PRODUCTS DETAILS

Home > Products >

Arlon Microwave PCB Built on AD450 70mil 1.778mm DK4.5 With Immersion Gold for Circuit Board Miniaturization

Products

Arlon Microwave PCB Built on AD450 70mil 1.778mm DK4.5 With Immersion Gold for Circuit Board Miniaturization

Name: Arlon Microwave PCB Built on AD450 70mil 1.778mm DK4.5 With Immersion Gold for Circuit Board Miniaturization
Brand: Bicheng Technologies Limited
SKU: BIC-160-V5.8
Price: 2.99 USD
Availability: InStock
Rating: 4.6 (158 reviews)

MOQ:	1
Price:	USD2.99-6.99 Per Piece
Standard Packaging:	Vacuum
Delivery Period:	5-6 working days
Payment Method:	T/T, Paypal
Supply Capacity:	45000 pieces per month

Detail Information

Product Description

Detail Information

Place of Origin

China

Brand Name

Bicheng Technologies Limited

Certification

Model Number

BIC-160-V5.8

Glass Epoxy:

AD450

Final Height Of PCB:

1.8 Mm ±0.1mm

Final Foil External:

1.0 Oz

Surface Finish:

Immersion Gold

Solder Mask Color:

N/A

Colour Of Component Legend:

N/A

TEST:

100% Electrical Test Prior Shipment

Minimum Order Quantity:

Price:

USD2.99-6.99 Per Piece

Packaging Details:

Vacuum

Delivery Time:

5-6 working days

Payment Terms:

T/T, Paypal

Supply Ability:

45000 pieces per month

Product Description

Arlon Microwave PCB Built on AD450 70mil 1.778mm DK4.5 With Immersion Gold for Circuit Board Miniaturization

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers' (Arlon) AD450 is a woven fiberglass reinforced, ceramic filled, PTFE based composite material for use as a printed circuit board substrate. The woven fiberglass provides better dielectric constant and thickness uniformity, better dimensional stability as well as reduced manufacturing costs.

The electrical properties of AD450 suggest it can readily replace FR-4 in applications where higher frequencies and expectations for increased fidelity with broadband signal are beyond the performance offered by FR-4.

With a dielectric constant of 4.5, most FR-4 designs can be readily transferred. Its higher thermal conductivity and lower CTE also promote its use in higher power designs, where temperature extremes and heat rejection are primary considerations.

AD450 is compatible with processing used for standard PTFE based printed circuit board substrates. In addition, its low Z-axis thermal expansion will improve plated through hole reliability, compared to typical PTFE based laminates.

Typical Applications:

1. Circuit Board Miniaturization

2. Multimedia Transmission Systems

3. Wide Band Antenna Applications

4. Replacement of FR-4 in Higher Frequency Applications

Arlon Microwave PCB Built on AD450 70mil 1.778mm DK4.5 With Immersion Gold for Circuit Board Miniaturization 0

Figure 1 demonstrates the stability of dielectric constant across frequency.

Arlon Microwave PCB Built on AD450 70mil 1.778mm DK4.5 With Immersion Gold for Circuit Board Miniaturization 1

Figure 2 demonstrates the stability of dissipation factor across frequency.

Our PCB Capability(AD450)

PCB Material:	Woven Fiberglass Re inforced, Ceramic filled, PTFE based Composite
Designation:	AD450
Dielectric constant:	4.5
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	10mil (0.254mm), 20mil (0.508mm), 30mil(0.762mm), 40mil(1.016mm), 50mil (1.27mm), 60mil (1.524mm), 70mil(1.778mm), 90mil (2.286mm), 180mil (4.572mm), 200mil (5.08mm), 230mil (5.842mm)
PCB thickness:
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP etc..

Data Sheet of AD450

Property	Test Method	Condition	Result
Dielectric Constant @ 200 MHz	IPC TM-650 2.5.5.6	C23/50	4.5
Loss Tangent @ 10 GHz	IPC TM-650 2.5.5.6	C23/50	0.0035
Thermal Coefficient of Er	IPC TM-650 2.5.5.6	- 10℃ TO +140℃	-233.5
Copper Peel Strength (lb/in)	IPC TM-650 2.4.8	A, TS	>12
Volume Resistivity (MΩ-cm)	IPC TM-650 2.5.17.1	C96/35/90	1.2 X 109
Surface Resistivity (MΩ)	IPC TM-650 2.5.17.1	C96/35/90	4.5 X 107
Arc Resistance (seconds)	ASTM D-495	D48/50	>180
Tensile Modulus (kpsi)	ASTM D-638	A, 23℃	>700
Tensile Strength (kpsi)	ASTM D-882	A, 23℃	>20
Compressive Modulus (kpsi)	ASTM D-685	A, 23℃	>350
Flexural Modulus (kpsi)	ASTM D-790	A, 23℃	>540
Dielectric Breakdown (kV)	ASTM D-149	D48/50	>45
Density (g/cm3)	ASTM D-792 Method A	A, 23℃	2.45
Water Absorption (%)	IPC TM-650 2.6.2.2	E1/105 + D24/23	0.07
Coefficient of Thermal Expansion (ppm/℃) X Axis Y Axis Z Axis	IPC TM-650 2.4.24 TMA	0℃ to 100 ℃	8 11 42
Thermal Conductivity (W /mK)	ASTM E-1225	100℃	0.38
Outgassing Total Mass Loss (%) Collected Volatile Condensable Material (%) Water Vapor Recovered	NASA SP-R-0022A Maximum 1.00% Maximum 0.10%	125℃, ≦10-6 torr	0.01 0.01 0.00
Flammability	UL 94 Vertical Burn	C48/23/50, E24/125	UL94-V0

Tags:

pcb board,

printed circuit board,

pcb manufacturing

Arlon HF PCB Built on AD450 50mil 1.27mm DK4.5 With Immersion Gold for Wide Band Antennas

Contact Now

Arlon High Frequency PCB Built on AD450 60mil 1.524mm DK4.5 With Immersion Gold for Multimedia Transmission Systems

Contact Now