TC600 High-Performance Thermal Composite PCB 2-layer 30mil thick with ENIG

Introducing the TC600: The High-Performance Thermal Composite PCB

Introduction
Designing high-frequency, high-power electronic systems can be a challenging task, particularly when it comes to managing heat dissipation and maintaining signal integrity. That's where the TC600 woven fiberglass reinforced, ceramic filled, PTFE-based composite PCB substrate shines. Engineered to provide "Best-In-Class" thermal conductivity, the TC600 offers a unique solution for applications demanding enhanced heat transfer and low dielectric losses.

Features of the TC600 PCB Substrate

The TC600 stands out with its impressive specifications:

• Dielectric constant (Dk) of 6.15 at 1.8 MHz and 10 GHz/23°C
• Dissipation factor (Df) of 0.0017 and 0.0020 at 1.8 and 10 GHz/23°C respectively
• Temperature coefficient of Dk (TcDk) of -75 ppm/°C ranging from -40°C to 150°C
• Moisture absorption of only 0.03%
• CTE of 9 ppm/°C in the X and Y-axis, and 35 ppm/°C in the Z-axis
• Thermal conductivity of 1.1 W/mK in the Z-axis and 1.4 W/mK in the X and Y-axis

These exceptional material properties make the TC600 an ideal choice for high-frequency, high-power applications where heat dissipation and signal integrity are critical concerns.

Benefits of the TC600 PCB
The TC600 offers several key benefits that make it a standout choice for various electronic designs:

1. Heat Dissipation and Management: The impressive thermal conductivity of the TC600 helps to effectively dissipate heat, reducing hot spots and improving the reliability of active components.

2. High Efficiency: The low dielectric loss tangent of the TC600 contributes to higher amplifier and antenna efficiency, resulting in improved performance and energy savings.

3. Mechanical Robustness: The TC600 is more mechanically robust compared to traditional brittle laminates, making it better able to withstand processing, impact, and high G-forces.

4. Affordable Pricing: The TC600 is priced affordably for commercial applications, making it accessible for a wide range of electronic products.

5. Reliable Narrow Lines: The high peel strength of the TC600 enables the creation of reliable narrow traces, supporting the miniaturization of electronic designs.

Applications of the TC600 PCB
The TC600 PCB substrate is well-suited for a variety of high-frequency, high-power applications, including:

• Power amplifiers, filters, and couplers
• Microwave combiners and power divider boards in avionics applications
• Small footprint antennas
• Digital audio broadcasting (DAB) antennas for satellite radio
• GPS and handheld RFID reader antennas

Conclusion
The TC600 PCB substrate represents a significant advancement in thermal management and signal integrity for high-frequency, high-power electronic designs. With its exceptional thermal conductivity, low dielectric losses, and mechanical robustness, the TC600 offers a compelling solution for designers seeking to push the boundaries of performance and reliability. Whether you're working on power amplifiers, antennas, or other high-frequency systems, the TC600 is worth considering as a game-changing PCB substrate.