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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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Arlon Microwave PCB Built on AD450 70mil 1.778mm DK4.5 With Immersion Gold for Circuit Board Miniaturization

Arlon Microwave PCB Built on AD450 70mil 1.778mm DK4.5 With Immersion Gold for Circuit Board Miniaturization

  • Arlon Microwave PCB Built on AD450 70mil 1.778mm DK4.5 With Immersion Gold for Circuit Board Miniaturization
  • Arlon Microwave PCB Built on AD450 70mil 1.778mm DK4.5 With Immersion Gold for Circuit Board Miniaturization
  • Arlon Microwave PCB Built on AD450 70mil 1.778mm DK4.5 With Immersion Gold for Circuit Board Miniaturization
Arlon Microwave PCB Built on AD450 70mil 1.778mm DK4.5 With Immersion Gold for Circuit Board Miniaturization
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-160-V5.8
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD2.99-6.99 Per Piece
Packaging Details: Vacuum
Delivery Time: 5-6 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
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Detailed Product Description
Glass Epoxy: AD450 Final Height Of PCB: 1.8 Mm ±0.1mm
Final Foil External: 1.0 Oz Surface Finish: Immersion Gold
Solder Mask Color: N/A Colour Of Component Legend: N/A
TEST: 100% Electrical Test Prior Shipment

Arlon Microwave PCB Built on AD450 70mil 1.778mm DK4.5 With Immersion Gold for Circuit Board Miniaturization

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers' (Arlon) AD450 is a woven fiberglass reinforced, ceramic filled, PTFE based composite material for use as a printed circuit board substrate. The woven fiberglass provides better dielectric constant and thickness uniformity, better dimensional stability as well as reduced manufacturing costs.

 

The electrical properties of AD450 suggest it can readily replace FR-4 in applications where higher frequencies and expectations for increased fidelity with broadband signal are beyond the performance offered by FR-4.

 

 

 

With a dielectric constant of 4.5, most FR-4 designs can be readily transferred. Its higher thermal conductivity and lower CTE also promote its use in higher power designs, where temperature extremes and heat rejection are primary considerations.

 

AD450 is compatible with processing used for standard PTFE based printed circuit board substrates. In addition, its low Z-axis thermal expansion will improve plated through hole reliability, compared to typical PTFE based laminates.

 

Typical Applications:

1. Circuit Board Miniaturization

2. Multimedia Transmission Systems

3. Wide Band Antenna Applications

4. Replacement of FR-4 in Higher Frequency Applications

 

 

Arlon Microwave PCB Built on AD450 70mil 1.778mm DK4.5 With Immersion Gold for Circuit Board Miniaturization 0

Figure 1 demonstrates the stability of dielectric constant across frequency.

 

 

Arlon Microwave PCB Built on AD450 70mil 1.778mm DK4.5 With Immersion Gold for Circuit Board Miniaturization 1

Figure 2 demonstrates the stability of dissipation factor across frequency.

 

 

Our PCB Capability(AD450)

PCB Material: Woven Fiberglass Re inforced, Ceramic filled, PTFE based Composite
Designation: AD450
Dielectric constant: 4.5
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil (0.508mm), 30mil(0.762mm), 40mil(1.016mm), 50mil (1.27mm), 60mil (1.524mm), 70mil(1.778mm), 90mil (2.286mm), 180mil (4.572mm), 200mil (5.08mm), 230mil (5.842mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

 

Data Sheet of AD450

Property Test Method Condition Result
Dielectric Constant @ 200 MHz IPC TM-650 2.5.5.6 C23/50 4.5
Loss Tangent @ 10 GHz IPC TM-650 2.5.5.6 C23/50 0.0035
Thermal Coefficient of Er IPC TM-650 2.5.5.6 - 10℃ TO +140℃ -233.5
Copper Peel Strength (lb/in) IPC TM-650 2.4.8 A, TS >12
Volume Resistivity (MΩ-cm) IPC TM-650 2.5.17.1 C96/35/90 1.2 X 109
Surface Resistivity (MΩ) IPC TM-650 2.5.17.1 C96/35/90 4.5 X 107
Arc Resistance (seconds) ASTM D-495 D48/50 >180
Tensile Modulus (kpsi) ASTM D-638 A, 23℃ >700
Tensile Strength (kpsi) ASTM D-882 A, 23℃ >20
Compressive Modulus (kpsi) ASTM D-685 A, 23℃ >350
Flexural Modulus (kpsi) ASTM D-790 A, 23℃ >540
Dielectric Breakdown (kV) ASTM D-149 D48/50 >45
Density (g/cm3) ASTM D-792 Method A A, 23℃ 2.45
Water Absorption (%) IPC TM-650 2.6.2.2 E1/105 + D24/23 0.07
Coefficient of Thermal Expansion (ppm/℃) X Axis Y Axis Z Axis IPC TM-650 2.4.24 TMA 0℃ to 100 ℃ 8 11 42
Thermal Conductivity (W /mK) ASTM E-1225 100℃ 0.38
Outgassing Total Mass Loss (%) Collected Volatile Condensable Material (%) Water Vapor Recovered NASA SP-R-0022A Maximum 1.00% Maximum 0.10% 125℃, ≦10-6 torr 0.01 0.01 0.00
Flammability UL 94 Vertical Burn C48/23/50, E24/125 UL94-V0

 

Arlon Microwave PCB Built on AD450 70mil 1.778mm DK4.5 With Immersion Gold for Circuit Board Miniaturization 2
 

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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