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222

MOQ: 1PCS
Price: 0.99-99USD/PCS
Standard Packaging: Packing
Delivery Period: 2-10 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000pcs
Detail Information
Minimum Order Quantity:
1PCS
Price:
0.99-99USD/PCS
Packaging Details:
Packing
Delivery Time:
2-10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000pcs
Product Description

Custom 2-Layer 19.6mil TP960 PCB with ENIG Finish

 

 

Introducing the 2-layer 19.6mil PCB using TP960 laminate, designed for high-frequency, thermally stable, and low-loss applications. The TP960 material, with its ceramic/PPO-based thermoplastic composition, delivers high dielectric strength, low dissipation, and dimensional stability. The ENIG (Electroless Nickel Immersion Gold) finish ensures excellent solderability, corrosion resistance, and durability, making this PCB ideal for satellite navigation systems, missile applications, and miniaturized antennas. Manufactured to IPC-Class-2 standards, this PCB guarantees precision and reliability for critical applications.

 

 

PCB Construction Details

Parameter Specification
Base Material TP960
Layer Count 2-layer (double-sided)
Board Dimensions 108mm x 96mm ± 0.15mm
Finished Thickness 0.6mm
Copper Weight 1oz (1.4 mils) outer layers
Minimum Trace/Space 5/6 mils
Minimum Hole Size 0.3mm
Via Plating Thickness 20μm
Surface Finish ENIG (Electroless Nickel Immersion Gold)
Top Silkscreen None
Bottom Silkscreen None
Top Solder Mask None
Bottom Solder Mask None
Electrical Testing 100% tested prior to shipment

 

PCB Stackup

This 2-layer rigid PCB stackup is optimized for low loss, high-frequency stability, and dimensional reliability. The stackup details are:

Layer Material Thickness
Copper Layer 1 RTF Copper (Reverse-Treated Foil) 35μm (1oz)
Core Material TP960 0.5mm (19.6mil)
Copper Layer 2 RTF Copper (Reverse-Treated Foil) 35μm (1oz)

 

 

The TP960 core provides stable dielectric constant, low dissipation factor, and excellent thermal performance, making it ideal for high-precision RF and microwave circuits.

 

PCB Statistics

This PCB is optimized for applications requiring compact and reliable designs:

Attribute Value
Components 56
Total Pads 92
Thru Hole Pads 45
Top SMT Pads 47
Bottom SMT Pads 0
Vias 34
Nets 2

 

 

About TP960 Laminate

The TP960 laminate is a high-frequency thermoplastic material combining ceramics and polyphenylene oxide (PPO) resin. Its unique composition eliminates fiberglass reinforcement, reducing negative impacts on electromagnetic wave propagation while maintaining dimensional stability and low dielectric loss. This material is ideal for miniaturized, high-frequency applications requiring exceptional reliability.

 

 

Key Features of TP960:

  • Dielectric Constant (Dk): 9.6 ± 0.19 at 10GHz, providing precise impedance control.
  • Dissipation Factor (Df): 0.0012 at 10GHz, ensuring minimal signal loss.
  • CTE (Coefficient of Thermal Expansion): X-axis: 40 ppm/°C, Y-axis: 40 ppm/°C, Z-axis: 55 ppm/°C
  • Thermal Coefficient of Dk: -40 ppm/°C, ensuring stable performance across -55°C to 150°C.
  • Thermal Conductivity: 0.65 W/mK, enabling efficient heat dissipation.
  • Moisture Absorption: 0.01%, ensuring stability in humid environments.
  • Flammability: UL 94-V0, meeting safety standards.

 

TP960 laminates allow for dielectric constants ranging from 3 to 25, tailored to circuit requirements, and maintain stability across a wide frequency range.

 

 

Benefits of TP960-Based PCBs

 

The low dissipation factor (Df) and stable dielectric constant (Dk) ensure minimal signal distortion and high-frequency reliability.

 

 

Thermal Stability:
With low TCDk (-40 ppm/°C) and high thermal conductivity (0.65 W/mK), the PCB provides consistent performance even in extreme temperature environments.

 

 

Moisture Resistance:
The material's low moisture absorption (0.01%) ensures dimensional stability, even in humid or harsh environments.

 

 

High Reliability:
The ENIG surface finish enhances solderability, corrosion resistance, and wire-bonding compatibility, making it suitable for critical applications.

 

 

Customizable Dielectric Properties:
The ability to select dielectric constants between 3 and 25 makes TP960 versatile for a wide range of high-frequency applications.

 

 

Ease of Manufacturing:
TP960 laminates' dimensional stability and smooth surface simplify fabrication while ensuring consistent results.

 

 

Application Scenarios

This 19.6mil TP960 PCB is designed for high-frequency and high-reliability applications, including:

Global Satellite Navigation Systems: Ensures precise signal transmission in extreme environmental conditions.

Missile-Borne Systems: Provides high reliability and low loss for advanced guidance systems.

Fuze Technology: Offers dimensional stability and low loss for compact, fast-response circuits.

Miniaturized Antennas: Delivers low dielectric loss and stable phase performance in space-constrained designs.

Aerospace Applications: Suitable for critical communication and navigation systems in harsh operating conditions.

 

Conclusion

The 2-layer 19.6mil TP960 PCB with ENIG finish is a high-performance solution for high-frequency, high-reliability applications requiring dimensional stability, low loss, and thermal performance. Its advanced ceramic/PPO composition, precise dielectric properties, and moisture resistance make it an excellent choice for satellite navigation, missile systems, and miniaturized antennas. Backed by IPC-Class-2 standards and 100% electrical testing, this PCB is manufactured to meet the most demanding requirements.

For inquiries or custom requirements, contact us today to bring your high-frequency designs to life!

 

products
PRODUCTS DETAILS
222
MOQ: 1PCS
Price: 0.99-99USD/PCS
Standard Packaging: Packing
Delivery Period: 2-10 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000pcs
Detail Information
Minimum Order Quantity:
1PCS
Price:
0.99-99USD/PCS
Packaging Details:
Packing
Delivery Time:
2-10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000pcs
Product Description

Custom 2-Layer 19.6mil TP960 PCB with ENIG Finish

 

 

Introducing the 2-layer 19.6mil PCB using TP960 laminate, designed for high-frequency, thermally stable, and low-loss applications. The TP960 material, with its ceramic/PPO-based thermoplastic composition, delivers high dielectric strength, low dissipation, and dimensional stability. The ENIG (Electroless Nickel Immersion Gold) finish ensures excellent solderability, corrosion resistance, and durability, making this PCB ideal for satellite navigation systems, missile applications, and miniaturized antennas. Manufactured to IPC-Class-2 standards, this PCB guarantees precision and reliability for critical applications.

 

 

PCB Construction Details

Parameter Specification
Base Material TP960
Layer Count 2-layer (double-sided)
Board Dimensions 108mm x 96mm ± 0.15mm
Finished Thickness 0.6mm
Copper Weight 1oz (1.4 mils) outer layers
Minimum Trace/Space 5/6 mils
Minimum Hole Size 0.3mm
Via Plating Thickness 20μm
Surface Finish ENIG (Electroless Nickel Immersion Gold)
Top Silkscreen None
Bottom Silkscreen None
Top Solder Mask None
Bottom Solder Mask None
Electrical Testing 100% tested prior to shipment

 

PCB Stackup

This 2-layer rigid PCB stackup is optimized for low loss, high-frequency stability, and dimensional reliability. The stackup details are:

Layer Material Thickness
Copper Layer 1 RTF Copper (Reverse-Treated Foil) 35μm (1oz)
Core Material TP960 0.5mm (19.6mil)
Copper Layer 2 RTF Copper (Reverse-Treated Foil) 35μm (1oz)

 

 

The TP960 core provides stable dielectric constant, low dissipation factor, and excellent thermal performance, making it ideal for high-precision RF and microwave circuits.

 

PCB Statistics

This PCB is optimized for applications requiring compact and reliable designs:

Attribute Value
Components 56
Total Pads 92
Thru Hole Pads 45
Top SMT Pads 47
Bottom SMT Pads 0
Vias 34
Nets 2

 

 

About TP960 Laminate

The TP960 laminate is a high-frequency thermoplastic material combining ceramics and polyphenylene oxide (PPO) resin. Its unique composition eliminates fiberglass reinforcement, reducing negative impacts on electromagnetic wave propagation while maintaining dimensional stability and low dielectric loss. This material is ideal for miniaturized, high-frequency applications requiring exceptional reliability.

 

 

Key Features of TP960:

  • Dielectric Constant (Dk): 9.6 ± 0.19 at 10GHz, providing precise impedance control.
  • Dissipation Factor (Df): 0.0012 at 10GHz, ensuring minimal signal loss.
  • CTE (Coefficient of Thermal Expansion): X-axis: 40 ppm/°C, Y-axis: 40 ppm/°C, Z-axis: 55 ppm/°C
  • Thermal Coefficient of Dk: -40 ppm/°C, ensuring stable performance across -55°C to 150°C.
  • Thermal Conductivity: 0.65 W/mK, enabling efficient heat dissipation.
  • Moisture Absorption: 0.01%, ensuring stability in humid environments.
  • Flammability: UL 94-V0, meeting safety standards.

 

TP960 laminates allow for dielectric constants ranging from 3 to 25, tailored to circuit requirements, and maintain stability across a wide frequency range.

 

 

Benefits of TP960-Based PCBs

 

The low dissipation factor (Df) and stable dielectric constant (Dk) ensure minimal signal distortion and high-frequency reliability.

 

 

Thermal Stability:
With low TCDk (-40 ppm/°C) and high thermal conductivity (0.65 W/mK), the PCB provides consistent performance even in extreme temperature environments.

 

 

Moisture Resistance:
The material's low moisture absorption (0.01%) ensures dimensional stability, even in humid or harsh environments.

 

 

High Reliability:
The ENIG surface finish enhances solderability, corrosion resistance, and wire-bonding compatibility, making it suitable for critical applications.

 

 

Customizable Dielectric Properties:
The ability to select dielectric constants between 3 and 25 makes TP960 versatile for a wide range of high-frequency applications.

 

 

Ease of Manufacturing:
TP960 laminates' dimensional stability and smooth surface simplify fabrication while ensuring consistent results.

 

 

Application Scenarios

This 19.6mil TP960 PCB is designed for high-frequency and high-reliability applications, including:

Global Satellite Navigation Systems: Ensures precise signal transmission in extreme environmental conditions.

Missile-Borne Systems: Provides high reliability and low loss for advanced guidance systems.

Fuze Technology: Offers dimensional stability and low loss for compact, fast-response circuits.

Miniaturized Antennas: Delivers low dielectric loss and stable phase performance in space-constrained designs.

Aerospace Applications: Suitable for critical communication and navigation systems in harsh operating conditions.

 

Conclusion

The 2-layer 19.6mil TP960 PCB with ENIG finish is a high-performance solution for high-frequency, high-reliability applications requiring dimensional stability, low loss, and thermal performance. Its advanced ceramic/PPO composition, precise dielectric properties, and moisture resistance make it an excellent choice for satellite navigation, missile systems, and miniaturized antennas. Backed by IPC-Class-2 standards and 100% electrical testing, this PCB is manufactured to meet the most demanding requirements.

For inquiries or custom requirements, contact us today to bring your high-frequency designs to life!

 

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