RO4730G3 2-Layer CCL 0.6mm Thick built for Hybrid, Multilayer PCB with ENIG Finish using in Cellular Base Station Antennas

RO4730G3 2-Layer PCB: 0.6mm Thick with ENIG Finish

The RO4730G3 2-layer PCB is a cost-effective and high-performance solution for antenna-grade applications. With its low-loss dielectric and lightweight properties, it is ideal for cellular base station antennas and other RF designs. The use of Electroless Nickel Immersion Gold (ENIG) ensures excellent solderability and durability.

Key Construction Details

Features of RO4730G3 Material

1. Dielectric Constant (Dk): 3.0 ± 0.05 at 10GHz for low-loss performance.
2. Dissipation Factor (Df): 0.0028 at 10GHz for minimal signal loss.
3. Thermal Conductivity: 0.45W/mK for effective heat dissipation.
4. Thermal Coefficient of Dk: 34 ppm/°C for consistent circuit performance.
5. Coefficient of Thermal Expansion (CTE): X-axis: 15.9 ppm/°C, Y-axis: 14.4 ppm/°C, Z-axis: 35.2 ppm/°C
6. High Tg: >280°C for thermal reliability.
7. Decomposition Temperature (Td): 411°C for excellent durability.

Why Choose RO4730G3 PCB?

Cost-Effective: Affordable alternative to PTFE-based laminates with similar performance.

High-Frequency Stability: Ensures minimal signal loss and reliable operation.

Easy Manufacturing: Compatible with standard processing methods, reducing costs and complexity.

Lightweight and Durable: Perfect for high-performance, weight-sensitive designs.

The RO4730G3 2-layer PCB is the ideal choice for antenna-grade and RF applications, offering excellent performance, lightweight design, and cost efficiency. Contact us today to learn more!