F4BME220 Double-sided 1oz Treated Foil copper clad laminate built on 0.254mm 0.508mm 1.524mm substrate

F4BME220 High-Frequency Copper Clad Laminate Description

The F4BME220 is a high-performance, glass fiber-reinforced PTFE (Polytetrafluoroethylene) copper clad laminate manufactured by Taizhou Wangling Insulation Material Factory. Designed for advanced microwave and radio frequency (RF) applications, this material offers a superior combination of stable electrical properties, excellent reliability, and high cost-effectiveness, positioning it as a competitive alternative to imported equivalents.

Core Technology and Composition

The laminate is constructed using a scientific formulation of woven glass fiber cloth and PTFE resin, precisely laminated with a reverse-treated foil (RTF) copper on one or both sides. This specific copper foil type is critical for the "E" variant (F4BME), distinguishing it from the standard F4BM series which uses ED copper. The RTF copper foil is engineered to provide a lower profile surface, which is essential for achieving excellent Passive Intermodulation (PIM) performance (≤-159 dBc), more precise etching control for fine-line circuits, and reduced conductor loss at high frequencies.

Key Electrical Specifications

• Dielectric Constant (Dk): A nominal value of 2.20 at 10 GHz, with a tight tolerance of ±0.04.
• Dissipation Factor (Df): An ultra-low loss tangent of 0.001 at 10 GHz and 0.0014 at 20 GHz, ensuring minimal signal attenuation.
• Dielectric Constant Temperature Coefficient (TcDk): -142 ppm/°C over a range of -55°C to +150°C, indicating stable electrical performance across a wide temperature span.

Standard Product Specifications

Copper Foil: Standard offering is with 1 oz (0.035mm) Reverse Treated Foil (RTF). A 0.5 oz (0.018mm) RTF option is also available.

Standard Thickness: Available in various total (copper+dielectric) or dielectric-only thicknesses. For the F4BME220 (Dk ≤ 2.65), the minimum achievable dielectric core thickness is 0.1mm. Common thicknesses and their tolerances are detailed in the manufacturer's data (e.g., 0.254mm ±0.02mm, 0.508mm ±0.04mm, 1.524mm ±0.06mm).

Standard Panel Sizes: Includes commercially efficient sizes such as 460mm x 610mm, 500mm x 600mm, and 914mm x 1220mm. Custom sizes are available upon request.

Mechanical & Thermal Performance:

• Peel Strength: >1.6 N/mm (with 1 oz RTF copper).
• Dimensional Stability: Enhanced by the adjustable glass-to-PTFE ratio. Higher glass content in higher Dk variants improves stability.
• Coefficient of Thermal Expansion (CTE): XY-direction: 25-34 ppm/°C; Z-direction: 240 ppm/°C (-55°C to 288°C).
• Thermal Conductivity (Z-direction): 0.24 W/(m·K).
• Max Operating Temperature: -55°C to +260°C.
• Flammability Rating: UL 94 V-0.

Other Critical Properties:

• Volume & Surface Resistivity: ≥6x10⁶ MΩ·cm and ≥1x10⁶ MΩ, respectively.
• Moisture Absorption: ≤0.08%.
• Thermal Stress Reliability: Passes 3 cycles of 10 seconds at 260°C solder dip without delamination.

Typical Applications
The F4BME220 is ideally suited for demanding high-frequency circuits where low loss, stable Dk, and low PIM are paramount. Key applications include:

• Phase Shifters and Passive Components
• Power Dividers, Couplers, and Combiners
• Feed Networks and Phased Array Antennas
• Base Station Antennas and Satellite Communication Systems

In summary, the F4BME220 is a specialized, high-reliability laminate that provides a controlled dielectric constant of 2.20, extremely low loss, and superior PIM characteristics due to its RTF copper construction. It is a commercially viable, high-volume solution for next-generation RF and microwave designs.