RT/duroid® 5880 Copper-Clad Laminate 0.127mm 0.252mm 0.508mm 0.787mm 1.575mm thickness substrate for multilayer hybrid PCB

RT/duroid® 5880 Copper-Clad Laminate: The Benchmark for Low-Loss, High-Frequency Circuitry

RT/duroid® 5880 is a cornerstone high-frequency laminate from Rogers Corporation, renowned for its exceptional electrical performance and reliability in demanding RF and microwave applications. It is a glass microfiber-reinforced polytetrafluoroethylene (PTFE) composite specifically engineered for precision stripline and microstrip circuits. The key to its performance lies in the randomly oriented microfibers within the PTFE matrix, which provide outstanding uniformity of the dielectric constant (Dk) across the panel and over a wide frequency range. This inherent uniformity ensures predictable signal propagation and consistent electrical performance in complex, high-frequency designs.

The electrical specifications of RT/duroid 5880 are its defining strength. It features a low dielectric constant of 2.20 ± 0.02 (typical, at 10 GHz), which is crucial for achieving desired impedance control and signal speed. More notably, it boasts an extremely low dissipation factor (Df) of 0.0009 at 10 GHz, one of the lowest in the industry. This ultra-low loss tangent translates to minimal signal attenuation, making it an ideal choice for sensitive, high-performance applications extending well into the Ku-band, Ka-band, and beyond. Its thermal coefficient of Dk is a low -125 ppm/°C, further enhancing electrical stability across temperature variations.

Mechanically, RT/duroid 5880 offers excellent machinability, allowing it to be easily cut, sheared, and shaped. It exhibits good dimensional stability and a very low moisture absorption rate of 0.02%, ensuring reliability in various environmental conditions. Its coefficient of thermal expansion (CTE) is anisotropic, with values of 31 ppm/°C (X-axis), 48 ppm/°C (Y-axis), and 237 ppm/°C (Z-axis), which is typical for reinforced materials and must be considered in multilayer designs. The laminate achieves a UL 94 V-0 flammability rating and is fully compatible with lead-free assembly processes.

Standard Specifications for the substrate:

Thicknesses: Offered in a wide range, including 0.005" (0.127 mm), 0.010" (0.252 mm), 0.020" (0.508 mm), 0.031" (0.787 mm), and 0.062" (1.575 mm), each with specified tight tolerances. Additional thicknesses from 0.0035" to 0.375" are available.

Panel Sizes: Commonly supplied in 18" x 12" (457 mm x 305 mm) and 18" x 24" (457 mm x 610 mm) panels, with other sizes available upon request.

Standard Claddings: Provides versatile cladding options. Standard offerings include electrodeposited copper foil in ½ oz (18µm) and 1 oz (35µm) weights, designated as HH/HH and *H1/H1*. For applications requiring superior electrical performance (lower conductor loss at high frequencies), rolled copper foil (½ oz *5R/5R*, 1 oz *1R/1R*) is available. Cladding with other metals like aluminum or brass can also be specified.

Key Property Benchmarks: The datasheet confirms robust mechanical strength with copper peel strength >5.5 pli (for 1 oz EDC), high volume resistivity (2x10⁷ MΩ·cm), and a density of 2.2 gm/cm³.

In summary, RT/duroid 5880 sets the industry standard for ultra-low loss PTFE-based laminates. Its unparalleled combination of a stable, low Dk, an exceptionally low dissipation factor, and proven processability makes it the material of choice for critical applications in satellite communications, point-to-point radio, aerospace, and defense systems where signal integrity and minimal loss are non-negotiable.