil (12.7mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

 

Typical Applications:

1. Digital Audio Broadcasting (DAB) Antennas (Satellite Radio)

2. GPS & Hand-held RFID Reader Antennas

3. Microwave Combiner and Power Divider Boards in Avionics Applications

4. Power Amplifiers, Filters and Couplers

5. Small Footprint Antennas

 

Appendix: Typical Properties TC600

Property Unit Value Test Method
1. Electrical Properties
Dielectric Constant (may vary by thickness)      
@1.8 MHz - 6.15 Resonant Cavity
@10 GHz - 6.15 IPC TM-650 2.5.5.5
Dissipation Factor      
@1.8 GHz - 0.0017 Resonant Cavity
@10 GHz - 0.002 IPC TM-650 2.5.5.5
Temperature Coefficient of Dielectric -    
TCεr @ 10 GHz (-40-150°C) ppm/ºC -75 IPC TM-650 2.5.5.5
Volume Resistivity      
C96/35/90 MΩ-cm 1.6x109 IPC TM-650 2.5.17.1
E24/125 MΩ-cm 2.4x108 IPC TM-650 2.5.17.1
Surface Resistivity      
C96/35/90 3.1x109 IPC TM-650 2.5.17.1
E24/125 9.0x108 IPC TM-650 2.5.17.1
Electrical Strength Volts/mil (kV/mm) 850 (34) IPC TM-650 2.5.6.2
Dielectric Breakdown kV 62 IPC TM-650 2.5.6
Arc Resistance sec >240 IPC TM-650 2.5.1
 
2. Thermal Properties
Decomposition Temperature (Td)      
Initial °C 512 IPC TM-650 2.4.24.6
5% °C 572 IPC TM-650 2.4.24.6
T260 min >60 IPC TM-650 2.4.24.1
T288 min >60 IPC TM-650 2.4.24.1
T300 min >60 IPC TM-650 2.4.24.1
Thermal Expansion, CTE (x,y) 50-150ºC ppm/ºC 9, 9 IPC TM-650 2.4.41
Thermal Expansion, CTE (z) 50-150ºC ppm/ºC 35 IPC TM-650 2.4.24
% z-axis Expansion (50-260ºC) % 1.5 IPC TM-650 2.4.24
 
3. Mechanical Properties
Peel Strength to Copper (1 oz/35 micron)      
After Thermal Stress lb/in (N/mm) 10 (1.8) IPC TM-650 2.4.8
At Elevated Temperatures (150ºC) lb/in (N/mm) 10 (1.8) IPC TM-650 2.4.8.2
After Process Solutions lb/in (N/mm) 9 (1.6) IPC TM-650 2.4.8
Young’s Modulus kpsi (MPa) 280 (1930) IPC TM-650 2.4.18.3
Flexural Strength (Machine/Cross) kpsi (MPa) 9.60/9.30 (66/64) IPC TM-650 2.4.4
Tensile Strength (Machine/Cross) kpsi (MPa) 5.0/4.30 (34/30) IPC TM-650 2.4.18.3
Compressive Modulus kpsi (MPa)   ASTM D-3410
Poisson’s Ratio -   ASTM D-3039
 
4. Physical Properties
Water Absorption % 0.02 IPC TM-650 2.6.2.1
Density, ambient 23ºC g/cm3 2.9 ASTM D792 Method A
Thermal Conductivity (z-axis) W/mK 1.1 ASTM E1461
Thermal Conductivity (x, y) W/mK 1.4 ASTM E1461
Specific Heat J/gK 0.94 ASTM E1461
Flammability class V0 UL-94
NASA Outgassing, 125ºC, ≤10-6 torr      
Total Mass Loss % 0.02 NASA SP-R-0022A
Collected Volatiles % 0 NASA SP-R-0022A
Water Vapor Recovered % 0 NASA SP-R-0022A

 

TC600 Microwave PCB with 15mil 20mil 30mil 50mil 60mil Thickness TC600 High Frequency PCB with Immersion Silver 1

 

TC600 Microwave PCB with 15mil 20mil 30mil 50mil 60mil Thickness TC600 High Frequency PCB with Immersion Silver 2

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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