RO3206 high frequency PCB 2-layer 25mil with ENEPIG | Black Silkscreen | No Solder Mask

RO3206 High Frequency PCB: Unleashing Superior Performance and Cost Efficiency

We are pleased to present RO3206, a high frequency circuit material by Rogers that has been engineered to offer exceptional electrical performance and mechanical stability at competitive prices. In this blog post, the features, benefits, and applications of the RO3206 high frequency PCB will be explored, along with its construction details and worldwide availability.

Features:
RO3206 boasts impressive features that set it apart from other circuit materials. With a dielectric constant of 6.15 (with a tight tolerance of 0.15 at 10 GHz/23°C), exceptional electrical performance is achieved. A dissipation factor of 0.0027 at 10GHz ensures minimal signal loss, while the high thermal conductivity of 0.67 W/MK facilitates efficient heat dissipation. Furthermore, RO3206 exhibits low moisture absorption, ensuring stable performance in various environments. Additionally, its copper coefficient of thermal expansion (CTE) is matched in the X-axis and Y-axis, with values of 13 ppm/°C, and in the Z-axis with a value of 34 ppm/°C, guaranteeing reliable performance in complex multi-layer structures.

Benefits:
The benefits of utilizing RO3206 high frequency PCB are numerous. The rigidity is improved due to the woven glass reinforcement, making it easier to handle during manufacturing. The uniform electrical and mechanical performance makes it ideal for complex multi-layer high frequency structures. High frequency performance is ensured through the low dielectric loss. Compatibility with epoxy multilayer board hybrid designs and reliable surface-mounted assemblies are possible due to the low in-plane expansion coefficient, which is matched to copper. The excellent dimensional stability of RO3206 contributes to high production yields, while its cost-effective pricing makes it suitable for volume manufacturing. Finally, the surface smoothness allows for finer line etching tolerances, ensuring precise PCB designs.

PCB Construction Details:
The RO3206 high frequency PCB is a 2-layer rigid board with copper thicknesses of 35 μm on both layers. The board dimensions are 51.91mm x 110mm, with a finished board thickness of 0.8mm. Trace/space requirements are a minimum of 4/6 mils, and the minimum hole size is 0.35mm. The PCB is subjected to via plating with a thickness of 20 μm and is finished with an ENEPIG surface coating. The top silkscreen is black, while no bottom silkscreen or solder mask is applied. Each PCB undergoes a rigorous 100% electrical test before shipment, ensuring its quality and reliability.

Applications:
RO3206 high frequency PCB finds application in various industries. It is widely used in automotive collision avoidance systems, automotive global position satellite antennas, wireless telecommunications systems, microstrip patch antennas for wireless communications, direct broadcast satellites, datalink on cable systems, remote meter readers, power backplanes, LMDS and wireless broadband, as well as base station infrastructure. Its versatility and superior performance make it an excellent choice for demanding applications in these fields.

Conclusion:
RO3206 high frequency PCB offers a winning combination of exceptional electrical performance, mechanical stability, and cost efficiency. Its unique features, benefits, and wide availability make it an excellent choice for various high frequency applications. Whether reliable PCBs are needed for automotive systems or advanced wireless communications, RO3206 is here to deliver outstanding results. Embrace the power of RO3206 and revolutionize your PCB designs today.