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Custom 2-Layer TP600 PCB DK 6.0 base on high-frequency material 19.6mil thick with ENEPIG Finish for miniaturized antenna

Custom 2-Layer TP600 PCB DK 6.0 base on high-frequency material 19.6mil thick with ENEPIG Finish for miniaturized antenna

MOQ: 1PCS
Price: 0.99-99USD/PCS
Standard Packaging: Packing
Delivery Period: 2-10 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000pcs
Detail Information
Place of Origin
China
Brand Name
Wangling
Certification
ISO9001
Model Number
TP600 PCB
Minimum Order Quantity:
1PCS
Price:
0.99-99USD/PCS
Packaging Details:
Packing
Delivery Time:
2-10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000pcs
Product Description

Custom 2-Layer 19.6mil TP600 PCB with ENEPIG Finish

 

Introducing a 2-layer 19.6mil PCB using TP600 laminate, designed for high-frequency, thermally stable, and moisture-resistant applications. With its ceramic/PPO-based thermoplastic composition, TP600 provides an excellent balance of dielectric performance, low dissipation, and dimensional stability. The ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold) surface finish offers superior solderability, wire-bonding compatibility, and corrosion resistance, making this PCB ideal for satellite navigation, missile systems, and miniaturized antennas. Built to IPC-Class-2 standards, this PCB meets stringent quality and performance requirements.

 

Custom 2-Layer TP600 PCB DK 6.0 base on high-frequency material 19.6mil thick with ENEPIG Finish for miniaturized antenna 0

 

PCB Construction Details

This TP600-based PCB is optimized for high-frequency and miniaturized applications, with the following specifications:

Parameter Specification
Base Material TP600
Layer Count 2-layer (double-sided)
Board Dimensions 42mm x 45mm ± 0.15mm
Finished Thickness 0.6mm
Copper Weight 1oz (1.4 mils) outer layers
Minimum Trace/Space 7/6 mils
Minimum Hole Size 0.4mm
Via Plating Thickness 20μm
Surface Finish ENEPIG (Electroless Nickel, Palladium, Immersion Gold)
Top Silkscreen None
Bottom Silkscreen None
Top Solder Mask None
Bottom Solder Mask None
Additional Features Countersunk holes
Electrical Testing 100% tested prior to shipment

 

PCB Stackup

This 2-layer rigid PCB stackup is designed for low loss, high-frequency stability, and dimensional reliability:

Layer Material Thickness
Copper Layer 1 RTF Copper (Reverse-Treated Foil) 35μm (1oz)
Core Material TP600 0.5mm (19.6mil)
Copper Layer 2 RTF Copper (Reverse-Treated Foil) 35μm (1oz)

 

 

PCB Statistics

This PCB features a compact and optimized design for high-reliability applications:

Attribute Value
Components 19
Total Pads 56
Thru Hole Pads 25
Top SMT Pads 31
Bottom SMT Pads 0
Vias 78
Nets 2

 

 

About TP600 Laminate

The TP600 laminate is a high-frequency thermoplastic material composed of ceramics and polyphenylene oxide (PPO) resin, offering precision dielectric properties and low loss. Unlike traditional fiberglass-reinforced laminates, TP600 eliminates the negative effects of glass fiber on electromagnetic wave propagation, ensuring superior signal integrity and dimensional stability.

 

 

Key Features of TP600:

  • Dielectric Constant (Dk): 6 ± 0.12 at 10GHz, ensuring precise impedance control.
  • Dissipation Factor (Df): 0.0010 at 10GHz, ensuring minimal signal loss.
  • CTE (Coefficient of Thermal Expansion): X-axis: 50 ppm/°C, Y-axis: 50 ppm/°C, Z-axis: 60 ppm/°C
  • Thermal Coefficient of Dk: -50 ppm/°C, ensuring stable performance across -55°C to 150°C.
  • Thermal Conductivity: 0.55 W/mK, enabling efficient heat dissipation.
  • Moisture Absorption: 0.01%, ensuring stability in humid environments.
  • Flammability: UL-94 V0, meeting safety standards.

 

TP600 laminates are available with dielectric constants ranging from 3 to 25, tailored to circuit requirements, and maintain stability across a wide frequency range. The RTF (Reverse-Treated Foil) copper cladding minimizes conductor loss and enhances peel strength.

 

 

Benefits of TP600-Based PCBs

 

The low dissipation factor (Df) and stable dielectric constant (Dk) ensure minimal signal distortion at high frequencies.

 

With low TCDk (-50 ppm/°C) and high thermal conductivity (0.55 W/mK), the PCB ensures consistent performance across wide temperature ranges.

 

The material's low moisture absorption (0.01%) ensures dimensional stability and reliable signal performance in humid environments.

 

The ENEPIG surface finish enhances solderability, corrosion resistance, and wire-bonding compatibility, making it suitable for mission-critical applications.

 

TP600 laminates' smooth surface and dimensional stability enable easy fabrication and consistent results across production runs.

 

The ability to select dielectric constants between 3 and 25 makes TP600 versatile for a wide range of applications.

 

 

Application Scenarios

  • Global Satellite Navigation Systems
  • Missile-Borne Systems
  • Fuze Technology
  • Miniaturized Antennas
  • Aerospace Applications

 

 

Conclusion

The 2-layer 19.6mil TP600 PCB with ENEPIG finish is a cutting-edge solution for high-frequency, high-reliability applications requiring dimensional stability, low loss, and thermal performance. Its advanced ceramic/PPO composition, precise dielectric properties, and moisture resistance make it an excellent choice for satellite navigation, aerospace, and missile-borne technologies. Backed by IPC-Class-2 standards and 100% electrical testing, this PCB is designed to meet and exceed industry expectations.

 

For more information or to discuss your custom requirements, contact us today. Let us help you achieve success in your next high-frequency project!

 

products
PRODUCTS DETAILS
Custom 2-Layer TP600 PCB DK 6.0 base on high-frequency material 19.6mil thick with ENEPIG Finish for miniaturized antenna
MOQ: 1PCS
Price: 0.99-99USD/PCS
Standard Packaging: Packing
Delivery Period: 2-10 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000pcs
Detail Information
Place of Origin
China
Brand Name
Wangling
Certification
ISO9001
Model Number
TP600 PCB
Minimum Order Quantity:
1PCS
Price:
0.99-99USD/PCS
Packaging Details:
Packing
Delivery Time:
2-10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000pcs
Product Description

Custom 2-Layer 19.6mil TP600 PCB with ENEPIG Finish

 

Introducing a 2-layer 19.6mil PCB using TP600 laminate, designed for high-frequency, thermally stable, and moisture-resistant applications. With its ceramic/PPO-based thermoplastic composition, TP600 provides an excellent balance of dielectric performance, low dissipation, and dimensional stability. The ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold) surface finish offers superior solderability, wire-bonding compatibility, and corrosion resistance, making this PCB ideal for satellite navigation, missile systems, and miniaturized antennas. Built to IPC-Class-2 standards, this PCB meets stringent quality and performance requirements.

 

Custom 2-Layer TP600 PCB DK 6.0 base on high-frequency material 19.6mil thick with ENEPIG Finish for miniaturized antenna 0

 

PCB Construction Details

This TP600-based PCB is optimized for high-frequency and miniaturized applications, with the following specifications:

Parameter Specification
Base Material TP600
Layer Count 2-layer (double-sided)
Board Dimensions 42mm x 45mm ± 0.15mm
Finished Thickness 0.6mm
Copper Weight 1oz (1.4 mils) outer layers
Minimum Trace/Space 7/6 mils
Minimum Hole Size 0.4mm
Via Plating Thickness 20μm
Surface Finish ENEPIG (Electroless Nickel, Palladium, Immersion Gold)
Top Silkscreen None
Bottom Silkscreen None
Top Solder Mask None
Bottom Solder Mask None
Additional Features Countersunk holes
Electrical Testing 100% tested prior to shipment

 

PCB Stackup

This 2-layer rigid PCB stackup is designed for low loss, high-frequency stability, and dimensional reliability:

Layer Material Thickness
Copper Layer 1 RTF Copper (Reverse-Treated Foil) 35μm (1oz)
Core Material TP600 0.5mm (19.6mil)
Copper Layer 2 RTF Copper (Reverse-Treated Foil) 35μm (1oz)

 

 

PCB Statistics

This PCB features a compact and optimized design for high-reliability applications:

Attribute Value
Components 19
Total Pads 56
Thru Hole Pads 25
Top SMT Pads 31
Bottom SMT Pads 0
Vias 78
Nets 2

 

 

About TP600 Laminate

The TP600 laminate is a high-frequency thermoplastic material composed of ceramics and polyphenylene oxide (PPO) resin, offering precision dielectric properties and low loss. Unlike traditional fiberglass-reinforced laminates, TP600 eliminates the negative effects of glass fiber on electromagnetic wave propagation, ensuring superior signal integrity and dimensional stability.

 

 

Key Features of TP600:

  • Dielectric Constant (Dk): 6 ± 0.12 at 10GHz, ensuring precise impedance control.
  • Dissipation Factor (Df): 0.0010 at 10GHz, ensuring minimal signal loss.
  • CTE (Coefficient of Thermal Expansion): X-axis: 50 ppm/°C, Y-axis: 50 ppm/°C, Z-axis: 60 ppm/°C
  • Thermal Coefficient of Dk: -50 ppm/°C, ensuring stable performance across -55°C to 150°C.
  • Thermal Conductivity: 0.55 W/mK, enabling efficient heat dissipation.
  • Moisture Absorption: 0.01%, ensuring stability in humid environments.
  • Flammability: UL-94 V0, meeting safety standards.

 

TP600 laminates are available with dielectric constants ranging from 3 to 25, tailored to circuit requirements, and maintain stability across a wide frequency range. The RTF (Reverse-Treated Foil) copper cladding minimizes conductor loss and enhances peel strength.

 

 

Benefits of TP600-Based PCBs

 

The low dissipation factor (Df) and stable dielectric constant (Dk) ensure minimal signal distortion at high frequencies.

 

With low TCDk (-50 ppm/°C) and high thermal conductivity (0.55 W/mK), the PCB ensures consistent performance across wide temperature ranges.

 

The material's low moisture absorption (0.01%) ensures dimensional stability and reliable signal performance in humid environments.

 

The ENEPIG surface finish enhances solderability, corrosion resistance, and wire-bonding compatibility, making it suitable for mission-critical applications.

 

TP600 laminates' smooth surface and dimensional stability enable easy fabrication and consistent results across production runs.

 

The ability to select dielectric constants between 3 and 25 makes TP600 versatile for a wide range of applications.

 

 

Application Scenarios

  • Global Satellite Navigation Systems
  • Missile-Borne Systems
  • Fuze Technology
  • Miniaturized Antennas
  • Aerospace Applications

 

 

Conclusion

The 2-layer 19.6mil TP600 PCB with ENEPIG finish is a cutting-edge solution for high-frequency, high-reliability applications requiring dimensional stability, low loss, and thermal performance. Its advanced ceramic/PPO composition, precise dielectric properties, and moisture resistance make it an excellent choice for satellite navigation, aerospace, and missile-borne technologies. Backed by IPC-Class-2 standards and 100% electrical testing, this PCB is designed to meet and exceed industry expectations.

 

For more information or to discuss your custom requirements, contact us today. Let us help you achieve success in your next high-frequency project!

 

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