Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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RT/duroid 6035HTC PCB DK3.5 at 10 GHz 30mil double layer 1oz copper with Immersion Silver

RT/duroid 6035HTC PCB DK3.5 at 10 GHz 30mil double layer 1oz copper with Immersion Silver

  • RT/duroid 6035HTC PCB DK3.5 at 10 GHz 30mil double layer 1oz copper with Immersion Silver
  • RT/duroid 6035HTC PCB DK3.5 at 10 GHz 30mil double layer 1oz copper with Immersion Silver
RT/duroid 6035HTC PCB DK3.5 at 10 GHz 30mil double layer 1oz copper with Immersion Silver
Product Details:
Place of Origin: CHINA
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0321-V3.21
Payment & Shipping Terms:
Minimum Order Quantity: 1 PIECE
Price: USD2 .99-9.99 per piece
Packaging Details: VACUUM
Delivery Time: 8-9 WORKING DAY
Payment Terms: T/T,Paypal
Supply Ability: 50000 PIECE PER MONTH
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Detailed Product Description
Board Material: Polyimide (PI) 25um Board Thickness: 0.15 Mm
Surface/Inner Layer Cu Thickness: 35 µm Surface Finish: Immersion Gold
Coverlay Colour: Yellow Color Of Silkscreen: White
Function: 100% Pass Electrical Test Number Of Layers: 2

Raise the Bar with Our New High-Power RF PCB


Engineers searching for the ultimate PCB foundation for microwave and RF designs, look no further! We're thrilled to announce the launch of our new high-performance rigid board that takes RF circuit design to the next level.


Built on Rogers' acclaimed RT/duroid 6035HTC material, this board boasts best-in-class thermal management and electrical performance. The ceramic-filled PTFE composite substrate has excellent dielectric properties, with a low and stable loss tangent for minimal signal loss up to 10GHz. And the high thermal conductivity rapidly dissipates heat from high power components.


Stackup & Materials

  • Substrate: Rogers RT/duroid 6035HTC, 0.762mm (30 mil) thickness. Dielectric constant of 3.5 at 10 GHz. Extremely low loss (Df of 0.0013 at 10 GHz) and thermal coefficient of Dk of -66 ppm/°C. Operational range of -40°C to +85°C.
  • Copper Foil: Electrodeposited rolled annealed copper, 35 μm thickness on both layers, with thermally stable reverse treat for optimal high frequency signal integrity.
  • Layer 1: Signal layer
  • Layer 2: Ground/power plane layer
  • Plating: 20 μm copper in holes/vias
  • Final Finished Board Thickness: 0.9mm
  • Final Copper Weight: 1 oz (1.4 mil) each outer layer


Layout Capabilities

  • Board Dimensions: 76.05mm x 53.2mm
  • Minimum Trace/Space: 6/8 mil
  • Minimum Hole Size: 0.45mm
  • All vias are thru-hole interconnects, no blind/buried vias
  • 105 vias with 20μm copper plating for robust interconnects
  • 87 components, 101 pads, supporting top and bottom SMT parts


With its reverse-treated copper layers and robust 105 vias, the PCB enables routing intricate microwave circuits with ease. The finely spaced traces and abundance of vias provide ample connectivity for complex designs. And it withstands extreme thermal cycles thanks to a thermally stable construction.


Surface Finishes

  • Immersion silver surface finish on pads and traces enables excellent solderability and thermal/electrical performance
  • No solder mask for maximum heat dissipation
  • No silkscreen for simplicity



  • Excellent high frequency performance - The Rogers RT/duroid 6035HTC dielectric material has a low loss tangent, stable dielectric constant, and low thermal coefficient of Dk for reliable performance up to 10GHz.
  • High thermal conductivity - The ceramic-filled PTFE composite material dissipates heat efficiently, enabling operation at higher power levels.
  • Thermally stable construction - The reverse treat copper foil minimizes thermal expansion issues over wide temperature swings.
  • High density routing capabilities - With 6/8 mil trace/space, dense RF layouts can be achieved.
  • Abundant vias - 105 vias with 20μm copper plating provide robust interconnects between layers.
  • Lead-free immersion silver finish - Provides excellent solderability and thermal/electrical conduction from pads.
  • No solder mask - Allows for maximum heat dissipation across board surface.
  • 100% electrical testing - Ensures quality and reliability.


We designed this board to be the ultimate microwave PCB platform. Ideal for high frequency analog and digital, microwave, and mm-Wave applications. Integrate it into your designs to reach new levels of performance.


Of course, these advanced capabilities come at a cost. The specialized materials and fabrication result in a higher price tag compared to standard PCBs. And the 2-layer stackup limits routing flexibility versus a 4+ layer board. But for RF/microwave products where electrical performance and thermal management are vital, the benefits outweigh the costs.



  • Higher cost - The advanced dielectric material and fabrication is more expensive than standard FR-4 PCBs.
  • Limited layer count - The 2-layer construction reduces routing flexibility compared to a 4+ layer board.
  • No solder mask - Lack of solder mask may require extra handling and cleaning precautions.
  • Limited board sizes - Currently only available in one fixed dimension of 76.05mm x 53.2mm.
  • No blind/buried vias - Thru-hole vias take up more routing space versus blind/buried vias.
  • Lead time - Advanced PCBs typically have longer fabrication lead times.


Should you have any technical inquiries or require further assistance, please do not hesitate to contact Sally Mao at Our dedicated team stands ready to address any questions or concerns you may encounter. We can't wait to see the leading-edge innovations you create with this new RF board!

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
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