High-Performance 6-Layer RO4350B PCB: Exceptional Stability and Reliability for High-Frequency Designs

High-Frequency Designs Elevated with Rogers' RO4350B PCB

The next level of performance in high-frequency electronics can be unlocked with the exceptional 6-layer RO4350B PCB. This cutting-edge solution, engineered with Rogers' renowned material, is designed to power the most demanding applications, from cellular base station antennas to automotive radar systems.

At the core of this PCB is the RO4350B laminate, a proprietary woven glass-reinforced hydrocarbon/ceramic that offers unparalleled electrical and mechanical stability. With a tight dielectric constant (Dk) of 3.48 ± 0.05 at 10GHz and a remarkably low dissipation factor of 0.0037, this material is engineered to deliver exceptional signal integrity and high-frequency performance.

Boasting a compact 110mm x 80mm footprint with a tight tolerance of ±0.15mm, this robust 6-layer PCB features a finished board thickness of 1.6mm and 1oz (1.4 mils) copper weight on the inner and outer layers. The PCB's impressive specifications include a minimum trace/space of 4/4 mils, minimum hole size of 0.3mm, and Electroless Nickel Immersion Gold (ENIG) surface finish for superior solderability.

Engineered for seamless integration, the RO4350B PCB is equipped with blind vias from layers 1-4 and 5-6, ensuring reliable plated through-hole quality even in the most demanding thermal shock applications. Manufactured to the stringent IPC-Class-2 standard and subjected to 100% electrical testing, this solution is designed to exceed industry expectations.

Whether the focus is on cellular base station antennas, RF identification tags, automotive radar, or direct broadcast satellite LNBs, the RO4350B PCB is engineered to elevate high-frequency designs. Its balanced coefficient of thermal expansion (CTE), matched to copper, ensures dimensional stability and reliable performance, even in challenging environments.

This exceptional RO4350B PCB solution, with worldwide availability, unlocks the boundless potential of next-generation high-frequency electronics and is easily accessible to customers across the globe.