MOQ: | 1PCS |
Price: | 2.99USD/pcs |
Standard Packaging: | Packing |
Delivery Period: | 2-10 working days |
Payment Method: | T/T, Paypal |
Supply Capacity: | 50000pcs |
F4BTMS255 2-Layer PCB: 60mil Thick, Immersion Gold Finish
The F4BTMS255 PCB is a high-performance 2-layer rigid PCB, designed for aerospace, RF, and microwave applications. Engineered with F4BTMS255 material, this PCB delivers low dielectric loss, dimensional stability, and broad frequency range compatibility. Its ceramic-enhanced formulation and reinforced glass fiber construction make it ideal for high-reliability applications, including satellite communication, radar systems, and phased array antennas.
Key Construction Details
Parameter | Specification |
Base Material | F4BTMS255 |
Layer Count | 2 layers |
Board Dimensions | 87mm x 80mm |
Minimum Trace/Space | 5/7 mils |
Minimum Hole Size | 0.3mm |
Blind Vias | None |
Finished Thickness | 1.6mm |
Copper Weight | 1oz (1.4 mils) |
Via Plating Thickness | 20 μm |
Surface Finish | Immersion Gold (ENIG) |
Top Silkscreen | White |
Bottom Silkscreen | None |
Top Solder Mask | None |
Bottom Solder Mask | None |
Electrical Testing | 100% tested before shipment |
Features of F4BTMS255
Dielectric Constant (Dk): 2.55 ± 0.04 at 10GHz.
Dissipation Factor (Df): 0.0012 at 10GHz, 0.0013 at 20GHz.
CTE (Coefficient of Thermal Expansion): X-axis: 15 ppm/°C. Y-axis: 20 ppm/°C. Z-axis: 80 ppm/°C.
Low Thermal Coefficient of Dk: -92 ppm/°C, ensuring stability over a wide temperature range (-55°C to 150°C).
Moisture Absorption: Extremely low at 0.025%.
High Thermal Resistance: Stable up to 288°C, with UL-94 V0 flammability certification.
RTF Low-Roughness Copper Foil: Reduces conductor loss while improving peel strength.
Benefits of F4BTMS255 PCBs
The low Dk and Df values minimize dielectric loss, ensuring high-frequency performance for RF and microwave applications.
The low CTE and excellent thermal conductivity ensure dimensional reliability, even under extreme temperatures or thermal cycling.
With moisture absorption at just 0.025%, this PCB maintains performance in harsh environments, making it suitable for aerospace and military applications.
The ceramic-enriched material reduces the negative effects of glass fiber, improving electromagnetic wave propagation and minimizing anisotropy.
Compatible with standard PCB fabrication processes, the F4BTMS255 reduces production complexity and cost.
Applications of F4BTMS255 PCBs
Spacecraft systems, cabin electronics, and radar systems.
High-frequency circuits for communication and signal transmission.
High-reliability radar systems for defense applications.
Precision feed networks and phase-sensitive designs.
Stable, high-performance circuits for satellite links and signal processing.
Why Choose F4BTMS255 PCBs?
The F4BTMS255 2-layer PCB is the perfect solution for engineers seeking low-loss, high-frequency materials for critical applications. Its unique combination of ceramic-enhanced PTFE, low moisture absorption, and thermal stability makes it a reliable and cost-effective choice for aerospace, RF, and military systems.
Key Advantages at a Glance
Excellent signal integrity for RF and microwave designs.
High thermal resistance and stability under extreme conditions.
Low dielectric loss for minimal signal distortion.
Durable and reliable, even in harsh environments.
The F4BTMS255 PCB is a cutting-edge solution for aerospace, RF, and high-frequency applications. With its low Dk and Df, thermal reliability, and dimensional stability, this PCB ensures top-tier performance in critical applications like radar, antennas, and satellite communication systems.
If you’re looking for a reliable, high-performance PCB material for your next project, the F4BTMS255 PCB is your answer. Contact us today to learn more or to place your order!
MOQ: | 1PCS |
Price: | 2.99USD/pcs |
Standard Packaging: | Packing |
Delivery Period: | 2-10 working days |
Payment Method: | T/T, Paypal |
Supply Capacity: | 50000pcs |
F4BTMS255 2-Layer PCB: 60mil Thick, Immersion Gold Finish
The F4BTMS255 PCB is a high-performance 2-layer rigid PCB, designed for aerospace, RF, and microwave applications. Engineered with F4BTMS255 material, this PCB delivers low dielectric loss, dimensional stability, and broad frequency range compatibility. Its ceramic-enhanced formulation and reinforced glass fiber construction make it ideal for high-reliability applications, including satellite communication, radar systems, and phased array antennas.
Key Construction Details
Parameter | Specification |
Base Material | F4BTMS255 |
Layer Count | 2 layers |
Board Dimensions | 87mm x 80mm |
Minimum Trace/Space | 5/7 mils |
Minimum Hole Size | 0.3mm |
Blind Vias | None |
Finished Thickness | 1.6mm |
Copper Weight | 1oz (1.4 mils) |
Via Plating Thickness | 20 μm |
Surface Finish | Immersion Gold (ENIG) |
Top Silkscreen | White |
Bottom Silkscreen | None |
Top Solder Mask | None |
Bottom Solder Mask | None |
Electrical Testing | 100% tested before shipment |
Features of F4BTMS255
Dielectric Constant (Dk): 2.55 ± 0.04 at 10GHz.
Dissipation Factor (Df): 0.0012 at 10GHz, 0.0013 at 20GHz.
CTE (Coefficient of Thermal Expansion): X-axis: 15 ppm/°C. Y-axis: 20 ppm/°C. Z-axis: 80 ppm/°C.
Low Thermal Coefficient of Dk: -92 ppm/°C, ensuring stability over a wide temperature range (-55°C to 150°C).
Moisture Absorption: Extremely low at 0.025%.
High Thermal Resistance: Stable up to 288°C, with UL-94 V0 flammability certification.
RTF Low-Roughness Copper Foil: Reduces conductor loss while improving peel strength.
Benefits of F4BTMS255 PCBs
The low Dk and Df values minimize dielectric loss, ensuring high-frequency performance for RF and microwave applications.
The low CTE and excellent thermal conductivity ensure dimensional reliability, even under extreme temperatures or thermal cycling.
With moisture absorption at just 0.025%, this PCB maintains performance in harsh environments, making it suitable for aerospace and military applications.
The ceramic-enriched material reduces the negative effects of glass fiber, improving electromagnetic wave propagation and minimizing anisotropy.
Compatible with standard PCB fabrication processes, the F4BTMS255 reduces production complexity and cost.
Applications of F4BTMS255 PCBs
Spacecraft systems, cabin electronics, and radar systems.
High-frequency circuits for communication and signal transmission.
High-reliability radar systems for defense applications.
Precision feed networks and phase-sensitive designs.
Stable, high-performance circuits for satellite links and signal processing.
Why Choose F4BTMS255 PCBs?
The F4BTMS255 2-layer PCB is the perfect solution for engineers seeking low-loss, high-frequency materials for critical applications. Its unique combination of ceramic-enhanced PTFE, low moisture absorption, and thermal stability makes it a reliable and cost-effective choice for aerospace, RF, and military systems.
Key Advantages at a Glance
Excellent signal integrity for RF and microwave designs.
High thermal resistance and stability under extreme conditions.
Low dielectric loss for minimal signal distortion.
Durable and reliable, even in harsh environments.
The F4BTMS255 PCB is a cutting-edge solution for aerospace, RF, and high-frequency applications. With its low Dk and Df, thermal reliability, and dimensional stability, this PCB ensures top-tier performance in critical applications like radar, antennas, and satellite communication systems.
If you’re looking for a reliable, high-performance PCB material for your next project, the F4BTMS255 PCB is your answer. Contact us today to learn more or to place your order!