Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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Experience the high-performance capabilities of Rogers RO3006

Experience the high-performance capabilities of Rogers RO3006

  • Experience the high-performance capabilities of Rogers RO3006
Experience the high-performance capabilities of Rogers RO3006
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-751-V6.6
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD9.99-99.99
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
Contact Now
Detailed Product Description
Thermal Conductivity: 2.0W/MK 75um Dielectric Material Final Height Of PCB: 2.0mm ±0.2
Final Foil External: 2oz Surface Finish: Hot Air Soldering Leveling(HASL),lead Free
Solder Mask Color: White Colour Of Component Legend: Black
TEST: 100% Electrical Test Prior Shipment

Experience the high-performance capabilities of Rogers RO3006

We are excited to announce the arrival of our newest PCB, made with high-quality materials and designed using advanced technology.


Our latest PCB is made from high-quality materials and has been designed with advanced technology. Rogers RO3006, a high-performance material that is ideal for high-frequency applications, has been used to create the PCB. It is also lead-free, making it an environmentally friendly option.


The PCB is highly reliable and can operate within a wide temperature range, from -40℃ to +85℃. The stackup is base copper 17um + dielectric 25mil + base copper 17um, and it has a thickness of 0.8 mm. The PCB has a size of 156.00 x 122.00 mm=3Types=3PCS and has small spaces between the electrical pathways and small holes for electronic components.


The circuit board has no hidden or buried connections, and any slots are fully connected. It has a finished copper weight of 1 oz (1.4 mils) all layers and a via plating thickness of 1 mil. The surface finish is immersion gold (ENIG), and the top silkscreen is black, while the bottom silkscreen is not applicable. The top/bottom solder mask is also not applicable, and there is no silkscreen on the soldering pads. The PCB has undergone a 100% electrical test to ensure its quality and reliability.


Various applications can use our PCB, which has 98 electronic components, 286 connection points, and 88 vias. It is a versatile and reliable optionfor a range of electronic designs.


The PCB is supplied with a panelized solder paste stencil for the top side, making it easier to use. The PCB is designed to align with board breakouts, and all edges are tab-routed. Non-plated holes for breakouts are included in the Gerbers, and breakouts are shown as per the design FabDrawing. The circuit board dimensions are 156.00 x 122.00 mm=3Types=3PCS, with a minimum trace/space of 6/5 mils and a minimum hole size of 17 mils.


Excellent customer service is our priority, and technical questions or inquiries can be directed to Sally at We are excited to offer this high-quality PCB to our customers and look forward to the innovative projects it will facilitate.


Everything You Need to Know About Rogers RO3006 PCBs

-----Properties of Rogers RO3006 PCB Material


Rogers RO3006 is a superior material for high-frequency PCB applications. Its advanced technology and exceptional properties make it the ideal choice for electronic designs requiring high reliability and performance.


Rogers RO3006 is a hydrocarbon/ceramic composite with ceramic fillers, which makes it an excellent choice for high-frequency applications. With a low dielectric constant of 6.15±0.05 at 10 GHz/23℃ and a low loss tangent of 0.002 at 10 GHz/23℃, it reduces signal loss and improves signal integrity.


The lead-free process used in the manufacturing of Rogers RO3006 makes it an environmentally friendly option, in compliance with the latest environmental regulations.


Rogers RO3006 has exceptional thermal stability, capable of operating in a wide temperature range from -50℃ to 150℃, while maintaining its dielectric properties. This feature makes it an outstanding choice for electronic designs that require reliable performance in extreme temperatures.


Rogers RO3006's dielectric constant and design are optimized for high-frequency applications. With a dielectric constant of 6.5 at 8 GHz to 40 GHz, it allows for improved signal integrity. The design is also optimized using the differential phaselength method, ensuring that the PCB has consistent and controlled impedance.


The dissipation factor of Rogers RO3006 is low, at 0.002 at 10 GHz/23℃. This means that the material has low signal loss and is ideal for high-frequency applications. The thermal coefficient of ε is also low, at -262 ppm/℃ from -50℃ to 150℃ at 10 GHz, ensuring that the dielectric properties of the material remain stable even in extreme temperatures.


Rogers RO3006 has excellent dimensional stability, with a coefficient of 0.27/0.15 mm/m (X/Y) under COND A, according to IPC-TM-650 2.2.4. This makes it a reliable choice for electronic designs that require stability and precision. The material also has low moisture absorption, at 0.02%, according to D48/50 IPC-TM-650


Rogers RO3006 has a high copper peel strength of 7.1 Ib/in. for 1oz, EDC after solder float, according to IPC-TM 2.4.8. This ensures that the copper layers are securely attached to the PCB, even under extreme conditions. The material also has a high surface resistivity of 105 MΩ under COND A, according to IPC


Rogers RO3006 has a high tensile modulus of 1498/1293 MPa (X/Y) at 23℃, according to ASTM D 638. This means that the material has high strength and durability. The material is also flame retardant, with a V-0 rating according to UL 94.


Rogers RO3006 has a thermal conductivity of 0.79 W/M/K at 50℃, according to ASTM D 5470. This ensures that the material can dissipate heat effectively, making it a great choice for high-power applications. The material also has a low coefficient of thermal expansion of 17/17/24 ppm/℃ (X/Y/Z) at 23℃/50% RH, according to IPC-TM-650 This means that the material can maintain its dimensional stability even under extreme temperature changes.


In conclusion, Rogers RO3006 is an outstanding choice for electronic designs that require high performance, reliability, and stability. Its exceptional properties, such as low dielectric constant, low loss tangent, and thermal stability, make it an excellent option for high-frequency applications. Its lead-free process compatibility and environmental friendliness also make it a smart choice for sustainable electronic designs. Whether designing for high-frequency communication systems or high-power applications, Rogers RO3006 is a great option to consider for your next PCB design.

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
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