TSM-DS3 PCB 2-layer 5mil with Immersion Silver without Solder Mask and Silkscreen

TSM-DS3 High Frequency PCB: Redefining High-Power Applications

TSM-DS3 High Frequency PCB is a cutting-edge solution that is revolutionizing the realm of high-power applications. This ceramic-filled reinforced material boasts exceptional properties that make it a viable alternative to traditional epoxies for fabricating complex multilayer PCBs. With a low fiberglass content of approximately 5%, TSM-DS3 offers thermal stability, industry-leading low loss core, and predictability comparable to the best fiberglass reinforced epoxies.

Featuring a dielectric constant of 3.0 with tight tolerance at 10 GHz/23°C and a dissipation factor of 0.0014 at 10GHz, TSM-DS3 ensures precise electrical performance with minimal signal loss. Its high thermal conductivity of 0.65 W/MK effectively dissipates heat, making it ideal for applications where heat management is crucial. Additionally, TSM-DS3 exhibits dimensional stability that rivals epoxy materials and is compatible with resistive foils.

One of the key benefits of TSM-DS3 is its ability to enable the fabrication of large format, high layer count PCBs with consistency and predictability. Designed for high-power applications, TSM-DS3 offers thermal stability and low coefficients of thermal expansion, ensuring reliability in demanding thermal cycling environments. With a focus on high yield production and quality, TSM-DS3 paves the way for advanced PCB designs that meet the most stringent requirements.

From couplers and phased array antennas to radar manifolds and semiconductor/ATE testing, TSM-DS3 finds applications across diverse industries. Its exceptional properties, advanced manufacturing capabilities, and compatibility with complex designs position TSM-DS3 as a game-changer in the world of high-frequency circuit materials. Experience the power and versatility of TSM-DS3 High Frequency PCB and elevate your high-power applications to new heights.