Unleashing the Potential of F4BTME High-Frequency PCBs
Introduction to F4BTME Series
The F4BTME series of laminates are meticulously crafted using a scientific formulation of glass fiber cloth, nano-ceramic fillers, and PTFE resin to offer enhanced dielectric properties and low loss characteristics. These substrates, built on the F4BM dielectric layer, deliver superior heat resistance, reduced thermal expansion, increased insulation resistance, and improved thermal conductivity, all while maintaining low loss characteristics.
Key Features of F4BTME298
The F4BTME298 variant boasts a dielectric constant of 2.98 at 10GHz and a dissipation factor of 0.0018 at 10GHz, showcasing exceptional thermal stability with a coefficient of thermal expansion ranging from -55°C to 288°C. With a low thermal coefficient of Dk and a PIM value of <-160 dbc, the F4BTME298 PCB offers reliability and durability for demanding high-frequency applications.
Construction and Design Details
Parameter | Specification |
Board Dimensions | 51.51mm x 111.92mm = 1PCS, +/- 0.15mm |
Minimum Trace/Space | 6/5 mils |
Minimum Hole Size | 0.3mm |
Blind Vias | No |
Finished Board Thickness | 1.6mm |
Finished Cu Weight | 1oz (1.4 mils) outer layers |
Via Plating Thickness | 20 um |
Surface Finish | Immersion Tin |
Top Silkscreen | White |
Bottom Silkscreen | No |
Top Solder Mask | Green |
Bottom Solder Mask | No |
Electrical Test | 100% Electrical test used prior to shipment |
Applications and Versatility
The F4BTME high-frequency PCBs find applications in diverse industries, including aerospace, microwave, RF, radar, military radar, feed networks, and satellite communications. Their exceptional dielectric properties, low-loss characteristics, and stability across various environmental conditions make them an ideal choice for high-reliability electronic systems.
Global Availability and Standard Compliance
With worldwide availability and adherence to IPC-Class-2 quality standards, the F4BTME high-frequency PCBs cater to a global market seeking top-tier solutions for high-frequency electronic applications. The use of Gerber RS-274-X artwork and meticulous construction details ensure consistent performance and reliability in demanding environments.
Conclusion: Leading the Future of High-Frequency PCBs
In conclusion, the F4BTME high-frequency PCBs stand out as a cutting-edge solution for industries requiring high reliability, precision, and efficiency in their electronic systems. With their advanced features, superior dielectric properties, low-loss characteristics, and global availability, the F4BTME series sets a new standard for high-frequency PCB technology, offering unparalleled performance and reliability in a wide range of applications worldwide.
Unleashing the Potential of F4BTME High-Frequency PCBs
Introduction to F4BTME Series
The F4BTME series of laminates are meticulously crafted using a scientific formulation of glass fiber cloth, nano-ceramic fillers, and PTFE resin to offer enhanced dielectric properties and low loss characteristics. These substrates, built on the F4BM dielectric layer, deliver superior heat resistance, reduced thermal expansion, increased insulation resistance, and improved thermal conductivity, all while maintaining low loss characteristics.
Key Features of F4BTME298
The F4BTME298 variant boasts a dielectric constant of 2.98 at 10GHz and a dissipation factor of 0.0018 at 10GHz, showcasing exceptional thermal stability with a coefficient of thermal expansion ranging from -55°C to 288°C. With a low thermal coefficient of Dk and a PIM value of <-160 dbc, the F4BTME298 PCB offers reliability and durability for demanding high-frequency applications.
Construction and Design Details
Parameter | Specification |
Board Dimensions | 51.51mm x 111.92mm = 1PCS, +/- 0.15mm |
Minimum Trace/Space | 6/5 mils |
Minimum Hole Size | 0.3mm |
Blind Vias | No |
Finished Board Thickness | 1.6mm |
Finished Cu Weight | 1oz (1.4 mils) outer layers |
Via Plating Thickness | 20 um |
Surface Finish | Immersion Tin |
Top Silkscreen | White |
Bottom Silkscreen | No |
Top Solder Mask | Green |
Bottom Solder Mask | No |
Electrical Test | 100% Electrical test used prior to shipment |
Applications and Versatility
The F4BTME high-frequency PCBs find applications in diverse industries, including aerospace, microwave, RF, radar, military radar, feed networks, and satellite communications. Their exceptional dielectric properties, low-loss characteristics, and stability across various environmental conditions make them an ideal choice for high-reliability electronic systems.
Global Availability and Standard Compliance
With worldwide availability and adherence to IPC-Class-2 quality standards, the F4BTME high-frequency PCBs cater to a global market seeking top-tier solutions for high-frequency electronic applications. The use of Gerber RS-274-X artwork and meticulous construction details ensure consistent performance and reliability in demanding environments.
Conclusion: Leading the Future of High-Frequency PCBs
In conclusion, the F4BTME high-frequency PCBs stand out as a cutting-edge solution for industries requiring high reliability, precision, and efficiency in their electronic systems. With their advanced features, superior dielectric properties, low-loss characteristics, and global availability, the F4BTME series sets a new standard for high-frequency PCB technology, offering unparalleled performance and reliability in a wide range of applications worldwide.