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Metal Based High Frequency PCB Built on 3.0mm PTFE with 1.0oz coating Immersion Gold for Radio Device
  • name
  • name

Metal Based High Frequency PCB Built on 3.0mm PTFE with 1.0oz coating Immersion Gold for Radio Device

MOQ: 1
Price: USD 9.99-99.99
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Western Union
Supply Capacity: 50000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-107-V1.07
Number Of Layers:
2
Glass Epoxy:
PTFE F4B
Final Foil:
1 Oz
Final Height Of PCB:
3.0 Mm ±10%
Surface Finish:
Immersion Gold
Solder Mask Color:
Black
Colour Of Component Legend:
White
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 9.99-99.99
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Western Union
Supply Ability:
50000 pieces per month
Product Description

Metal Based High Frequency PCB Built on Modified Woven Fabric Glass Teflon (PTFE) Copper Clad Laminates with Ceramic Filler

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Metal based substrate is a combination of metal based high frequency materials. The intermediate medium is made of high frequency materials ( such as PTFE and others), one side is coated with copper foil, the other side is coated with copper base or aluminum base. The PCB made on this kind of modified material, we can call it metal based high frequency PCB.

 

Metal Based High Frequency PCB Built on 3.0mm PTFE with 1.0oz coating Immersion Gold for Radio Device 0

 

Parameters

DK @ 10GHz & Tolerance: 2.20+/- 0.03

Thermal Change of DK (ppm/℃) : -48

Loss Tangent, Df@10GHz: 0.001

Thermal Conductivity(W/mk): 0.35

Td (℃): 476

Coefficient of Thermal Expansion -50℃ -260 ℃: X 40; Y45; Z98

Density (g/cm3): 1.80

Volume Resisivity (Mohm.cm) 1x 10^8

Surface Resistivity (Mohm): 1 x 10^8

Moisture Absorption: 0.02

Peel Strength (N/cm) (1oz): 20

Flammability Rating: UL94 V0

 

Data Sheet of F4BTMS Modified woven fabric glass Teflon (PTFE) copper clad laminates with ceramic filler

Designator of Substrate Material Composition / Dielectric Layer Types DK @ 10GHz & Tolerance Thermal Change of Dk(ppm/℃) Loss Tangent, Df@10GHz Thermal Conductivity(W/mk) Td (℃) Coefficient of Thermal Expansion -50℃ -260 ℃ (ppm/℃) Density (g/cm3): Volume Resisivity (Mohm.cm) Surface Resistivity (Mohm) Moisture Absorption (%) Peel Strength (N/cm) (1oz) Flammability Rating
X Y Z
F4BTMS PTFE/Ceramic/Superfine woven glass F4BTMS220 2.20±0.03 -48 0.0010 0.35 476 40 45 98 1.80 1X108 1X108 0.02 20 V-0
F4BTMS294 2.94±0.04 -20 0.0012 0.58 490 10 12 22 2.25 1X108 1X108 0.03 12 V-0
F4BTMS300 3.00±0.04 -20 0.0013 0.58 490 10 11 22 2.28 1X108 1X108 0.04 12 V-0

Type of Metal Base: Aluminum, Copper

Thickness of Metal Base: 1.0mm, 2.0mm, 3.0mm, 4.0mm

Base copper: 0.5oz, 1oz

 

Thickness and size F4BTMS

Designator of Substrate Standard Dielectric Thickness(Without the cladding) and Tolerance Available Copper Foil Standard Size
F4BTMS 0.127mm(5mil) ±0.0127mm(0.5mil) 0.254mm(10mil) ±0.02mm(1mil) 0.508mm(20mil) ±0.03mm(1.19mil) 0.762mm(30mil) ±0.04mm(1.58mil) 1.016mm(40mil) ±0.05mm(2mil) 1.524mm(60mil) ±0.05mm(2mil) 3.05mm(120mil) ±0.1mm(4mil) 5.08mm(200mil) ±0.127mm(5mil) Non-standard thickness is increased by 0.254mm(10mil). Over 6.1mm(240mil), please contact us. 0.5oz, 1oz, ED Copper, RTF Copper, HVLP Copper, RA Copper, 50ῼ Resistance Copper 305mm x 460mm (12" x 18") 460mm x 610mm (18" x 24") 500mm x 600mm (19.7" x 23.6") 915mm x 1220mm (36" x 48")

 

Metal Based High Frequency PCB Built on 3.0mm PTFE with 1.0oz coating Immersion Gold for Radio Device 1

 

Our PCB Capability (Metal based RF PCB)

PCB Material: Modified PTFE Copper Clad with Ceramic Filler
Designator: F4BTMS220
Dielectric constant @ 10GHz: 2.2
Layer count: Single Layer
Copper weight: 0.5oz, 1oz
PCB thickness: 1.2mm - 9.0mm
0.047” - 0.354”
Solder mask: Green, Red, Black, White, Blue etc.
PCB size: ≤400mm X 500mm
Surface finish: Bare copper, HASL, ENIG, Immersion tin etc.

 

Metal Based High Frequency PCB Built on 3.0mm PTFE with 1.0oz coating Immersion Gold for Radio Device 2

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products
PRODUCTS DETAILS
Products

Newly Shipped RF PCB

Rogers PCB Board

Taconic PCB Board

PTFE PCB Board

Flexible Printed Circuit

Multilayer PCB Board

High Temperature PCB

HDI PCB Board

Impedance Controlled PCB

PCB Prototypes

Blog

Arlon PCB Board

Hybrid PCB Board

FR-4 PCB Board

High Frequency PCB

F4B SERIES PCBS
Metal Based High Frequency PCB Built on 3.0mm PTFE with 1.0oz coating Immersion Gold for Radio Device
  • name
  • name
Metal Based High Frequency PCB Built on 3.0mm PTFE with 1.0oz coating Immersion Gold for Radio Device
MOQ: 1
Price: USD 9.99-99.99
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Western Union
Supply Capacity: 50000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-107-V1.07
Number Of Layers:
2
Glass Epoxy:
PTFE F4B
Final Foil:
1 Oz
Final Height Of PCB:
3.0 Mm ±10%
Surface Finish:
Immersion Gold
Solder Mask Color:
Black
Colour Of Component Legend:
White
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 9.99-99.99
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Western Union
Supply Ability:
50000 pieces per month
Product Description

Metal Based High Frequency PCB Built on Modified Woven Fabric Glass Teflon (PTFE) Copper Clad Laminates with Ceramic Filler

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Metal based substrate is a combination of metal based high frequency materials. The intermediate medium is made of high frequency materials ( such as PTFE and others), one side is coated with copper foil, the other side is coated with copper base or aluminum base. The PCB made on this kind of modified material, we can call it metal based high frequency PCB.

 

Metal Based High Frequency PCB Built on 3.0mm PTFE with 1.0oz coating Immersion Gold for Radio Device 0

 

Parameters

DK @ 10GHz & Tolerance: 2.20+/- 0.03

Thermal Change of DK (ppm/℃) : -48

Loss Tangent, Df@10GHz: 0.001

Thermal Conductivity(W/mk): 0.35

Td (℃): 476

Coefficient of Thermal Expansion -50℃ -260 ℃: X 40; Y45; Z98

Density (g/cm3): 1.80

Volume Resisivity (Mohm.cm) 1x 10^8

Surface Resistivity (Mohm): 1 x 10^8

Moisture Absorption: 0.02

Peel Strength (N/cm) (1oz): 20

Flammability Rating: UL94 V0

 

Data Sheet of F4BTMS Modified woven fabric glass Teflon (PTFE) copper clad laminates with ceramic filler

Designator of Substrate Material Composition / Dielectric Layer Types DK @ 10GHz & Tolerance Thermal Change of Dk(ppm/℃) Loss Tangent, Df@10GHz Thermal Conductivity(W/mk) Td (℃) Coefficient of Thermal Expansion -50℃ -260 ℃ (ppm/℃) Density (g/cm3): Volume Resisivity (Mohm.cm) Surface Resistivity (Mohm) Moisture Absorption (%) Peel Strength (N/cm) (1oz) Flammability Rating
X Y Z
F4BTMS PTFE/Ceramic/Superfine woven glass F4BTMS220 2.20±0.03 -48 0.0010 0.35 476 40 45 98 1.80 1X108 1X108 0.02 20 V-0
F4BTMS294 2.94±0.04 -20 0.0012 0.58 490 10 12 22 2.25 1X108 1X108 0.03 12 V-0
F4BTMS300 3.00±0.04 -20 0.0013 0.58 490 10 11 22 2.28 1X108 1X108 0.04 12 V-0

Type of Metal Base: Aluminum, Copper

Thickness of Metal Base: 1.0mm, 2.0mm, 3.0mm, 4.0mm

Base copper: 0.5oz, 1oz

 

Thickness and size F4BTMS

Designator of Substrate Standard Dielectric Thickness(Without the cladding) and Tolerance Available Copper Foil Standard Size
F4BTMS 0.127mm(5mil) ±0.0127mm(0.5mil) 0.254mm(10mil) ±0.02mm(1mil) 0.508mm(20mil) ±0.03mm(1.19mil) 0.762mm(30mil) ±0.04mm(1.58mil) 1.016mm(40mil) ±0.05mm(2mil) 1.524mm(60mil) ±0.05mm(2mil) 3.05mm(120mil) ±0.1mm(4mil) 5.08mm(200mil) ±0.127mm(5mil) Non-standard thickness is increased by 0.254mm(10mil). Over 6.1mm(240mil), please contact us. 0.5oz, 1oz, ED Copper, RTF Copper, HVLP Copper, RA Copper, 50ῼ Resistance Copper 305mm x 460mm (12" x 18") 460mm x 610mm (18" x 24") 500mm x 600mm (19.7" x 23.6") 915mm x 1220mm (36" x 48")

 

Metal Based High Frequency PCB Built on 3.0mm PTFE with 1.0oz coating Immersion Gold for Radio Device 1

 

Our PCB Capability (Metal based RF PCB)

PCB Material: Modified PTFE Copper Clad with Ceramic Filler
Designator: F4BTMS220
Dielectric constant @ 10GHz: 2.2
Layer count: Single Layer
Copper weight: 0.5oz, 1oz
PCB thickness: 1.2mm - 9.0mm
0.047” - 0.354”
Solder mask: Green, Red, Black, White, Blue etc.
PCB size: ≤400mm X 500mm
Surface finish: Bare copper, HASL, ENIG, Immersion tin etc.

 

Metal Based High Frequency PCB Built on 3.0mm PTFE with 1.0oz coating Immersion Gold for Radio Device 2

Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel: 86-755-27374847
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