CuClad 250 Substarte Copper-Clad Laminate with 0.25mm 0.51mm 0.79mm 1.57mm for Military and RF Systems

CuClad® 250 Copper-Clad Laminate: The Isotropic, High-Stability Foundation for Advanced Military and RF Systems

We are proud to introduce the CuClad® 250, a premier cross-plied woven fiberglass/PTFE laminate engineered by Rogers Corporation for the most demanding high-frequency and precision microwave applications. Distinguished by its unique construction and superior mechanical stability, CuClad 250 is specifically designed for systems where electrical and mechanical isotropy, low loss, and dimensional predictability are non-negotiable, such as in advanced phased array antennas and mission-critical military electronics.

Stability and Uniformity

The defining feature of the CuClad series, and especially CuClad 250, is its cross-plied woven fiberglass reinforcement. Unlike standard laminates where all glass plies are aligned in the same direction, CuClad 250 alternates plies at 90-degree angles. This engineered structure creates true electrical and mechanical isotropy in the X-Y plane, meaning the material behaves identically regardless of the direction across the board. This unique property is critical for applications like phased array antennas, where consistent signal propagation and minimal pattern distortion across all elements are essential for beamforming accuracy.

Electrical Performance with Mechanical Properties
CuClad 250 utilizes a higher fiberglass-to-PTFE ratio within the series, striking an optimal balance between electrical performance and ruggedness.

Dielectric Constant (Dk): Ranges from 2.40 to 2.55 at 10 GHz, offering designers flexibility for impedance control.

Dissipation Factor (Df): A low 0.0017 at 10 GHz, ensuring minimal signal loss for filters, couplers, and low-noise amplifiers (LNAs).

Stability: Exhibits excellent stability of both Dk and Df over a wide frequency range, as shown in the datasheet graphs, simplifying design scaling.

Mechanical & Thermal Performance:

Dimensional Stability: The cross-plied construction and higher glass content provide exceptional dimensional stability, reducing movement during thermal processing and improving multilayer registration.

Thermal Management: Features a very favorable and low in-plane Coefficient of Thermal Expansion (CTE) of 18-19 ppm/°C (X and Y axes). This closely matches the CTE of copper, significantly reducing stress on plated through-holes (PTHs) and enhancing reliability in temperature-cycling environments typical of aerospace and defense applications.

Mechanical Strength: Boasts the highest tensile modulus (up to 725 kpsi) and compressive modulus (342 kpsi) in the CuClad series, providing a robust, rigid platform for mechanically challenging assemblies.

Proven Reliability for Severe Environments
CuClad 250 is built for high-reliability applications. It exhibits very low moisture absorption (0.03%), meets stringent NASA outgassing requirements, and carries a UL 94 V-0 flammability rating. These properties make it a trusted choice for space-qualified, airborne, and naval electronics.

Standard and Custom Configurations
The material is available with standard electrodeposited copper claddings (½, 1, or 2 oz.) and can be bonded to heavy metal ground planes (aluminum, brass, copper) for integrated heat sinking. For the most critical performance applications, CuClad 250 can be specified with an "LX" testing grade, where each sheet is individually tested and certified.

Application

1. Phased Array Radar and Antenna Systems
2. Electronic Warfare (ECM/ESM) and Military Radar Platforms
3. High-Frequency Filters, Couplers, and Hybrids
4. Low-Noise Amplifiers (LNAs) and other sensitive microwave components
5. Multilayer Boards requiring excellent Z-axis CTE (177 ppm/°C) and dimensional stability

Performance Analysis Summary:
CuClad 250 delivers a masterful balance. It sacrifices a minimal amount in dissipation factor compared to the ultra-low-loss CuClad 217 to gain substantial improvements in mechanical rigidity, dimensional stability, and thermal expansion matching. This trade-off is precisely targeted for applications where the mechanical and thermal environment is as challenging as the electrical requirements. For designers who cannot tolerate anisotropic behavior and need a substrate that performs predictably in all directions under stress, CuClad 250 offers a proven, high-performance solution.

Contact our technical sales team to discuss how CuClad 250's isotropic properties can enhance your next design, request detailed test data, or inquire about the "LX" certified material option.