RO4350B + RO4450F 6-Layer RF PCB with 1.8mm Thickness: A High-Performance Solution by Bicheng Technologies Limited

RO4350B + RO4450F 6-Layer RF PCB with 1.8mm Thickness: A High-Performance Solution by Bicheng Technologies Limited

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

At Bicheng Technologies Limited, we are excited to offer our RO4350B + RO4450F 6-Layer RF PCB, a cutting-edge product designed for high-frequency RF and microwave applications. This PCB combines the low dielectric loss and thermal stability of Rogers RO4350B laminates with the sequential lamination compatibility of RO4450F bondply, making it an excellent choice for multi-layer RF designs.

This 1.8mm PCB features blind vias, immersion gold finish, and 6-layer stackup, ensuring precision, reliability, and cost-efficiency for cellular base stations, automotive radar systems, and satellite communication devices. Let me guide you through the construction, features, and applications of this high-performance PCB.

1. Overview of the RO4350B + RO4450F 6-Layer RF PCB

The RO4350B + RO4450F 6-Layer RF PCB is a rigid PCB solution that combines high-frequency performance with mechanical durability for demanding RF and microwave applications. RO4350B laminates offer tight Dk tolerance, low dissipation factor, and excellent thermal conductivity, making them ideal for high-power RF circuits. Meanwhile, RO4450F bondply enhances the PCB’s construction with multi-lamination compatibility, dimensional stability, and ease of processing.

At Bicheng Technologies Limited, we ensure that every PCB meets IPC-Class-2 standards and undergoes 100% electrical testing to guarantee its quality and reliability.

PCB Construction Details

Below is an overview of the construction specifications for this 6-layer RF PCB:

This 6-layer stackup, with blind vias and precise lamination techniques, ensures low signal loss, thermal reliability, and mechanical stability for complex RF circuit designs.

2. Features and Advantages of RO4350B and RO4450F Materials

This PCB’s performance is driven by the unique properties of RO4350B laminates and RO4450F bondply, both of which are manufactured by Rogers Corporation. Together, these materials deliver high-frequency stability, thermal efficiency, and mechanical durability, making this PCB ideal for advanced RF systems.

Features of RO4350B Laminates:

• Dielectric Constant (Dk): 3.48 ± 0.05 at 10GHz, ensuring stable signal propagation over a wide range of frequencies.
• Dissipation Factor (Df): 0.0037 at 10GHz, minimizing signal loss and improving efficiency.
• Thermal Conductivity: 0.69 W/m/K, ensuring efficient heat dissipation in high-power applications.
• Thermal and Dimensional Stability:
  • X-axis CTE: 10 ppm/°C
  • Y-axis CTE: 12 ppm/°C
  • Z-axis CTE: 32 ppm/°C, ensuring compatibility with copper and reducing the risk of delamination.
• Moisture Resistance: Low water absorption of 0.06%, ensuring reliability in humid environments.

Features of RO4450F Bondply:

• Dielectric Constant (Dk): 3.52 ± 0.05 at 10GHz, providing consistent performance in multi-layer constructions.
• Dissipation Factor (Df): 0.004 at 10GHz, offering low signal loss for high-frequency circuits.
• Thermal Conductivity: 0.65 W/m/K, enabling reliable thermal management.
• Lamination Compatibility: High Tg and low flow characteristics make RO4450F ideal for sequential laminations in complex PCB designs.

3. Key Advantages of the RO4350B + RO4450F PCB

This hybrid PCB offers a range of benefits for engineers designing high-frequency circuits and RF systems:

Performance Optimization

• Signal Integrity: RO4350B ensures low signal loss, tight impedance control, and stable performance in RF circuits.
• Multi-Layer Precision: RO4450F bondply enables complex multi-layer stackups with enhanced dimensional stability.
• Thermal Management and Reliability
• High Power Handling: The combination of RO4350B and RO4450F provides excellent thermal conductivity and heat dissipation.
• Dimensional Stability: Low CTE values ensure structural integrity and minimize thermal stress during operation.
• Cost and Manufacturing Efficiency
• Standard Processing: RO4350B and RO4450F are compatible with standard FR-4 fabrication processes, reducing production costs.
• Sequential Lamination: RO4450F bondply supports multiple lamination cycles, simplifying manufacturing for complex designs.

4. Applications of the RO4350B + RO4450F 6-Layer RF PCB

1. The RO4350B + RO4450F 6-Layer RF PCB is designed for industries that demand high-frequency stability, low signal loss, and thermal reliability. Its versatile design makes it suitable for a wide range of applications:
2. Typical Applications:
3. Cellular Base Station Antennas and Power Amplifiers.
4. RF Identification Tags (RFID)
5. Automotive Radar and Sensors
6. LNBs for Direct Broadcast Satellites

5. Why Choose Bicheng Technologies Limited?

At Bicheng Technologies Limited, we are committed to providing innovative PCB solutions for high-frequency and RF applications. The RO4350B + RO4450F 6-Layer RF PCB exemplifies our dedication to performance, reliability, and cost efficiency.

Our Strengths:

Precision Manufacturing: All PCBs are manufactured to IPC-Class-2 standards and undergo 100% electrical testing.

Global Availability: We deliver our products worldwide, ensuring timely support for your projects.

Expert Support: Our team of professionals is here to provide technical assistance and guidance tailored to your needs.

For any inquiries or technical questions, feel free to contact me, Sally, at sales30@bichengpcb.com. I’d be delighted to assist you in finding the perfect PCB solution for your application.