2-layer rigid PCB built on Wangling's WL-CT440 high-performance thermosetting resin-based high-frequency laminateil
Contact Person : Sally Mao
Phone Number : 86-755-27374847
WhatsApp : +8618277967574
Product Description
For aerospace and lightweight RF applications where every gram matters, TLY-5Z laminates offer an exceptional balance of low density, dimensional stability, and reliable electrical performance. TLY-5Z is an advanced composite material blending glass-filled PTFE with woven fiberglass reinforcement. This glass-filled structure is specifically designed for low-density applications, such as aerospace, where minimizing weight is crucial.
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The woven matrix in TLY-5Z yields a mechanically stable laminate suitable for high-volume manufacturing—far more dimensionally stable than chopped fiber reinforced PTFE composites. The low dissipation factor enables successful deployment in millimeter-wave applications, including automotive radar at 77 GHz and other antennas operating at Ka, E, and W bands. Comparative OEM testing at 77 GHz has shown that lightly reinforced TLY-5Z delivers equivalent insertion loss and dielectric properties to its closest chopped-fiber-reinforced competitor—with the primary benefit being much higher manufacturing yields.
TLY-5Z offers a dielectric constant range of 2.17 to 2.40. For most thicknesses, the dielectric constant can be specified anywhere within this range with a tolerance of ±0.02. In the low dielectric constant range, the dissipation factor is approximately 0.0009 at 10 GHz, making TLY-5Z one of the lowest-loss materials available for its class.
| TLY-5Z Typical Values | |||||
| Property | Test Method | Unit | Value | Unit | Value |
| Dk @ 1.9 GHz | IPC-650 2.5.5.5.1 Mod. | 2.20+/- 0.04 | 2.20+/- 0.04 | ||
| Df @ 1.9 GHz | IPC-650 2.5.5.5.1 Mod. | 0.001 | 0.001 | ||
| Df @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | 0.0015 | 0.0015 | ||
| Tc(D)K (-55 ~150°C) | IPC-650 2.5.5.6 Mod. | ppm/°C | -72 | ppm/°C | -72 |
| Dielectric Breakdown Voltage | IPC-650 2.5.6 | kV | 45 | kV | 45 |
| Dielectric Strength | IPC-650 2.5.6.2 | V/mil | 770 | V/mm | 30,315 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.03 | % | 0.03 |
| Peel Strength (1 oz. copper) | IPC-650 2.4.8 | lbs./inch | 7 | N/mm | 1.3 |
| Volume Resistivity | IPC-650 2.5.17.1 | Mohms/cm | 10^9 | Mohms/cm | 10^9 |
| Surface Resistivity | IPC-650 2.5.17.1 | Mohms | 10^8 | Mohms | 10^8 |
| Tensile Strength (MD) | IPC-650 2.4.18.3 | psi | 9137 | N/mm2 | 63 |
| Tensile Strength (CD) | IPC-650 2.4.18.3 | psi | 9572 | N/mm2 | 66 |
| Tensile Modulus (MD) | IPC-650 2.4.18.3 | psi | 182,748 | N/mm2 | 1260 |
| Tensile Modulus (CD) | IPC-650 2.4.18.3 | psi | 165,344 | N/mm2 | 1140 |
| Elongation (MD) | IPC-650 2.4.18.3 | % | 6 | % | 6 |
| Elongation (CD) | IPC-650 2.4.18.3 | % | 6.9 | % | 6.9 |
| Flex Strength (MD) | ASTM D790 | psi | 10,300 | N/mm2 | 71 |
| Flex Strength (CD) | ASTM D790 | psi | 11,600 | N/mm2 | 80 |
| Flex Modulus (MD) | ASTM D790 | psi | 377,100 | N/mm2 | 2600 |
| Flex Modulus (CD) | ASTM D790 | psi | 432,213 | N/mm2 | 2980 |
| Dimensional Stability (MD) | IPC-650 2.4.39 (Bake) | % (10 mil) | -0.05 | % (30 mil) | -0.05 |
| Dimensional Stability (CD) | IPC-650 2.4.39 (Bake) | % (10 mil) | -0.17 | % (30 mil) | -0.11 |
| Dimensional Stability (MD) | IPC-650 2.4.39 (Stress) | % (10 mil) | -0.07 | % (30 mil) | -0.07 |
| Dimensional Stability (CD) | IPC-650 2.4.39 (Stress) | % (10 mil) | -0.22 | % (30 mil) | -0.14 |
| Density (Specific Gravity) | IPC-650 2.3.5 | g/cm3 | 1.92 | g/cm3 | 1.92 |
| Specific Heat | IPC-650 2.4.50 | J/g°C | 0.95 | J/g°C | 0.95 |
| Thermal Conductivity | IPC-650 2.4.50 | W/M*K | 0.2 | W/M*K | 0.2 |
| CTE (x-y) (50 - 150°C) | IPC-650 2.4.41 | ppm/ºC | 30-40 | ppm/ºC | 30-40 |
| CTE (z) (50 - 150°C) | IPC-650 2.4.41 | ppm/ºC | 130 | ppm/ºC | 130 |
| Hardness | ASTM D2240 (Durometer) | - | 68 | - | 68 |
| UL-94 Flammability Rating | UL-94 | V-0 | V-0 | ||
Applications
Custom PCB Manufacturing on TLY-5Z
As a specialized manufacturer of high-frequency printed circuit boards, we offer comprehensive fabrication services using TLY-5Z and other advanced laminates. The following specification details a representative 2-layer rigid PCB implementation:
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PCB Construction Details:
| Parameter | Specification |
| Base Material | TLY-5Z |
| Layer Count | 2-layer rigid |
| Board Dimensions | 70 mm × 120 mm per panel, ±0.15 mm |
| Finished Board Thickness | 0.8 mm |
| Finished Copper Weight | 1 oz (1.4 mils) outer layers |
| Minimum Trace/Space | 6 / 9 mils |
| Minimum Hole Size | 0.35 mm |
| Via Structure | No blind or buried vias |
| Via Plating Thickness | 20 μm |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Top Solder Mask | Green |
| Bottom Solder Mask | Green |
| Top Silkscreen | White |
| Bottom Silkscreen | None |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Quality Standard | IPC-Class-2 |
Lowest Dissipation Factor in Its Class:
TLY-5Z offers a dissipation factor of approximately 0.0009 at 10 GHz in the low dielectric constant range, with a typical value of 0.0015 at 10 GHz. This ultra-low loss supports millimeter-wave designs at 77 GHz and beyond, enabling low insertion loss in transmission lines and feed networks.
Exceptional Dimensional Stability:
The woven fiberglass reinforcement provides far greater dimensional stability than chopped fiber reinforced PTFE composites, enabling high-volume manufacturing with tight positional tolerances and eliminating the need for double etching.
Low Density for Weight-Sensitive Applications:
With a density of just 1.92 g/cm³, TLY-5Z is significantly lighter than conventional PTFE-based laminates. This is particularly valuable for aerospace and airborne antenna applications where every gram of weight reduction matters.
Low Z-Axis CTE:
The low-density composition results in minimal Z-axis expansion (CTE of 130 ppm/°C), a characteristic not typically found in PTFE-rich composites. Compared to traditional low dielectric constant PTFE composites, TLY-5Z demonstrates superior thermal stability against z-axis expansion-induced stress on plated through-holes.
Plated Through-Hole Stability:
The combination of low Z-axis CTE and matched X/Y CTE (30/40 ppm/°C) contributes to reliable plated through-hole performance, even under thermal cycling—a critical requirement for high-reliability aerospace and defense applications.
Excellent Peel Strength and Flat Copper Compatibility:
TLY-5Z exhibits excellent peel strength and is compatible with flat copper, ensuring robust adhesion and reliable circuit performance through fabrication and assembly.
Attractive Price/Performance Ratio:
TLY-5Z offers a compelling cost-to-performance ratio, making it accessible for commercial high-volume production while maintaining the electrical and mechanical characteristics required for demanding RF applications.
Quality and Availability
All boards are manufactured in compliance with IPC-Class-2 quality standards, ensuring robust reliability for commercial, industrial, and aerospace-related applications. 100% electrical testing is performed prior to shipment to guarantee functional integrity.
Our production capability extends to worldwide availability, with flexible shipping and logistics support for both prototype and volume requirements. We offer rapid turnaround and competitive pricing while maintaining strict process control.
For inquiries about custom stack-ups, panel sizes, alternative copper foils, or other configurations, please contact our sales engineering team—we are ready to support your high-frequency circuit board requirements.
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