MOQ: | 1PCS |
Price: | 0.99-99USD/PCS |
Standard Packaging: | Packing |
Delivery Period: | 2-10 working days |
Payment Method: | T/T |
Supply Capacity: | 10000pcs |
In the adrenaline-fueled world of high-frequency electronics, where every picosecond counts, you need printed circuit boards that can keep up with your ambitions. Look no further than Wangling's revolutionary 8-layer RO4350B PCBs – the cornerstone of tomorrow's groundbreaking innovations.
Engineered with a relentless pursuit of perfection, these multi-layer marvels are the result of a synergistic collaboration between Wangling's design wizards and the legendary material scientists at Rogers Corporation. Together, they've crafted a PCB solution that doesn't just meet the demands of today's high-frequency applications – it obliterates them.
At the heart of this technological tour de force lies the renowned RO4350B core material, a proprietary blend of woven glass, hydrocarbon, and ceramics that puts the "super" in "super-high-frequency." With a dielectric constant (Dk) of 3.48 ± 0.05 at a scorching 10GHz and a dissipation factor (Df) of just 0.0037, these laminates deliver signal integrity that will make your circuits sing like a virtuoso.
But the true magic lies in the way these PCBs shrug off the ravages of heat and stress. Boasting a coefficient of thermal expansion (CTE) of 10 ppm/°C (x-axis), 12 ppm/°C (y-axis), and an astonishingly low 32 ppm/°C (z-axis), the RO4350B core is built to withstand the most extreme thermal shock, ensuring your plated-through-holes remain rock-solid reliable, even in the face of hellfire.
To further enhance the performance of these 8-layer marvels, Wangling has integrated Rogers' cutting-edge RO4450F bondply material into the stackup. This high-Tg wonder not only seals the deal on seamless multi-layer integration, but also offers unparalleled lateral flow characteristics, making it a dream to work with during the lamination process.
And let's not forget the copper. With a beefy 1oz (1.4 mils) on the outer layers and a potent combination of 1oz (1.4 mils) and 0.5oz (0.7 mils) on the inner layers, these PCBs are built to handle the most demanding power and signal requirements. Pair that with a 20μm via plating thickness, and you've got a recipe for unstoppable performance.
Whether you're pushing the boundaries of cellular base station antennas, automotive radar, or any other high-frequency marvel, Wangling's 8-layer RO4350B PCBs are the secret weapon you've been searching for. Unleash the future with these technological titans, and watch your designs soar to unprecedented heights.
MOQ: | 1PCS |
Price: | 0.99-99USD/PCS |
Standard Packaging: | Packing |
Delivery Period: | 2-10 working days |
Payment Method: | T/T |
Supply Capacity: | 10000pcs |
In the adrenaline-fueled world of high-frequency electronics, where every picosecond counts, you need printed circuit boards that can keep up with your ambitions. Look no further than Wangling's revolutionary 8-layer RO4350B PCBs – the cornerstone of tomorrow's groundbreaking innovations.
Engineered with a relentless pursuit of perfection, these multi-layer marvels are the result of a synergistic collaboration between Wangling's design wizards and the legendary material scientists at Rogers Corporation. Together, they've crafted a PCB solution that doesn't just meet the demands of today's high-frequency applications – it obliterates them.
At the heart of this technological tour de force lies the renowned RO4350B core material, a proprietary blend of woven glass, hydrocarbon, and ceramics that puts the "super" in "super-high-frequency." With a dielectric constant (Dk) of 3.48 ± 0.05 at a scorching 10GHz and a dissipation factor (Df) of just 0.0037, these laminates deliver signal integrity that will make your circuits sing like a virtuoso.
But the true magic lies in the way these PCBs shrug off the ravages of heat and stress. Boasting a coefficient of thermal expansion (CTE) of 10 ppm/°C (x-axis), 12 ppm/°C (y-axis), and an astonishingly low 32 ppm/°C (z-axis), the RO4350B core is built to withstand the most extreme thermal shock, ensuring your plated-through-holes remain rock-solid reliable, even in the face of hellfire.
To further enhance the performance of these 8-layer marvels, Wangling has integrated Rogers' cutting-edge RO4450F bondply material into the stackup. This high-Tg wonder not only seals the deal on seamless multi-layer integration, but also offers unparalleled lateral flow characteristics, making it a dream to work with during the lamination process.
And let's not forget the copper. With a beefy 1oz (1.4 mils) on the outer layers and a potent combination of 1oz (1.4 mils) and 0.5oz (0.7 mils) on the inner layers, these PCBs are built to handle the most demanding power and signal requirements. Pair that with a 20μm via plating thickness, and you've got a recipe for unstoppable performance.
Whether you're pushing the boundaries of cellular base station antennas, automotive radar, or any other high-frequency marvel, Wangling's 8-layer RO4350B PCBs are the secret weapon you've been searching for. Unleash the future with these technological titans, and watch your designs soar to unprecedented heights.