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Rogers RO3003 high frequency PCB 2-layer 1oz copper weight 60mil with Immersion Gold

Rogers RO3003 high frequency PCB 2-layer 1oz copper weight 60mil with Immersion Gold

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Product Description

Rely on RO3003 for Reliable Performance in Demanding High Frequency Applications

 

When designing circuits that need to operate with precision across wide ranges of frequency and temperature, the substrate material is critical. RO3003 from Rogers Corporation provides engineers with a solution they can trust in applications up to 77GHz like automotive radar and 5G infrastructure.

 

RO3003 maintains a tightly controlled dielectric constant of 3.0 ± 0.04 at 10GHz even as temperatures vary. Its ultra-low dissipation factor of 0.001 minimizes losses. Dimensional stability is also excellent with a coefficient of thermal expansion well-matched to copper layers.

 

A recent prototype leveraged these attributes. A compact 2-layer, 63x35mm board implemented a 24-component design within 4/6mil routing tolerances. Even after rigorous testing from -55°C to 125°C, all functionalities performed reliably.

 

Whether developing phased arrays for satellite antennas, power amplifiers for cellular basestations or positioning systems for autonomous driving, RO3003 enables realization of advanced, compact microwave circuitry.

 

Contact us to discuss how RO3003 can bring your cutting-edge designs to life. Rely on its proven performance to reach new frontiers in automotive, telecommunications and beyond. Prototyping complex multi-layer boards is also made simpler through RO3003’s robust process capability.

 

products
PRODUCTS DETAILS
Rogers RO3003 high frequency PCB 2-layer 1oz copper weight 60mil with Immersion Gold
Detail Information
Product Description

Rely on RO3003 for Reliable Performance in Demanding High Frequency Applications

 

When designing circuits that need to operate with precision across wide ranges of frequency and temperature, the substrate material is critical. RO3003 from Rogers Corporation provides engineers with a solution they can trust in applications up to 77GHz like automotive radar and 5G infrastructure.

 

RO3003 maintains a tightly controlled dielectric constant of 3.0 ± 0.04 at 10GHz even as temperatures vary. Its ultra-low dissipation factor of 0.001 minimizes losses. Dimensional stability is also excellent with a coefficient of thermal expansion well-matched to copper layers.

 

A recent prototype leveraged these attributes. A compact 2-layer, 63x35mm board implemented a 24-component design within 4/6mil routing tolerances. Even after rigorous testing from -55°C to 125°C, all functionalities performed reliably.

 

Whether developing phased arrays for satellite antennas, power amplifiers for cellular basestations or positioning systems for autonomous driving, RO3003 enables realization of advanced, compact microwave circuitry.

 

Contact us to discuss how RO3003 can bring your cutting-edge designs to life. Rely on its proven performance to reach new frontiers in automotive, telecommunications and beyond. Prototyping complex multi-layer boards is also made simpler through RO3003’s robust process capability.

 

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