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TLY-5Z High-Frequency Laminate 0.762 mm (30mil) substrate and Custom RF double side PCB for Low Weight Antennas for Aircraft

Brand Name: Taconic Model Number: TLY-5Z

Product Description

 

For aerospace and lightweight RF applications where every gram matters, TLY-5Z laminates offer an exceptional balance of low density, dimensional stability, and reliable electrical performance. TLY-5Z is an advanced composite material blending glass-filled PTFE with woven fiberglass reinforcement. This glass-filled structure is specifically designed for low-density applications, such as aerospace, where minimizing weight is crucial.

 

TLY-5Z High-Frequency Laminate 0.762 mm (30mil) substrate and Custom RF double side PCB for Low Weight Antennas for Aircraft

 

The woven matrix in TLY-5Z yields a mechanically stable laminate suitable for high-volume manufacturing—far more dimensionally stable than chopped fiber reinforced PTFE composites. The low dissipation factor enables successful deployment in millimeter-wave applications, including automotive radar at 77 GHz and other antennas operating at Ka, E, and W bands. Comparative OEM testing at 77 GHz has shown that lightly reinforced TLY-5Z delivers equivalent insertion loss and dielectric properties to its closest chopped-fiber-reinforced competitor—with the primary benefit being much higher manufacturing yields.

TLY-5Z offers a dielectric constant range of 2.17 to 2.40. For most thicknesses, the dielectric constant can be specified anywhere within this range with a tolerance of ±0.02. In the low dielectric constant range, the dissipation factor is approximately 0.0009 at 10 GHz, making TLY-5Z one of the lowest-loss materials available for its class.

 

TLY-5Z Typical Values
Property Test Method Unit Value Unit Value
Dk @ 1.9 GHz IPC-650 2.5.5.5.1 Mod.   2.20+/- 0.04   2.20+/- 0.04
Df @ 1.9 GHz IPC-650 2.5.5.5.1 Mod.   0.001   0.001
Df @ 10 GHz IPC-650 2.5.5.5.1 Mod.   0.0015   0.0015
Tc(D)K (-55 ~150°C) IPC-650 2.5.5.6 Mod. ppm/°C -72 ppm/°C -72
Dielectric Breakdown Voltage IPC-650 2.5.6 kV 45 kV 45
Dielectric Strength IPC-650 2.5.6.2 V/mil 770 V/mm 30,315
Moisture Absorption IPC-650 2.6.2.1 % 0.03 % 0.03
Peel Strength (1 oz. copper) IPC-650 2.4.8 lbs./inch 7 N/mm 1.3
Volume Resistivity IPC-650 2.5.17.1 Mohms/cm 10^9 Mohms/cm 10^9
Surface Resistivity IPC-650 2.5.17.1 Mohms 10^8 Mohms 10^8
Tensile Strength (MD) IPC-650 2.4.18.3 psi 9137 N/mm2 63
Tensile Strength (CD) IPC-650 2.4.18.3 psi 9572 N/mm2 66
Tensile Modulus (MD) IPC-650 2.4.18.3 psi 182,748 N/mm2 1260
Tensile Modulus (CD) IPC-650 2.4.18.3 psi 165,344 N/mm2 1140
Elongation (MD) IPC-650 2.4.18.3 % 6 % 6
Elongation (CD) IPC-650 2.4.18.3 % 6.9 % 6.9
Flex Strength (MD) ASTM D790 psi 10,300 N/mm2 71
Flex Strength (CD) ASTM D790 psi 11,600 N/mm2 80
Flex Modulus (MD) ASTM D790 psi 377,100 N/mm2 2600
Flex Modulus (CD) ASTM D790 psi 432,213 N/mm2 2980
Dimensional Stability (MD) IPC-650 2.4.39 (Bake) % (10 mil) -0.05 % (30 mil) -0.05
Dimensional Stability (CD) IPC-650 2.4.39 (Bake) % (10 mil) -0.17 % (30 mil) -0.11
Dimensional Stability (MD) IPC-650 2.4.39 (Stress) % (10 mil) -0.07 % (30 mil) -0.07
Dimensional Stability (CD) IPC-650 2.4.39 (Stress) % (10 mil) -0.22 % (30 mil) -0.14
Density (Specific Gravity) IPC-650 2.3.5 g/cm3 1.92 g/cm3 1.92
Specific Heat IPC-650 2.4.50 J/g°C 0.95 J/g°C 0.95
Thermal Conductivity IPC-650 2.4.50 W/M*K 0.2 W/M*K 0.2
CTE (x-y) (50 - 150°C) IPC-650 2.4.41 ppm/ºC 30-40 ppm/ºC 30-40
CTE (z) (50 - 150°C) IPC-650 2.4.41 ppm/ºC 130 ppm/ºC 130
Hardness ASTM D2240 (Durometer) - 68 - 68
UL-94 Flammability Rating UL-94   V-0   V-0

 

Applications

  1. Aerospace Components – Low-density construction for weight-sensitive systems
  2. Low-Weight Antennas for Aircraft – Conformal and embedded antenna structures
  3. RF Passive Components – Filters, couplers, and power dividers
  4. Automotive Radar – 77 GHz radar modules and antennas
  5. Satellite and Cellular Communications – LNB, LNA, and LNC assemblies
  6. Millimeter-Wave Systems – Ka, E, and W band applications
  7. Phased Array Antennas – Dimensional stability for consistent element spacing

 

 

Custom PCB Manufacturing on TLY-5Z

As a specialized manufacturer of high-frequency printed circuit boards, we offer comprehensive fabrication services using TLY-5Z and other advanced laminates. The following specification details a representative 2-layer rigid PCB implementation:

 

TLY-5Z High-Frequency Laminate 0.762 mm (30mil) substrate and Custom RF double side PCB for Low Weight Antennas for Aircraft

 

PCB Construction Details:

Parameter Specification
Base Material TLY-5Z
Layer Count 2-layer rigid
Board Dimensions 70 mm × 120 mm per panel, ±0.15 mm
Finished Board Thickness 0.8 mm
Finished Copper Weight 1 oz (1.4 mils) outer layers
Minimum Trace/Space 6 / 9 mils
Minimum Hole Size 0.35 mm
Via Structure No blind or buried vias
Via Plating Thickness 20 μm
Surface Finish ENIG (Electroless Nickel Immersion Gold)
Top Solder Mask Green
Bottom Solder Mask Green
Top Silkscreen White
Bottom Silkscreen None
Electrical Test 100% prior to shipment
Artwork Format Gerber RS-274-X
Quality Standard IPC-Class-2

 

Lowest Dissipation Factor in Its Class:
TLY-5Z offers a dissipation factor of approximately 0.0009 at 10 GHz in the low dielectric constant range, with a typical value of 0.0015 at 10 GHz. This ultra-low loss supports millimeter-wave designs at 77 GHz and beyond, enabling low insertion loss in transmission lines and feed networks.

 

Exceptional Dimensional Stability:
The woven fiberglass reinforcement provides far greater dimensional stability than chopped fiber reinforced PTFE composites, enabling high-volume manufacturing with tight positional tolerances and eliminating the need for double etching.

 

Low Density for Weight-Sensitive Applications:
With a density of just 1.92 g/cm³, TLY-5Z is significantly lighter than conventional PTFE-based laminates. This is particularly valuable for aerospace and airborne antenna applications where every gram of weight reduction matters.

 

Low Z-Axis CTE:
The low-density composition results in minimal Z-axis expansion (CTE of 130 ppm/°C), a characteristic not typically found in PTFE-rich composites. Compared to traditional low dielectric constant PTFE composites, TLY-5Z demonstrates superior thermal stability against z-axis expansion-induced stress on plated through-holes.

 

Plated Through-Hole Stability:
The combination of low Z-axis CTE and matched X/Y CTE (30/40 ppm/°C) contributes to reliable plated through-hole performance, even under thermal cycling—a critical requirement for high-reliability aerospace and defense applications.

 

Excellent Peel Strength and Flat Copper Compatibility:
TLY-5Z exhibits excellent peel strength and is compatible with flat copper, ensuring robust adhesion and reliable circuit performance through fabrication and assembly.

 

Attractive Price/Performance Ratio:
TLY-5Z offers a compelling cost-to-performance ratio, making it accessible for commercial high-volume production while maintaining the electrical and mechanical characteristics required for demanding RF applications.

 

 

Quality and Availability

All boards are manufactured in compliance with IPC-Class-2 quality standards, ensuring robust reliability for commercial, industrial, and aerospace-related applications. 100% electrical testing is performed prior to shipment to guarantee functional integrity.

 

Our production capability extends to worldwide availability, with flexible shipping and logistics support for both prototype and volume requirements. We offer rapid turnaround and competitive pricing while maintaining strict process control.

 

For inquiries about custom stack-ups, panel sizes, alternative copper foils, or other configurations, please contact our sales engineering team—we are ready to support your high-frequency circuit board requirements.

 

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