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Rogers RT/Duroid 6010 High Frequency PCB Built on DK 10.2 50mil With Immersion Gold for Satellite Communications Systems

Rogers RT/Duroid 6010 High Frequency PCB Built on DK 10.2 50mil With Immersion Gold for Satellite Communications Systems

MOQ: 1
Price: USD9.99~99.99 per piece
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Paypal
Supply Capacity: 45000 pieces per month
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-0061-V2.0
Number Of Layers:
2
Glass Epoxy:
RT/duroid 6010
Final Height Of PCB:
1.3mm ±0.13
Final Foil External:
1.5 Oz
Surface Finish:
Immersion Gold (81.1%) 2µ" Over 100µ" Nickel
Solder Mask Color:
None
Colour Of Component Legend:
Black
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD9.99~99.99 per piece
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
45000 pieces per month
Product Description

Rogers High Frequency PCB Built on RT/Duroid 6010 DK 10.2 50mil With Immersion Gold for Satellite Communications Systems

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

 

Rogers RT/duroid 6010LM microwave laminates are ceramic-PTFE composites which are designed for electronic and microwave circuit applications requiring a high dielectric constant. It's available with a dielectric constant value of 10.2.

 

PCB Capability (RT/duroid 6010)

PCB Material: Ceramic-PTFE composite
Designator: RT/duroid 6010LM
Dielectric constant: 10.2 ±0.25 (process)
10.7 (design)
Layer count: 1 Layer, 2 Layer
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 25mil (0.635mm)
50mil (1.27mm), 75mil (1.90mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, OSP.


RT/duroid 6010LM microwave laminates feature ease of fabrication and stability in use. This property results in the possibility of mass production and reducing the cost of goods. It has tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability.

 

Features and Benefits
1. High dielectric constant for circuit size reduction
2. Low loss. Ideal for operating at X-bank or below
3. Low moisture absorption reducing effects of moisture on electrical loss
4. Low Z-axis expansion providing reliable PTH in multilayer boards
4. Tight DK and thickness control for repeatable circuit performance

 

The typical applications are aircraft collision avoidance systems, ground radar warning systems, patch antennas, satellite communications systems etc.

 

Rogers RT/Duroid 6010 High Frequency PCB Built on DK 10.2 50mil With Immersion Gold for Satellite Communications Systems 0

 

 

 

Appendix1: Properties of RT/duroid 6010LM laminates.

RT/duroid 6010 Typical Value
Property RT/duroid 6010 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.25 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped stripline
Dielectric Constant,εDesign 10.7 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0023 Z   10 GHz/A IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -425 Z ppm/℃ -50℃-170℃ IPC-TM-650 2.5.5.5
Volume Resistivity 5 x 105   Mohm.cm A IPC 2.5.17.1
Surface Resistivity 5 x 106   Mohm A IPC 2.5.17.1
Tensile Properties ASTM D638 (0.1/min. strain rate)
Young's Modulus 931(135) 559(81) X Y MPa(kpsi) A
Ultimate Stress 17(2.4) 13(1.9) X Y MPa(kpsi) A
Ultimate Strain 9 to 15 7 to 14 X Y % A
Compressive Properties   ASTM D695 (0.05/min. strain rate)
Young's Modulus 2144 (311) Z MPa(kpsi) A
Ultimate Stress 47(6.9) Z MPa(kpsi) A
Ultimate Strain 25 Z %  
Flexural Modulus 4364 (633) 3751 (544) X MPa(kpsi) A ASTM D790
Ultimate Stress 36 (5.2) 32 (4.4) X Y MPa(kpsi) A
Deformation under load 0.26 1.3 Z Z % 24hr/50℃/7MPa 24hr/150℃/7MPa ASTM D261
Moisture Absorption 0.01   % D48/50℃ 0.050"(1.27mm) thick IPC-TM-650 2.6.2.1
Thermal Conductivity 0.86   W/m/k 80℃ ASTM C518
Coefficient of Thermal Expansion 24
24
47
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.41
Td 500   ℃ TGA   ASTM D3850
Density 3.1   g/cm3   ASTM D792
Specific Heat 1.00(0.239)   j/g/k
(BTU/ib/OF)
  Calculated
Copper Peel 12.3 (2.1)   pli (N/mm) after solder float IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

 

Appendix2: Automatic silkscreen machine 

Rogers RT/Duroid 6010 High Frequency PCB Built on DK 10.2 50mil With Immersion Gold for Satellite Communications Systems 1

products
PRODUCTS DETAILS
Rogers RT/Duroid 6010 High Frequency PCB Built on DK 10.2 50mil With Immersion Gold for Satellite Communications Systems
MOQ: 1
Price: USD9.99~99.99 per piece
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Paypal
Supply Capacity: 45000 pieces per month
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-0061-V2.0
Number Of Layers:
2
Glass Epoxy:
RT/duroid 6010
Final Height Of PCB:
1.3mm ±0.13
Final Foil External:
1.5 Oz
Surface Finish:
Immersion Gold (81.1%) 2µ" Over 100µ" Nickel
Solder Mask Color:
None
Colour Of Component Legend:
Black
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD9.99~99.99 per piece
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
45000 pieces per month
Product Description

Rogers High Frequency PCB Built on RT/Duroid 6010 DK 10.2 50mil With Immersion Gold for Satellite Communications Systems

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

 

Rogers RT/duroid 6010LM microwave laminates are ceramic-PTFE composites which are designed for electronic and microwave circuit applications requiring a high dielectric constant. It's available with a dielectric constant value of 10.2.

 

PCB Capability (RT/duroid 6010)

PCB Material: Ceramic-PTFE composite
Designator: RT/duroid 6010LM
Dielectric constant: 10.2 ±0.25 (process)
10.7 (design)
Layer count: 1 Layer, 2 Layer
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 25mil (0.635mm)
50mil (1.27mm), 75mil (1.90mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, OSP.


RT/duroid 6010LM microwave laminates feature ease of fabrication and stability in use. This property results in the possibility of mass production and reducing the cost of goods. It has tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability.

 

Features and Benefits
1. High dielectric constant for circuit size reduction
2. Low loss. Ideal for operating at X-bank or below
3. Low moisture absorption reducing effects of moisture on electrical loss
4. Low Z-axis expansion providing reliable PTH in multilayer boards
4. Tight DK and thickness control for repeatable circuit performance

 

The typical applications are aircraft collision avoidance systems, ground radar warning systems, patch antennas, satellite communications systems etc.

 

Rogers RT/Duroid 6010 High Frequency PCB Built on DK 10.2 50mil With Immersion Gold for Satellite Communications Systems 0

 

 

 

Appendix1: Properties of RT/duroid 6010LM laminates.

RT/duroid 6010 Typical Value
Property RT/duroid 6010 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.25 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped stripline
Dielectric Constant,εDesign 10.7 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0023 Z   10 GHz/A IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -425 Z ppm/℃ -50℃-170℃ IPC-TM-650 2.5.5.5
Volume Resistivity 5 x 105   Mohm.cm A IPC 2.5.17.1
Surface Resistivity 5 x 106   Mohm A IPC 2.5.17.1
Tensile Properties ASTM D638 (0.1/min. strain rate)
Young's Modulus 931(135) 559(81) X Y MPa(kpsi) A
Ultimate Stress 17(2.4) 13(1.9) X Y MPa(kpsi) A
Ultimate Strain 9 to 15 7 to 14 X Y % A
Compressive Properties   ASTM D695 (0.05/min. strain rate)
Young's Modulus 2144 (311) Z MPa(kpsi) A
Ultimate Stress 47(6.9) Z MPa(kpsi) A
Ultimate Strain 25 Z %  
Flexural Modulus 4364 (633) 3751 (544) X MPa(kpsi) A ASTM D790
Ultimate Stress 36 (5.2) 32 (4.4) X Y MPa(kpsi) A
Deformation under load 0.26 1.3 Z Z % 24hr/50℃/7MPa 24hr/150℃/7MPa ASTM D261
Moisture Absorption 0.01   % D48/50℃ 0.050"(1.27mm) thick IPC-TM-650 2.6.2.1
Thermal Conductivity 0.86   W/m/k 80℃ ASTM C518
Coefficient of Thermal Expansion 24
24
47
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.41
Td 500   ℃ TGA   ASTM D3850
Density 3.1   g/cm3   ASTM D792
Specific Heat 1.00(0.239)   j/g/k
(BTU/ib/OF)
  Calculated
Copper Peel 12.3 (2.1)   pli (N/mm) after solder float IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

 

Appendix2: Automatic silkscreen machine 

Rogers RT/Duroid 6010 High Frequency PCB Built on DK 10.2 50mil With Immersion Gold for Satellite Communications Systems 1

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