RO3003 and High Tg FR-4 8-layer rigid high frequency PCB with 1oz cupper weight

Hybrid PCBs utilizing RO3003 and High Tg FR-4 materials are produced by us. RO3003, a high-frequency laminate designed for commercial microwave and RF applications, features excellent stability of dielectric constant (Dk) across different temperatures and frequencies. This makes it suitable for applications such as automotive radar, advanced driver assistance systems, and 5G wireless infrastructure. High Tg FR-4, specifically Shengyi S1000-2M, is a high-performance epoxy glass circuit material known for its low CTE and superior thermal reliability.

The dielectric constant (Dk) of RO3003 is 3.00 +/- .04, and it exhibits a low dissipation factor of .0010 at 10 GHz. Additionally, it demonstrates low X, Y, and Z axis CTE values of 17, 16, and 25 ppm/°C, respectively, making it suitable for reliable stripline and multilayer board constructions, including hybrid designs with epoxy glass multilayer boards.

High Tg FR-4, with a glass transition temperature (Tg) exceeding 180°C, provides excellent thermal stability. Before reaching Tg, it has a CTE (Z-axis) of 41 ppm/°C, and its permittivity (1GHz) is 4.6. This material is well-suited for high multilayer PCB applications, ensuring reliable through-hole connections and maintaining strong mechanical and electrical integrity.

The stackup of an 8-layer rigid PCB includes copper layers, a RO3003 core, prepreg layers, and S1000-2M FR-4. The board dimensions are 92.5mm x 130.05mm, with a finished board thickness of 1.3mm. The finished copper weight is 0.5 oz (0.7 mils) for inner layers and 1 oz (1.4 mils) for outer layers. Via plating thickness is 20μm, and the surface finish employed is immersion gold. The top and bottom silkscreens are in white, while the top solder mask is matt black.

IPC-Class-2 quality standards are met during the manufacturing process, and the PCB undergoes 100% electrical testing. The design adheres to specific impedance requirements, such as 50 ohm single-end impedance on the top layer and 100 ohm differential impedance with 9.5mil/10mil track/gap on the top layer. The PCB's robust construction and reliable electrical performance make it suitable for various applications.

These hybrid PCBs find application in wireless communications, automotive radar systems, direct broadcast satellites, cellular telecommunications systems (including power amplifiers and antennas), and datalink on cable systems. They offer reliable performance, mechanical integrity, and compliance with environmental regulations.

In summary, the production of hybrid PCBs utilizing RO3003 and High Tg FR-4 materials is our specialty. These PCBs exhibit excellent stability, performance, and reliability across various high-frequency applications. The construction details and features cater to a wide range of industries globally, ensuring the provision of reliable and efficient circuit board solutions.