Copper Coin Embedded 6-Layer Hybrid PCB: M6 and IT180 for High-Performance Applications

Copper Coin Embedded 6-Layer Hybrid PCB: M6 and IT180 for High-Performance Applications

At the forefront of advanced PCB technology, our Copper Coin Embedded 6-Layer Hybrid PCB is designed to meet the rigorous demands of high-speed communication, automotive electronics, and aerospace applications. Utilizing a hybrid construction of M6 high-speed material and IT180 High Tg FR-4, this PCB delivers exceptional thermal performance, signal integrity, and mechanical reliability.

Whether it’s 5G base stations, millimeter-wave radar systems, or advanced aerospace electronics, this PCB is engineered to excel in high-frequency and high-power environments. Here’s an in-depth look at its construction, features, and applications.

Key Construction Details

This IPC-Class-2 compliant PCB undergoes a 100% electrical test prior to shipment, ensuring reliability and quality.

PCB Stackup

Features of the Copper Coin Embedded PCB

1. Copper Coin Embedded for Thermal Management

A copper coin is embedded in the center of the PCB to absorb and dissipate heat efficiently. This feature is critical for high-power applications such as automotive radar and 5G base stations, where thermal management is crucial to ensure long-term reliability.

2. High-Speed M6 Material

Dielectric Constant (Dk): 3.4 at 1GHz and 3.34 at 13GHz for low signal distortion.

Dissipation Factor (Df): Extremely low at 0.002 (1GHz) and 0.0037 (13GHz), ensuring minimal signal loss.

High Thermal Decomposition Temperature (Td): 410°C for stability under extreme heat.

Compatibility with FR-4 Processing: Simplifies manufacturing and reduces costs.

3. Thermal and Mechanical Stability from IT180

Tg >185°C for thermal stability.

Dielectric Constant (Dk): 4.17, ideal for mixed-signal designs.

CTE (Coefficient of Thermal Expansion): Z-axis CTE of 45ppm/°C ensures plated-through hole reliability.

4. Resin-Filled and Capped Vias

All vias are resin-filled and capped, improving structural integrity and preventing solder wicking, making the PCB suitable for high-density interconnects.

Applications of the Copper Coin Embedded PCB

Millimeter-wave antennas and RF front-ends for AAUs (Active Antenna Units).

77GHz millimeter-wave radar and ADAS (Advanced Driver Assistance Systems).

High-speed data transmission for routers, servers, and switches.

High-reliability circuits for avionics and radar systems.

Why Choose This PCB?

Our Copper Coin Embedded 6-Layer PCB is the ultimate solution for designers looking to balance high performance, thermal efficiency, and cost-effectiveness.

Here’s why it stands out:

Exceptional Thermal Management: The copper coin ensures heat dissipation in high-power circuits.

High-Frequency Performance: M6 material minimizes signal loss, making it perfect for RF and millimeter-wave designs.

Durability: Resin-filled vias and hybrid stackup enhance reliability in harsh environments.

Cost-Effective Manufacturing: Compatible with standard FR-4 processes, reducing production costs.

Conclusion

The Copper Coin Embedded 6-Layer Hybrid PCB combines the best of M6 high-speed material and IT180 High Tg FR-4, delivering unmatched performance, thermal stability, and reliability. Whether you're designing for 5G infrastructure, automotive radar, or aerospace systems, this PCB is built to meet your most demanding requirements.

Ready to take your designs to the next level? Contact us today to learn more about how this innovative PCB can power your next-generation applications!