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F4BM220 PCB 2-layer 1.0mm Thick with 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) coated plating with Immersion tin

F4BM220 PCB 2-layer 1.0mm Thick with 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) coated plating with Immersion tin

Detail Information
Product Description

Exploring the Versatility of F4BM220 PCBs

 

Introduction:
F4BM220 PCBs are highly specialized circuit boards that offer enhanced electrical performance and reliability for a variety of applications. In this article, we will delve into the key features, construction details, applications, and benefits of F4BM220 PCBs, providing a comprehensive guide for beginners.

 

Key Features of F4BM220 PCBs:

  • Made from a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film.
  • Improved insulation resistance and stability compared to traditional materials.
  • Low dielectric loss for optimal signal transmission and reduced interference.
  • High dielectric constant of 2.2 at 10GHz for reliable performance in high-frequency applications.

 

Construction and Specifications:

  • Core thickness of 1.00mm with copper layers on both sides.
  • Finished thickness of 1.1mm with 1oz copper weight on outer layers.
  • Plated with immersion tin for enhanced solderability.
  • Green solder mask for additional protection.
  • Adherence to IPC-Class-2 quality standards with 100% electrical testing prior to shipment.

 

 

PCB Capability (F4BME)
PCB Material: PTFE glass fiber cloth copper clad laminates
Designation (F4BME ) F4BME DK (10GHz) DF (10 GHz)
F4BME217 2.17±0.04 0.0010
F4BME220 2.20±0.04 0.0010
F4BME233 2.33±0.04 0.0011
F4BME245 2.45±0.05 0.0012
F4BME255 2.55±0.05 0.0013
F4BME265 2.65±0.05 0.0013
F4BME275 2.75±0.05 0.0015
F4BME294 2.94±0.06 0.0016
F4BME300 3.00±0.06 0.0017
Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (or overall thickness) 0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

 

 

Applications of F4BM220 PCBs:

  • Versatile design suitable for microwave, RF, and radar systems.
  • Ideal for power dividers, phase shifters, feed networks, and satellite communications.
  • Offers flexibility with 10 components and 34 pads for diverse circuit configurations.

 

Conclusion:
F4BM220 PCBs stand out as a reliable and versatile solution for high-frequency electronic applications, boasting low dielectric loss and high thermal stability. Their advanced construction and performance characteristics make them a valuable choice for electronic design projects, ensuring optimal functionality and durability.

For further information or technical inquiries regarding F4BM220 PCBs, please reach out to sales@bichengpcb.com.

products
PRODUCTS DETAILS
F4BM220 PCB 2-layer 1.0mm Thick with 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) coated plating with Immersion tin
Detail Information
Product Description

Exploring the Versatility of F4BM220 PCBs

 

Introduction:
F4BM220 PCBs are highly specialized circuit boards that offer enhanced electrical performance and reliability for a variety of applications. In this article, we will delve into the key features, construction details, applications, and benefits of F4BM220 PCBs, providing a comprehensive guide for beginners.

 

Key Features of F4BM220 PCBs:

  • Made from a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film.
  • Improved insulation resistance and stability compared to traditional materials.
  • Low dielectric loss for optimal signal transmission and reduced interference.
  • High dielectric constant of 2.2 at 10GHz for reliable performance in high-frequency applications.

 

Construction and Specifications:

  • Core thickness of 1.00mm with copper layers on both sides.
  • Finished thickness of 1.1mm with 1oz copper weight on outer layers.
  • Plated with immersion tin for enhanced solderability.
  • Green solder mask for additional protection.
  • Adherence to IPC-Class-2 quality standards with 100% electrical testing prior to shipment.

 

 

PCB Capability (F4BME)
PCB Material: PTFE glass fiber cloth copper clad laminates
Designation (F4BME ) F4BME DK (10GHz) DF (10 GHz)
F4BME217 2.17±0.04 0.0010
F4BME220 2.20±0.04 0.0010
F4BME233 2.33±0.04 0.0011
F4BME245 2.45±0.05 0.0012
F4BME255 2.55±0.05 0.0013
F4BME265 2.65±0.05 0.0013
F4BME275 2.75±0.05 0.0015
F4BME294 2.94±0.06 0.0016
F4BME300 3.00±0.06 0.0017
Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (or overall thickness) 0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

 

 

Applications of F4BM220 PCBs:

  • Versatile design suitable for microwave, RF, and radar systems.
  • Ideal for power dividers, phase shifters, feed networks, and satellite communications.
  • Offers flexibility with 10 components and 34 pads for diverse circuit configurations.

 

Conclusion:
F4BM220 PCBs stand out as a reliable and versatile solution for high-frequency electronic applications, boasting low dielectric loss and high thermal stability. Their advanced construction and performance characteristics make them a valuable choice for electronic design projects, ensuring optimal functionality and durability.

For further information or technical inquiries regarding F4BM220 PCBs, please reach out to sales@bichengpcb.com.

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