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F4BTME298 high frequency PCB 2-layer 60mil Thick with 1oz copper weight and Immersion Tin

F4BTME298 high frequency PCB 2-layer 60mil Thick with 1oz copper weight and Immersion Tin

Detail Information
Product Description

Unleashing the Potential of F4BTME High-Frequency PCBs

 

Introduction to F4BTME Series
The F4BTME series of laminates are meticulously crafted using a scientific formulation of glass fiber cloth, nano-ceramic fillers, and PTFE resin to offer enhanced dielectric properties and low loss characteristics. These substrates, built on the F4BM dielectric layer, deliver superior heat resistance, reduced thermal expansion, increased insulation resistance, and improved thermal conductivity, all while maintaining low loss characteristics.

 

Key Features of F4BTME298
The F4BTME298 variant boasts a dielectric constant of 2.98 at 10GHz and a dissipation factor of 0.0018 at 10GHz, showcasing exceptional thermal stability with a coefficient of thermal expansion ranging from -55°C to 288°C. With a low thermal coefficient of Dk and a PIM value of <-160 dbc, the F4BTME298 PCB offers reliability and durability for demanding high-frequency applications.

 

Construction and Design Details

Parameter Specification
Board Dimensions 51.51mm x 111.92mm = 1PCS, +/- 0.15mm
Minimum Trace/Space 6/5 mils
Minimum Hole Size 0.3mm
Blind Vias No
Finished Board Thickness 1.6mm
Finished Cu Weight 1oz (1.4 mils) outer layers
Via Plating Thickness 20 um
Surface Finish Immersion Tin
Top Silkscreen White
Bottom Silkscreen No
Top Solder Mask Green
Bottom Solder Mask No
Electrical Test 100% Electrical test used prior to shipment

 

Applications and Versatility
The F4BTME high-frequency PCBs find applications in diverse industries, including aerospace, microwave, RF, radar, military radar, feed networks, and satellite communications. Their exceptional dielectric properties, low-loss characteristics, and stability across various environmental conditions make them an ideal choice for high-reliability electronic systems.

 

Global Availability and Standard Compliance
With worldwide availability and adherence to IPC-Class-2 quality standards, the F4BTME high-frequency PCBs cater to a global market seeking top-tier solutions for high-frequency electronic applications. The use of Gerber RS-274-X artwork and meticulous construction details ensure consistent performance and reliability in demanding environments.

 

Conclusion: Leading the Future of High-Frequency PCBs
In conclusion, the F4BTME high-frequency PCBs stand out as a cutting-edge solution for industries requiring high reliability, precision, and efficiency in their electronic systems. With their advanced features, superior dielectric properties, low-loss characteristics, and global availability, the F4BTME series sets a new standard for high-frequency PCB technology, offering unparalleled performance and reliability in a wide range of applications worldwide.

products
PRODUCTS DETAILS
F4BTME298 high frequency PCB 2-layer 60mil Thick with 1oz copper weight and Immersion Tin
Detail Information
Product Description

Unleashing the Potential of F4BTME High-Frequency PCBs

 

Introduction to F4BTME Series
The F4BTME series of laminates are meticulously crafted using a scientific formulation of glass fiber cloth, nano-ceramic fillers, and PTFE resin to offer enhanced dielectric properties and low loss characteristics. These substrates, built on the F4BM dielectric layer, deliver superior heat resistance, reduced thermal expansion, increased insulation resistance, and improved thermal conductivity, all while maintaining low loss characteristics.

 

Key Features of F4BTME298
The F4BTME298 variant boasts a dielectric constant of 2.98 at 10GHz and a dissipation factor of 0.0018 at 10GHz, showcasing exceptional thermal stability with a coefficient of thermal expansion ranging from -55°C to 288°C. With a low thermal coefficient of Dk and a PIM value of <-160 dbc, the F4BTME298 PCB offers reliability and durability for demanding high-frequency applications.

 

Construction and Design Details

Parameter Specification
Board Dimensions 51.51mm x 111.92mm = 1PCS, +/- 0.15mm
Minimum Trace/Space 6/5 mils
Minimum Hole Size 0.3mm
Blind Vias No
Finished Board Thickness 1.6mm
Finished Cu Weight 1oz (1.4 mils) outer layers
Via Plating Thickness 20 um
Surface Finish Immersion Tin
Top Silkscreen White
Bottom Silkscreen No
Top Solder Mask Green
Bottom Solder Mask No
Electrical Test 100% Electrical test used prior to shipment

 

Applications and Versatility
The F4BTME high-frequency PCBs find applications in diverse industries, including aerospace, microwave, RF, radar, military radar, feed networks, and satellite communications. Their exceptional dielectric properties, low-loss characteristics, and stability across various environmental conditions make them an ideal choice for high-reliability electronic systems.

 

Global Availability and Standard Compliance
With worldwide availability and adherence to IPC-Class-2 quality standards, the F4BTME high-frequency PCBs cater to a global market seeking top-tier solutions for high-frequency electronic applications. The use of Gerber RS-274-X artwork and meticulous construction details ensure consistent performance and reliability in demanding environments.

 

Conclusion: Leading the Future of High-Frequency PCBs
In conclusion, the F4BTME high-frequency PCBs stand out as a cutting-edge solution for industries requiring high reliability, precision, and efficiency in their electronic systems. With their advanced features, superior dielectric properties, low-loss characteristics, and global availability, the F4BTME series sets a new standard for high-frequency PCB technology, offering unparalleled performance and reliability in a wide range of applications worldwide.

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