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RO4533 PCB For Antenna High Frequency PCB 30mil Rogers 4533 PCB Double Layer ENIG Circuit Board

RO4533 PCB For Antenna High Frequency PCB 30mil Rogers 4533 PCB Double Layer ENIG Circuit Board

MOQ: 1PCS
Price: 0.99-99USD/PCS
Standard Packaging: Packing
Delivery Period: 2-10 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000pcs
Detail Information
Place of Origin
China
Brand Name
Rogers
Certification
ISO9001
Model Number
RO4533
Minimum Order Quantity:
1PCS
Price:
0.99-99USD/PCS
Packaging Details:
Packing
Delivery Time:
2-10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000pcs
Product Description

We proudly present our 2-layer PCB, constructed with Rogers RO4533 laminate(https://www.circuitboardpcbs.com/sale-14172071-ro4533-pcb-for-antenna-high-frequency-pcb-60mil-rogers-4533-pcb-double-layer-immersion-gold-circuit-.html), a high-performance material designed for mobile infrastructure and RF applications. With its low dielectric constant, low loss performance, and excellent passive intermodulation (PIM) response, this PCB is ideal for applications like cellular base station antennas and WiMAX antenna networks.
 
RO4533 PCB For Antenna High Frequency PCB 30mil Rogers 4533 PCB Double Layer ENIG Circuit Board 0
 
PCB Construction Details
This PCB is meticulously engineered to meet the demands of high-frequency and high-reliability applications. Below are the detailed construction specifications:

ParameterSpecification
Base MaterialRogers RO4533
Layer Count2 layers
Board Dimensions46.95mm x 53.13mm ± 0.15mm
Minimum Trace/Space4/5 mils
Minimum Hole Size0.4mm
Blind/Buried ViasNone
Finished Board Thickness0.8mm
Copper Weight1oz (1.4 mils) outer layers
Via Plating Thickness20μm
Surface FinishENEPIG (Electroless Nickel Electroless Palladium and Immersion Gold)
Top Solder MaskGreen
Bottom Solder MaskNone
Top SilkscreenWhite
Bottom SilkscreenNone
Electrical Testing100% tested prior to shipment
Quality StandardIPC-Class-2

 
PCB Stackup
The RO4533 core, with its 30mil thickness (0.762mm), provides low loss, dimensional stability, and thermal reliability for high-frequency applications. The PCB's stackup is as follows:

LayerMaterialThickness
Copper Layer 1Copper Foil35μm (1oz)
Core MaterialRogers RO4533 Core0.762mm (30mil)
Copper Layer 2Copper Foil35μm (1oz)

 
 
PCB Statistics
This PCB is optimized for compact, high-performance designs with the following specifications:

ParameterValue
Components20
Total Pads46
Thru Hole Pads22
Top SMT Pads24
Bottom SMT Pads0
Vias19
Nets3
Supplied ArtworkGerber RS-274-X

 
 
About Rogers RO4533 Material
The Rogers RO4533 laminate is a ceramic-filled, glass-reinforced hydrocarbon-based material, offering low dielectric loss, low passive intermodulation (PIM), and excellent dimensional stability. It is specifically developed for mobile infrastructure applications, providing the performance of PTFE laminates with the ease of manufacturability of standard FR-4 materials.
 
 
Key Features of RO4533:

  • Dielectric Constant (Dk): 3.3 at 10 GHz, ensuring stable and consistent performance at high frequencies.
  • Dissipation Factor (Df): 0.0025 at 10 GHz, minimizing signal loss for optimal performance.
  • Thermal Conductivity: 0.6 W/mK, supporting effective heat dissipation.
  • Coefficient of Thermal Expansion (CTE): X-axis: 13 ppm/°C. Y-axis: 11 ppm/°C. Z-axis: 37 ppm/°C.
  • Glass Transition Temperature (Tg): >280°C, ensuring stability during high-temperature processing.
  • Moisture Absorption: 0.02%, providing excellent performance in humid environments.

 
The RO4533 laminate is compatible with standard PCB fabrication processes, making it a cost-effective alternative to conventional PTFE materials.
 
 
Applications
This PCB, built with Rogers RO4533, is ideal for a wide range of RF and microwave applications, including:

  • Cellular Infrastructure Base Station Antennas 
  • WiMAX Antenna Networks
  • Automotive Radar and Sensors 
  • Power Amplifiers

 
 
Conclusion
The 2-layer PCB with Rogers RO4533 core is the perfect solution for RF and microwave applications requiring low loss, thermal reliability, and dimensional stability. Its advanced material properties and ease of manufacturability make it an excellent choice for industries such as telecommunications, automotive, aerospace, and wireless networking.
 
For more information or to request a quote, contact us today. We are dedicated to delivering high-quality PCBs tailored to your specific requirements!
 

products
PRODUCTS DETAILS
RO4533 PCB For Antenna High Frequency PCB 30mil Rogers 4533 PCB Double Layer ENIG Circuit Board
MOQ: 1PCS
Price: 0.99-99USD/PCS
Standard Packaging: Packing
Delivery Period: 2-10 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000pcs
Detail Information
Place of Origin
China
Brand Name
Rogers
Certification
ISO9001
Model Number
RO4533
Minimum Order Quantity:
1PCS
Price:
0.99-99USD/PCS
Packaging Details:
Packing
Delivery Time:
2-10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000pcs
Product Description

We proudly present our 2-layer PCB, constructed with Rogers RO4533 laminate(https://www.circuitboardpcbs.com/sale-14172071-ro4533-pcb-for-antenna-high-frequency-pcb-60mil-rogers-4533-pcb-double-layer-immersion-gold-circuit-.html), a high-performance material designed for mobile infrastructure and RF applications. With its low dielectric constant, low loss performance, and excellent passive intermodulation (PIM) response, this PCB is ideal for applications like cellular base station antennas and WiMAX antenna networks.
 
RO4533 PCB For Antenna High Frequency PCB 30mil Rogers 4533 PCB Double Layer ENIG Circuit Board 0
 
PCB Construction Details
This PCB is meticulously engineered to meet the demands of high-frequency and high-reliability applications. Below are the detailed construction specifications:

ParameterSpecification
Base MaterialRogers RO4533
Layer Count2 layers
Board Dimensions46.95mm x 53.13mm ± 0.15mm
Minimum Trace/Space4/5 mils
Minimum Hole Size0.4mm
Blind/Buried ViasNone
Finished Board Thickness0.8mm
Copper Weight1oz (1.4 mils) outer layers
Via Plating Thickness20μm
Surface FinishENEPIG (Electroless Nickel Electroless Palladium and Immersion Gold)
Top Solder MaskGreen
Bottom Solder MaskNone
Top SilkscreenWhite
Bottom SilkscreenNone
Electrical Testing100% tested prior to shipment
Quality StandardIPC-Class-2

 
PCB Stackup
The RO4533 core, with its 30mil thickness (0.762mm), provides low loss, dimensional stability, and thermal reliability for high-frequency applications. The PCB's stackup is as follows:

LayerMaterialThickness
Copper Layer 1Copper Foil35μm (1oz)
Core MaterialRogers RO4533 Core0.762mm (30mil)
Copper Layer 2Copper Foil35μm (1oz)

 
 
PCB Statistics
This PCB is optimized for compact, high-performance designs with the following specifications:

ParameterValue
Components20
Total Pads46
Thru Hole Pads22
Top SMT Pads24
Bottom SMT Pads0
Vias19
Nets3
Supplied ArtworkGerber RS-274-X

 
 
About Rogers RO4533 Material
The Rogers RO4533 laminate is a ceramic-filled, glass-reinforced hydrocarbon-based material, offering low dielectric loss, low passive intermodulation (PIM), and excellent dimensional stability. It is specifically developed for mobile infrastructure applications, providing the performance of PTFE laminates with the ease of manufacturability of standard FR-4 materials.
 
 
Key Features of RO4533:

  • Dielectric Constant (Dk): 3.3 at 10 GHz, ensuring stable and consistent performance at high frequencies.
  • Dissipation Factor (Df): 0.0025 at 10 GHz, minimizing signal loss for optimal performance.
  • Thermal Conductivity: 0.6 W/mK, supporting effective heat dissipation.
  • Coefficient of Thermal Expansion (CTE): X-axis: 13 ppm/°C. Y-axis: 11 ppm/°C. Z-axis: 37 ppm/°C.
  • Glass Transition Temperature (Tg): >280°C, ensuring stability during high-temperature processing.
  • Moisture Absorption: 0.02%, providing excellent performance in humid environments.

 
The RO4533 laminate is compatible with standard PCB fabrication processes, making it a cost-effective alternative to conventional PTFE materials.
 
 
Applications
This PCB, built with Rogers RO4533, is ideal for a wide range of RF and microwave applications, including:

  • Cellular Infrastructure Base Station Antennas 
  • WiMAX Antenna Networks
  • Automotive Radar and Sensors 
  • Power Amplifiers

 
 
Conclusion
The 2-layer PCB with Rogers RO4533 core is the perfect solution for RF and microwave applications requiring low loss, thermal reliability, and dimensional stability. Its advanced material properties and ease of manufacturability make it an excellent choice for industries such as telecommunications, automotive, aerospace, and wireless networking.
 
For more information or to request a quote, contact us today. We are dedicated to delivering high-quality PCBs tailored to your specific requirements!
 

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