RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203
TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350
|Place of Origin:||China|
|Brand Name:||Bicheng Enterprise Limited|
|Minimum Order Quantity:||1|
|Packaging Details:||KK carton (hard card)|
|Delivery Time:||2-3 working days|
|Supply Ability:||45000 pieces per month|
|Base Material:||Stainless Steel Shim||Foil Thickness(Optional):||0.12mm|
|Aperture Configured:||Laser Cut||Appearance:||Engraving And Electro Polishing|
|Fiducial Mark:||Through Hole||Application:||CSP, BGA, 0.5mm QFP Etc. Package|
Take Your High-Frequency Designs to New Heights with Our RO4003C PCB
Engineers know that materials matter when designing for high-frequency applications. That's why we're excited to announce the availability of our new two-layer PCB featuring Rogers Corporation's RO4003C laminates. With its low loss, excellent thermal stability, and wide operating temperature range, this board is ready to take your RF designs to the next level.
RO4003C: Engineered for Premium Performance
At the core of this PCB is Rogers' RO4003C hydrocarbon ceramic material, which achieves superior dielectric properties through a novel manufacturing process. The end result is a substrate with a low dissipation factor capable of handling up to 20GHz while maintaining signal integrity even at high temperatures.
The glass transition temperature of RO4003C is 280°C, meaning the material retains stable electrical performance from -40°C up to +85°C. This makes it an ideal choice for aerospace, automotive, and other applications subject to dramatic environmental shifts. No need to worry about your circuit drifting during temperature changes - RO4003C has you covered.
Optimized Construction for Your High-Frequency Needs
We've leveraged the capabilities of RO4003C to deliver a PCB engineered for high-frequency demands. The 2-layer design utilizes a 60mil dielectric core layer between 1oz copper layers measuring 35um thickness. This stackup provides mechanical rigidity with a low profile of just 1.6mm total thickness.
The 7/6 mil trace/space design ensures tight component spacing while maintaining a 105Ω controlled impedance. Plated through holes make routing and connections simple, while the HASL surface finish is compatible with lead-free soldering processes.
Ready for Your Next Great Design
Whether you're working on 5G equipment, satellite communications, automotive radar, or aerospace avionics, this new PCB has the high-frequency pedigree your designs demand. Order in 2 panel sizes of 10 boards each, with tight 233mm x 229mm dimensions held to a +/- 0.15mm tolerance.
Let us know if you need any customization of layer stackup, board shape, or other specifications. We can't wait to see the innovative high-frequency designs you'll create with our new RO4003C PCB!
Contact Person: Miss. Sally Mao