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Maximizing Performance with Rogers RO4730G3 High-Frequency PCBs: A Comprehensive Guide

Maximizing Performance with Rogers RO4730G3 High-Frequency PCBs: A Comprehensive Guide

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Product Description

Maximizing Performance with Rogers RO4730G3 High-Frequency PCBs: A Comprehensive Guide

 

Introduction

Q: What role do high-frequency PCBs play in electronic devices, and why is Rogers RO4730G3 a notable material in this realm?
A: High-frequency PCBs are essential for efficient signal transmission in various applications. Rogers RO4730G3 is a hydrocarbon/ceramic/woven glass antenna grade laminate that offers a cost-effective alternative to traditional materials, making it a versatile and reliable choice for optimizing performance and cost efficiency.

 

Features of Rogers RO4730G3

Q: What are the key features that make Rogers RO4730G3 stand out as a high-frequency PCB material?
A: Dk of 3.0 +/- 0.05 at 10GHz

Dissipation factor of 0.0028 at 10GHz
Thermal coefficient of Dk of 34 ppm/°C
Thermal Conductivity of 0.45W/mk
High Tg (>280 °C)
Low Z-axis CTE (<30ppm/°C)
Environmental friendliness (RoHS compliant)


Benefits of Rogers RO4730G3

Q: How do the benefits of Rogers RO4730G3 contribute to enhancing high-frequency PCB performance?
A: Low loss dielectric with low profile foil for reduced PIM and insertion loss

Unique filler/closed microspheres for low density and lightweight properties
High Tg and low Z-axis CTE for enhanced design flexibility and automated assembly compatibility
Specially formulated thermoset resin system/filler for ease of fabrication and consistent circuit performance


PCB Stackup and Construction

Q: What are the typical PCB stackup and construction details using Rogers RO4730G3?
A: 2-layer rigid PCB stackup with Rogers RO4730G3 core

Board dimensions: 88.2mm x 66.47mm
Minimum Trace/Space: 4/4 mils
Finished board thickness: 0.8mm
Surface finish: Electroless Nickel Immersion Gold (ENIG)
Quality standard: IPC-Class-2


Typical Applications

Q: In which applications can Rogers RO4730G3 high-frequency PCBs be effectively utilized?
A: Rogers RO4730G3 is widely used in various industries, with applications such as Cellular Base Station Antennas showcasing its exceptional performance and reliability in demanding high-frequency environments.

 

Conclusion

By harnessing the capabilities of Rogers RO4730G3 high-frequency PCBs, designers and manufacturers can achieve optimal performance and reliability in their electronic devices, paving the way for innovative solutions in high-frequency applications. This versatile material offers a high-quality and cost-effective option for meeting the stringent requirements of modern electronic designs.

products
PRODUCTS DETAILS
Maximizing Performance with Rogers RO4730G3 High-Frequency PCBs: A Comprehensive Guide
Detail Information
Product Description

Maximizing Performance with Rogers RO4730G3 High-Frequency PCBs: A Comprehensive Guide

 

Introduction

Q: What role do high-frequency PCBs play in electronic devices, and why is Rogers RO4730G3 a notable material in this realm?
A: High-frequency PCBs are essential for efficient signal transmission in various applications. Rogers RO4730G3 is a hydrocarbon/ceramic/woven glass antenna grade laminate that offers a cost-effective alternative to traditional materials, making it a versatile and reliable choice for optimizing performance and cost efficiency.

 

Features of Rogers RO4730G3

Q: What are the key features that make Rogers RO4730G3 stand out as a high-frequency PCB material?
A: Dk of 3.0 +/- 0.05 at 10GHz

Dissipation factor of 0.0028 at 10GHz
Thermal coefficient of Dk of 34 ppm/°C
Thermal Conductivity of 0.45W/mk
High Tg (>280 °C)
Low Z-axis CTE (<30ppm/°C)
Environmental friendliness (RoHS compliant)


Benefits of Rogers RO4730G3

Q: How do the benefits of Rogers RO4730G3 contribute to enhancing high-frequency PCB performance?
A: Low loss dielectric with low profile foil for reduced PIM and insertion loss

Unique filler/closed microspheres for low density and lightweight properties
High Tg and low Z-axis CTE for enhanced design flexibility and automated assembly compatibility
Specially formulated thermoset resin system/filler for ease of fabrication and consistent circuit performance


PCB Stackup and Construction

Q: What are the typical PCB stackup and construction details using Rogers RO4730G3?
A: 2-layer rigid PCB stackup with Rogers RO4730G3 core

Board dimensions: 88.2mm x 66.47mm
Minimum Trace/Space: 4/4 mils
Finished board thickness: 0.8mm
Surface finish: Electroless Nickel Immersion Gold (ENIG)
Quality standard: IPC-Class-2


Typical Applications

Q: In which applications can Rogers RO4730G3 high-frequency PCBs be effectively utilized?
A: Rogers RO4730G3 is widely used in various industries, with applications such as Cellular Base Station Antennas showcasing its exceptional performance and reliability in demanding high-frequency environments.

 

Conclusion

By harnessing the capabilities of Rogers RO4730G3 high-frequency PCBs, designers and manufacturers can achieve optimal performance and reliability in their electronic devices, paving the way for innovative solutions in high-frequency applications. This versatile material offers a high-quality and cost-effective option for meeting the stringent requirements of modern electronic designs.

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