TSM-DS3 PCB 2-layer - 0.508 mm (20 mil) | Copper_layer - 1oz (35µm), 2oz (70µm) with Immersion Silver

Introducing TSM-DS3 PCB: A High-Performance Solution for Demanding Applications

TSM-DS3, a cutting-edge ceramic-filled reinforced material with a mere 5% fiberglass content, has emerged as a game-changer in the realm of advanced circuit board manufacturing. This material, which competes head-to-head with traditional epoxies, excels in fabricating large format complex multilayers with unparalleled precision and reliability.

Q: What sets TSM-DS3 apart from traditional epoxy materials in circuit board manufacturing?
A: TSM-DS3 boasts a remarkably low dissipation factor of 0.0011 at 10 GHz, setting a new standard in the industry. Its high thermal conductivity of 0.65 W/m*K effectively dissipates heat away from critical components within a printed wiring board (PWB) design. Additionally, TSM-DS3 showcases minimal coefficients of thermal expansion, ensuring optimal performance in environments with demanding thermal cycling requirements.

TSM-DS3 Typical Values

Q: What are the key features of TSM-DS3 that make it an ideal choice for high-power applications?
A: The dielectric constant of 3.0 with tight tolerances, a dissipation factor of 0.0014 at 10 GHz, and a high thermal conductivity of 0.65 W/MK (unclad) are some of the standout features of TSM-DS3. Moreover, its low moisture absorption rate and matched copper coefficient of thermal expansion in all axes enhance its suitability for high-power applications.

Q: How does TSM-DS3 facilitate the construction of complex PCBs with consistency and predictability?
A: With a low fiberglass content (~5%) and dimensional stability rivaling epoxy materials, TSM-DS3 enables the production of large format high layer count PCBs with ease. This material's compatibility with resistive foils and temperature stability across a wide range further contribute to its ability to build complex PCBs with reliability and consistency.

The Benefits of TSM-DS3 are Multifold:

• Low fiberglass content (~5%) for enhanced performance
• Dimensional stability that rivals epoxy materials
• Facilitates the production of large format high layer count PCBs
• Enables the construction of complex PCBs with consistency and predictability
• Temperature stability with a dielectric constant variation of ± 0.25% across a wide temperature range
• Compatibility with resistive foils for diverse applications

PCB Capability TSM-DS3

Q: What are some typical applications of TSM-DS3 PCBs?

A: TSM-DS3 PCBs find applications in couplers, phased array antennas, radar manifolds, mmWave antenna/automotive systems, oil drilling equipment, and semiconductor/ATE testing environments.

In conclusion, TSM-DS3 PCBs represent a groundbreaking advancement in circuit board technology, offering unmatched performance and reliability for a wide range of high-power applications. With its exceptional characteristics and versatile applications, TSM-DS3 is poised to revolutionize the electronics industry worldwide.