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DK 3.48 4-layer Hybrid PCB 0.508mm RO4350B+ Tg170 FR-4 finished 0.98mm with ENIG PTH and blind vias using in Radar and Sensors

DK 3.48 4-layer Hybrid PCB 0.508mm RO4350B+ Tg170 FR-4 finished 0.98mm with ENIG PTH and blind vias using in Radar and Sensors

MOQ: 1PCS
Price: 0.99-99USD/PCS
Standard Packaging: Packing
Delivery Period: 2-10 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000pcs
Detail Information
Place of Origin
China
Brand Name
Rogers
Certification
ISO9001
Model Number
RO4350B and FR-4
Minimum Order Quantity:
1PCS
Price:
0.99-99USD/PCS
Packaging Details:
Packing
Delivery Time:
2-10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000pcs
Product Description

Our 4-Layer Hybrid PCB with RO4350B and FR-4

 

We are pleased to present our 4-layer hybrid PCB, which combines the superior electrical performance of Rogers RO4350B with the cost-effectiveness and manufacturability of FR-4. This PCB is designed for high-frequency applications requiring low signal loss, excellent thermal stability, and reliable multi-layer construction. Below, we provide a comprehensive overview of its construction, features, and applications.

 

DK 3.48 4-layer Hybrid PCB 0.508mm RO4350B+ Tg170 FR-4 finished  0.98mm with ENIG PTH and blind vias using in Radar and Sensors 0

 

PCB Construction Details

This hybrid PCB is engineered for precision and performance, utilizing a 0.508mm (20mil) RO4350B core and Tg170 FR-4 in a carefully optimized layer stackup. The detailed specifications are presented in the table below:

Parameter Specification
Base Material Rogers RO4350B + Tg170 FR-4
Layer Count 4-layer
Board Dimensions 80.22mm x 90mm ± 0.15mm
Minimum Trace/Space 4/6 mils
Minimum Hole Size 0.3mm
Blind/Buried Vias None
Finished Board Thickness 0.98mm
Copper Weight 0.5oz (0.7 mils) inner layers / 1oz outer layers
Via Plating Thickness 20μm
Surface Finish Immersion Gold
Top Solder Mask Green
Bottom Solder Mask Green
Top Silkscreen White
Bottom Silkscreen White
Electrical Testing 100% tested prior to shipment
Quality Standard IPC-Class-2

 

 

PCB Stackup

Layer Material Thickness
Copper Layer 1 Copper Foil 35μm
Core Material Rogers RO4350B Core 0.508mm (20mil)
Copper Layer 2 Copper Foil 18μm
Prepreg FR-4 Prepreg 0.2mm
Copper Layer 3 Copper Foil 18μm
Core Material Tg170 FR-4 Core 0.102mm (4mil)
Copper Layer 4 Copper Foil 35μm

The combination of RO4350B and FR-4 ensures that this PCB offers both high-frequency performance and cost efficiency while maintaining excellent thermal and mechanical stability.

 

PCB Statistics

Parameter Value
Components 26
Total Pads 59
Thru Hole Pads 37
Top SMT Pads 22
Bottom SMT Pads 0
Vias 125
Nets 10
Supplied Artwork Gerber RS-274-X

 

 

About Rogers RO4350B Material

The Rogers RO4350B material is a woven glass-reinforced hydrocarbon/ceramic laminate that provides PTFE-like electrical performance and FR-4-like manufacturability. It is a proven choice for multi-layer board (MLB) constructions, offering tight control of the dielectric constant (Dk), low loss, and excellent dimensional stability.

 

Key Features of RO4350B:

  • Dielectric Constant (Dk): 3.48 ± 0.05 at 10GHz/23°C.
  • Dissipation Factor (Df): 0.0037 at 10GHz/23°C.
  • Thermal Conductivity: 0.69 W/m/°K.
  • Coefficient of Thermal Expansion (CTE): X-axis: 10 ppm/°C. Y-axis: 12 ppm/°C. Z-axis: 32 ppm/°C.
  • High Glass Transition Temperature (Tg): >280°C.
  • Low Water Absorption: 0.06%.
  • Flammability: UL 94 V-0 rated.

 

 

Benefits of the Hybrid PCB

 

High-Frequency Performance:
The RO4350B core ensures low signal loss, tight Dk control, and excellent thermal stability, making it ideal for RF and microwave applications.

 

Cost-Effective Construction:
By combining RO4350B with FR-4, this hybrid PCB offers high performance at a fraction of the cost of full PTFE-based boards.

 

Dimensional Stability:
The material's thermal coefficient of expansion (CTE) is closely matched to copper, ensuring reliable plated-through-hole (PTH) quality, even in extreme conditions.

 

Environmentally Friendly:
The PCB is UL 94 V-0 rated and complies with environmental standards, providing a safe and sustainable solution.

 

 

Applications

Cellular Base Station Antennas and Power Amplifiers 

RF Identification (RFID) Tags

Automotive Radar and Sensors 

Direct Broadcast Satellites (LNBs) 

 

Conclusion

The 4-layer hybrid PCB with RO4350B and FR-4(https://www.circuitboardpcbs.com/sale-12282168-4-layer-rf-circuit-board-on-rogers-60mil-ro4350b-and-10mil-ro4350b-with-back-drill-for-uhf-coupler.html) is an innovative solution for high-frequency applications requiring low loss, excellent dimensional stability, and cost efficiency. Its hybrid construction combines the best features of RO4350B and FR-4, making it ideal for industries such as telecommunications, automotive, and aerospace.

 

For more information or to place an order, contact us today. We are committed to delivering high-quality PCBs tailored to your specific needs!

 

Products
PRODUCTS DETAILS
DK 3.48 4-layer Hybrid PCB 0.508mm RO4350B+ Tg170 FR-4 finished 0.98mm with ENIG PTH and blind vias using in Radar and Sensors
MOQ: 1PCS
Price: 0.99-99USD/PCS
Standard Packaging: Packing
Delivery Period: 2-10 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000pcs
Detail Information
Place of Origin
China
Brand Name
Rogers
Certification
ISO9001
Model Number
RO4350B and FR-4
Minimum Order Quantity:
1PCS
Price:
0.99-99USD/PCS
Packaging Details:
Packing
Delivery Time:
2-10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000pcs
Product Description

Our 4-Layer Hybrid PCB with RO4350B and FR-4

 

We are pleased to present our 4-layer hybrid PCB, which combines the superior electrical performance of Rogers RO4350B with the cost-effectiveness and manufacturability of FR-4. This PCB is designed for high-frequency applications requiring low signal loss, excellent thermal stability, and reliable multi-layer construction. Below, we provide a comprehensive overview of its construction, features, and applications.

 

DK 3.48 4-layer Hybrid PCB 0.508mm RO4350B+ Tg170 FR-4 finished  0.98mm with ENIG PTH and blind vias using in Radar and Sensors 0

 

PCB Construction Details

This hybrid PCB is engineered for precision and performance, utilizing a 0.508mm (20mil) RO4350B core and Tg170 FR-4 in a carefully optimized layer stackup. The detailed specifications are presented in the table below:

Parameter Specification
Base Material Rogers RO4350B + Tg170 FR-4
Layer Count 4-layer
Board Dimensions 80.22mm x 90mm ± 0.15mm
Minimum Trace/Space 4/6 mils
Minimum Hole Size 0.3mm
Blind/Buried Vias None
Finished Board Thickness 0.98mm
Copper Weight 0.5oz (0.7 mils) inner layers / 1oz outer layers
Via Plating Thickness 20μm
Surface Finish Immersion Gold
Top Solder Mask Green
Bottom Solder Mask Green
Top Silkscreen White
Bottom Silkscreen White
Electrical Testing 100% tested prior to shipment
Quality Standard IPC-Class-2

 

 

PCB Stackup

Layer Material Thickness
Copper Layer 1 Copper Foil 35μm
Core Material Rogers RO4350B Core 0.508mm (20mil)
Copper Layer 2 Copper Foil 18μm
Prepreg FR-4 Prepreg 0.2mm
Copper Layer 3 Copper Foil 18μm
Core Material Tg170 FR-4 Core 0.102mm (4mil)
Copper Layer 4 Copper Foil 35μm

The combination of RO4350B and FR-4 ensures that this PCB offers both high-frequency performance and cost efficiency while maintaining excellent thermal and mechanical stability.

 

PCB Statistics

Parameter Value
Components 26
Total Pads 59
Thru Hole Pads 37
Top SMT Pads 22
Bottom SMT Pads 0
Vias 125
Nets 10
Supplied Artwork Gerber RS-274-X

 

 

About Rogers RO4350B Material

The Rogers RO4350B material is a woven glass-reinforced hydrocarbon/ceramic laminate that provides PTFE-like electrical performance and FR-4-like manufacturability. It is a proven choice for multi-layer board (MLB) constructions, offering tight control of the dielectric constant (Dk), low loss, and excellent dimensional stability.

 

Key Features of RO4350B:

  • Dielectric Constant (Dk): 3.48 ± 0.05 at 10GHz/23°C.
  • Dissipation Factor (Df): 0.0037 at 10GHz/23°C.
  • Thermal Conductivity: 0.69 W/m/°K.
  • Coefficient of Thermal Expansion (CTE): X-axis: 10 ppm/°C. Y-axis: 12 ppm/°C. Z-axis: 32 ppm/°C.
  • High Glass Transition Temperature (Tg): >280°C.
  • Low Water Absorption: 0.06%.
  • Flammability: UL 94 V-0 rated.

 

 

Benefits of the Hybrid PCB

 

High-Frequency Performance:
The RO4350B core ensures low signal loss, tight Dk control, and excellent thermal stability, making it ideal for RF and microwave applications.

 

Cost-Effective Construction:
By combining RO4350B with FR-4, this hybrid PCB offers high performance at a fraction of the cost of full PTFE-based boards.

 

Dimensional Stability:
The material's thermal coefficient of expansion (CTE) is closely matched to copper, ensuring reliable plated-through-hole (PTH) quality, even in extreme conditions.

 

Environmentally Friendly:
The PCB is UL 94 V-0 rated and complies with environmental standards, providing a safe and sustainable solution.

 

 

Applications

Cellular Base Station Antennas and Power Amplifiers 

RF Identification (RFID) Tags

Automotive Radar and Sensors 

Direct Broadcast Satellites (LNBs) 

 

Conclusion

The 4-layer hybrid PCB with RO4350B and FR-4(https://www.circuitboardpcbs.com/sale-12282168-4-layer-rf-circuit-board-on-rogers-60mil-ro4350b-and-10mil-ro4350b-with-back-drill-for-uhf-coupler.html) is an innovative solution for high-frequency applications requiring low loss, excellent dimensional stability, and cost efficiency. Its hybrid construction combines the best features of RO4350B and FR-4, making it ideal for industries such as telecommunications, automotive, and aerospace.

 

For more information or to place an order, contact us today. We are committed to delivering high-quality PCBs tailored to your specific needs!

 

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