Rogers TMM4 Thermoset RF/ Microwave double clad Laminate and fabricate 2 layer 75mil ssubstrate PCB with ENIG Solutions

Product Description

Rogers TMM4 is a ceramic, hydrocarbon, thermoset polymer composite designed for high-reliability stripline and microstrip applications. It combines many of the benefits of ceramic substrates and traditional PTFE microwave laminates—without requiring the specialized production techniques commonly associated with those materials. TMM4 laminates are based on thermoset resins, so they do not soften when heated. This allows reliable wire bonding of component leads to circuit traces without concern for pad lifting or substrate deformation. TMM4 also does not require sodium naphthanate treatment prior to electroless plating, simplifying PCB fabrication.

The material offers an exceptionally low thermal coefficient of dielectric constant, isotropic coefficients of thermal expansion closely matched to copper, and thermal conductivity approximately twice that of traditional PTFE/ceramic laminates. These characteristics support high plated-through-hole reliability, low etch shrinkage, and effective heat removal.

Note: TMM4 is available with ½ oz/ft² to 2 oz/ft² electrodeposited copper foil, or bonded directly to brass or aluminum plates. Substrate thicknesses from 0.015" to 0.500" are available.

Applications

RF and Microwave Circuitry 

Power Amplifiers and Combiners 

Filters and Couplers 

Satellite Communication Systems 

GPS Antennas and Patch Antennas 

Dielectric Polarizers and Lenses 

Chip Testers 

Custom PCB Manufacturing on TMM4

As a specialized manufacturer of high-frequency printed circuit boards, we offer fabrication services using Rogers TMM4 and other advanced laminate materials. The following specification details a representative 2-layer rigid PCB implementation:

PCB Construction Details:

Ceramic-like Electrical Performance with Soft-Substrate Processing:
TMM4 combines a controlled dielectric constant with low dissipation factor, delivering stable RF performance while remaining compatible with standard PWB processes. It resists etchants and solvents used in printed circuit production, reducing damage during fabrication and assembly.

Thermoset Resin for Reliable Assembly:
Because TMM4 is based on a thermoset resin, it does not soften when heated. This enables reliable wire bonding without pad lifting or substrate deformation. It also supports lead-free process compatibility.

CTE Matched to Copper:
The isotropic CTE values of 16 ppm/°K in X and Y and 21 ppm/°K in Z are closely matched to copper, supporting high-reliability plated through holes and low etch shrinkage.

Excellent Thermal Performance:
With thermal conductivity of 0.70 W/m·K and a decomposition temperature of 425°C, TMM4 helps remove heat from power amplifiers and other high-power circuits while withstanding demanding assembly conditions.

Low Thermal Coefficient of Dk:
The thermal coefficient of dielectric constant is typically +15 ppm/°K over -55°C to +125°C, helping maintain consistent impedance and circuit performance across operating temperatures.

Mechanical Robustness:
TMM4 resists creep and cold flow, and its mechanical properties support stable performance over the life of the end product. It is available in a wide range of thicknesses and claddings, including heavy metal and unclad options.

Processing and Design Considerations

1. Plating: TMM4 does not require sodium naphthanate treatment prior to electroless plating.
2. Fabrication: All common PWB processes can be used with TMM4 materials.
3. Wire Bonding: Thermoset resin construction supports reliable wire bonding.
4. Thickness Options: Standard thicknesses include 0.015", 0.025", 0.030", 0.050", 0.060", 0.075", 0.100", 0.125", 0.150", 0.200", 0.250", and 0.300", with additional configurations available on request.
5. Claddings: Electrodeposited copper foil in ½ oz and 1 oz, plus additional claddings such as heavy metal and unclad.

Quality and Availability

All boards are manufactured in compliance with IPC-Class-2 quality standards. 100% electrical testing is performed prior to shipment to ensure functional integrity.

Our production capability extends to worldwide availability, with flexible logistics support for both prototype and volume requirements. We offer rapid turnaround and competitive pricing while maintaining strict process control.

For inquiries about custom stack-ups, panel sizes, copper foil options, heavy metal cladding, or other configurations, please contact our sales engineering team—we are ready to support your high-frequency circuit board requirements.