CLTE-MW™ double sided Copper Clad Laminate with 0.076 mm Ultra-thin Engineered for Millimeter-Wave & 5G Circuitry

CLTE-MW™ Copper Clad Laminate: Engineered for Millimeter-Wave & 5G Circuitry

CLTE-MW™ represents a specialized advancement in high-frequency circuit materials, specifically engineered to address the unique demands of 5G, millimeter-wave (mmWave), and other high-density RF applications. As a ceramic-filled, woven glass reinforced PTFE composite, this laminate is designed to deliver cost-effective, high-performance solutions where precise thickness control, low loss, and stable electrical performance are critical. With seven available thickness options ranging from 3 to 10 mils, CLTE-MW enables designers to achieve optimal signal-to-ground spacing, making it ideal for impedance-controlled, high-frequency designs.

A key innovation in CLTE-MW is the use of spread glass reinforcement combined with high ceramic filler loading. This construction effectively minimizes the undesirable "glass weave effect" that can disrupt electromagnetic signal propagation at high frequencies, ensuring more consistent and predictable electrical performance. The material offers excellent dimensional stability, low moisture absorption, and a UL94 V-0 flammability rating, supporting reliable operation in commercial, aerospace, defense, and consumer applications.

CLTE-MW is particularly well-suited for amplifiers, antennas, baluns, couplers, and filters operating in demanding frequency ranges. Its balanced thermal, mechanical, and electrical properties provide a robust platform for circuits where physical or electrical constraints limit thickness options without compromising performance.

Standard Properties Table

Standard Specifications of CLTE-MW Laminate:

Electrical Properties:

• Dielectric Constant (Process Dk @ 10 GHz): 2.94 to 3.02 ±0.04
• Design Dk (8–40 GHz, microstrip): 3.03 to 3.10 (varies by thickness)
• Dissipation Factor (Loss Tangent @ 10 GHz): 0.0015
• Thermal Coefficient of Dk: –35 ppm/°C (0–100°C, @ 10 GHz)
• Volume Resistivity: 1.3 × 10⁷ MΩ·cm
• Electrical Strength: 630 V/mil
• Comparative Tracking Index: 600V / PLC 0

Thermal Properties:

• Coefficient of Thermal Expansion (CTE): X & Y-axis: 8 ppm/°C, Z-axis: 30 ppm/°C (excellent for PTH reliability)
• Decomposition Temperature (Td): 500°C
• Thermal Conductivity: 0.42 W/(m·K)
• Time to Delamination (@ 288°C): >60 minutes

Mechanical & Physical Properties:

• Copper Peel Strength (@ 288°C): 1.1 N/mm (6.0 lbs/in)
• Dimensional Stability: 0.22 mil/inch (MD & CMD)
• Moisture Absorption: 0.03%
• Flammability: UL 94 V-0
• Density: 2.1 g/cm³

Dielectric Constant by Thickness (Design Dk, AH/AH):

0.003" (0.076 mm): Dk = 3.10

0.004" (0.102 mm): Dk = 3.08

0.005" (0.127 mm): Dk = 3.07

0.006" (0.152 mm): Dk = 3.07

0.007" (0.178 mm): Dk = 3.06

0.008" (0.203 mm): Dk = 3.05

0.010" (0.254 mm): Dk = 3.03

Standard Product Offerings:

Available Thicknesses & Tolerances:

0.003" (0.076 mm) ±0.0005"

0.004" (0.102 mm) ±0.0005"

0.005" (0.127 mm) ±0.0007"

0.006" (0.152 mm) ±0.0007"

0.007" (0.178 mm) ±0.0010"

0.008" (0.203 mm) ±0.0010"

0.010" (0.254 mm) ±0.0010"

Standard Panel Sizes: 12" × 18" (305 × 457 mm) and 24" × 18" (610 × 457 mm)

Standard Copper Claddings:

Reverse Treated Electrodeposited Copper: ½ oz (18 µm), 1 oz (35 µm), 2 oz (70 µm)

Very Low Profile Electrodeposited Copper: ¼ oz (9 µm), ½ oz (18 µm), 1 oz (35 µm)

CLTE-MW laminate delivers a finely tuned balance of electrical consistency, mechanical stability, and thermal reliability, making it an intelligent choice for next-generation high-frequency designs where precision, performance, and cost efficiency must coexist.