| MOQ: | 1PCS |
| Price: | 0.99-99USD/PCS |
| Standard Packaging: | Packing |
| Delivery Period: | 2-10 working days |
| Payment Method: | T/T, Paypal |
| Supply Capacity: | 50000pcs |
Custom 2-Layer 19.6mil TP600 PCB with ENEPIG Finish
Introducing a 2-layer 19.6mil PCB using TP600 laminate, designed for high-frequency, thermally stable, and moisture-resistant applications. With its ceramic/PPO-based thermoplastic composition, TP600 provides an excellent balance of dielectric performance, low dissipation, and dimensional stability. The ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold) surface finish offers superior solderability, wire-bonding compatibility, and corrosion resistance, making this PCB ideal for satellite navigation, missile systems, and miniaturized antennas. Built to IPC-Class-2 standards, this PCB meets stringent quality and performance requirements.
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PCB Construction Details
This TP600-based PCB is optimized for high-frequency and miniaturized applications, with the following specifications:
| Parameter | Specification |
| Base Material | TP600 |
| Layer Count | 2-layer (double-sided) |
| Board Dimensions | 42mm x 45mm ± 0.15mm |
| Finished Thickness | 0.6mm |
| Copper Weight | 1oz (1.4 mils) outer layers |
| Minimum Trace/Space | 7/6 mils |
| Minimum Hole Size | 0.4mm |
| Via Plating Thickness | 20μm |
| Surface Finish | ENEPIG (Electroless Nickel, Palladium, Immersion Gold) |
| Top Silkscreen | None |
| Bottom Silkscreen | None |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Additional Features | Countersunk holes |
| Electrical Testing | 100% tested prior to shipment |
PCB Stackup
This 2-layer rigid PCB stackup is designed for low loss, high-frequency stability, and dimensional reliability:
| Layer | Material | Thickness |
| Copper Layer 1 | RTF Copper (Reverse-Treated Foil) | 35μm (1oz) |
| Core Material | TP600 | 0.5mm (19.6mil) |
| Copper Layer 2 | RTF Copper (Reverse-Treated Foil) | 35μm (1oz) |
PCB Statistics
This PCB features a compact and optimized design for high-reliability applications:
| Attribute | Value |
| Components | 19 |
| Total Pads | 56 |
| Thru Hole Pads | 25 |
| Top SMT Pads | 31 |
| Bottom SMT Pads | 0 |
| Vias | 78 |
| Nets | 2 |
About TP600 Laminate
The TP600 laminate is a high-frequency thermoplastic material composed of ceramics and polyphenylene oxide (PPO) resin, offering precision dielectric properties and low loss. Unlike traditional fiberglass-reinforced laminates, TP600 eliminates the negative effects of glass fiber on electromagnetic wave propagation, ensuring superior signal integrity and dimensional stability.
Key Features of TP600:
TP600 laminates are available with dielectric constants ranging from 3 to 25, tailored to circuit requirements, and maintain stability across a wide frequency range. The RTF (Reverse-Treated Foil) copper cladding minimizes conductor loss and enhances peel strength.
Benefits of TP600-Based PCBs
The low dissipation factor (Df) and stable dielectric constant (Dk) ensure minimal signal distortion at high frequencies.
With low TCDk (-50 ppm/°C) and high thermal conductivity (0.55 W/mK), the PCB ensures consistent performance across wide temperature ranges.
The material's low moisture absorption (0.01%) ensures dimensional stability and reliable signal performance in humid environments.
The ENEPIG surface finish enhances solderability, corrosion resistance, and wire-bonding compatibility, making it suitable for mission-critical applications.
TP600 laminates' smooth surface and dimensional stability enable easy fabrication and consistent results across production runs.
The ability to select dielectric constants between 3 and 25 makes TP600 versatile for a wide range of applications.
Application Scenarios
Conclusion
The 2-layer 19.6mil TP600 PCB with ENEPIG finish is a cutting-edge solution for high-frequency, high-reliability applications requiring dimensional stability, low loss, and thermal performance. Its advanced ceramic/PPO composition, precise dielectric properties, and moisture resistance make it an excellent choice for satellite navigation, aerospace, and missile-borne technologies. Backed by IPC-Class-2 standards and 100% electrical testing, this PCB is designed to meet and exceed industry expectations.
For more information or to discuss your custom requirements, contact us today. Let us help you achieve success in your next high-frequency project!
| MOQ: | 1PCS |
| Price: | 0.99-99USD/PCS |
| Standard Packaging: | Packing |
| Delivery Period: | 2-10 working days |
| Payment Method: | T/T, Paypal |
| Supply Capacity: | 50000pcs |
Custom 2-Layer 19.6mil TP600 PCB with ENEPIG Finish
Introducing a 2-layer 19.6mil PCB using TP600 laminate, designed for high-frequency, thermally stable, and moisture-resistant applications. With its ceramic/PPO-based thermoplastic composition, TP600 provides an excellent balance of dielectric performance, low dissipation, and dimensional stability. The ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold) surface finish offers superior solderability, wire-bonding compatibility, and corrosion resistance, making this PCB ideal for satellite navigation, missile systems, and miniaturized antennas. Built to IPC-Class-2 standards, this PCB meets stringent quality and performance requirements.
![]()
PCB Construction Details
This TP600-based PCB is optimized for high-frequency and miniaturized applications, with the following specifications:
| Parameter | Specification |
| Base Material | TP600 |
| Layer Count | 2-layer (double-sided) |
| Board Dimensions | 42mm x 45mm ± 0.15mm |
| Finished Thickness | 0.6mm |
| Copper Weight | 1oz (1.4 mils) outer layers |
| Minimum Trace/Space | 7/6 mils |
| Minimum Hole Size | 0.4mm |
| Via Plating Thickness | 20μm |
| Surface Finish | ENEPIG (Electroless Nickel, Palladium, Immersion Gold) |
| Top Silkscreen | None |
| Bottom Silkscreen | None |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Additional Features | Countersunk holes |
| Electrical Testing | 100% tested prior to shipment |
PCB Stackup
This 2-layer rigid PCB stackup is designed for low loss, high-frequency stability, and dimensional reliability:
| Layer | Material | Thickness |
| Copper Layer 1 | RTF Copper (Reverse-Treated Foil) | 35μm (1oz) |
| Core Material | TP600 | 0.5mm (19.6mil) |
| Copper Layer 2 | RTF Copper (Reverse-Treated Foil) | 35μm (1oz) |
PCB Statistics
This PCB features a compact and optimized design for high-reliability applications:
| Attribute | Value |
| Components | 19 |
| Total Pads | 56 |
| Thru Hole Pads | 25 |
| Top SMT Pads | 31 |
| Bottom SMT Pads | 0 |
| Vias | 78 |
| Nets | 2 |
About TP600 Laminate
The TP600 laminate is a high-frequency thermoplastic material composed of ceramics and polyphenylene oxide (PPO) resin, offering precision dielectric properties and low loss. Unlike traditional fiberglass-reinforced laminates, TP600 eliminates the negative effects of glass fiber on electromagnetic wave propagation, ensuring superior signal integrity and dimensional stability.
Key Features of TP600:
TP600 laminates are available with dielectric constants ranging from 3 to 25, tailored to circuit requirements, and maintain stability across a wide frequency range. The RTF (Reverse-Treated Foil) copper cladding minimizes conductor loss and enhances peel strength.
Benefits of TP600-Based PCBs
The low dissipation factor (Df) and stable dielectric constant (Dk) ensure minimal signal distortion at high frequencies.
With low TCDk (-50 ppm/°C) and high thermal conductivity (0.55 W/mK), the PCB ensures consistent performance across wide temperature ranges.
The material's low moisture absorption (0.01%) ensures dimensional stability and reliable signal performance in humid environments.
The ENEPIG surface finish enhances solderability, corrosion resistance, and wire-bonding compatibility, making it suitable for mission-critical applications.
TP600 laminates' smooth surface and dimensional stability enable easy fabrication and consistent results across production runs.
The ability to select dielectric constants between 3 and 25 makes TP600 versatile for a wide range of applications.
Application Scenarios
Conclusion
The 2-layer 19.6mil TP600 PCB with ENEPIG finish is a cutting-edge solution for high-frequency, high-reliability applications requiring dimensional stability, low loss, and thermal performance. Its advanced ceramic/PPO composition, precise dielectric properties, and moisture resistance make it an excellent choice for satellite navigation, aerospace, and missile-borne technologies. Backed by IPC-Class-2 standards and 100% electrical testing, this PCB is designed to meet and exceed industry expectations.
For more information or to discuss your custom requirements, contact us today. Let us help you achieve success in your next high-frequency project!