Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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RO4730G3 PCB Dielectric Matrial on 25mil, 50mil and 75mil with Immersion Gold for Ground Radar Warning

RO4730G3 PCB Dielectric Matrial on 25mil, 50mil and 75mil with Immersion Gold for Ground Radar Warning

  • RO4730G3 PCB Dielectric Matrial  on 25mil, 50mil and 75mil with Immersion Gold for Ground Radar Warning
RO4730G3 PCB Dielectric Matrial  on 25mil, 50mil and 75mil with Immersion Gold for Ground Radar Warning
Product Details:
Place of Origin: CHINA
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0306-V3.06
Payment & Shipping Terms:
Minimum Order Quantity: 1 PIECE
Price: USD2 .99-9.99 per piece
Packaging Details: VACUUM
Delivery Time: 8-9 WORKING DAY
Payment Terms: T/T,Paypal
Supply Ability: 50000 PIECE PER MONTH
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Detailed Product Description
Board Material: Polyimide 25μm + 1.0mm Stiffener Of FR-4 Board Thickness: 1.20 Mm
Surface/Inner Layer Cu Thickness: 35 µm Surface Finish: Immersion Gold
Coverlay Colour: Black Color Of Silkscreen: White
Function: 100% Pass Electrical Test Number Of Layers: 1

In the dynamic realm of advanced electronics, the quest for reliable and high-performance materials is incessant. A material that has been garnering significant attention in the industry is RO4730G3. With its outstanding properties and remarkable test results, RO4730G3 stands tall as the preferred choice for a diverse range of applications. In this blog post, we delve into the distinctive features and advantages of RO4730G3, substantiated by comprehensive test data.


Dielectric Constant: Paving the Way for High-Frequency Brilliance
RO4730G3 boasts an impressive dielectric constant, clocking in at 3.0±0.5 at 10 GHz and 23℃. This exceptional attribute ensures efficient signal transmission, making it an ideal solution for high-frequency applications. Furthermore, the design dielectric constant of 2.98 across the frequency range of 1.7 GHz to 5 GHz, as determined by the Differential Phase Length Method, underscores the consistent and dependable performance of RO4730G3.


Dissipation Factor: Minimizing Signal Loss, Maximizing Excellence
When it comes to signal loss mitigation, the dissipation factor takes center stage. RO4730G3 excels in this aspect, exhibiting a low dissipation factor of 0.0028 at 10 GHz and 23℃. This exceptional performance ensures optimal signal integrity and minimal energy loss, making it the go-to choice for high-speed and high-frequency applications where signal fidelity reigns supreme.


Thermal Stability: Reliability in the Face of Temperature Fluctuations
RO4730G3 showcases remarkable thermal stability, as evidenced by its thermal coefficient of ε of +34 ppm/℃ in the range of -50℃ to 150℃. This characteristic guarantees consistent electrical performance despite varying temperature conditions, making it an excellent fit for applications subject to temperature fluctuations.


Dimensional Stability: Precision Redefined
With an unwavering dimensional stability of less than 0.4 mm/m in the X and Y directions, even after etching and exposure to temperatures of +E2/150℃, RO4730G3 sets the bar high for maintaining precise circuit geometries and ensuring unwavering performance in high-precision electronic devices.


Electrical and Surface Properties: The Pillars of Reliability
RO4730G3 boasts exceptional electrical properties, with a volume resistivity of 9 X 10^7 MΩ.cm and a surface resistivity of 7.2 X 10^5 MΩ. These values attest to its outstanding insulating characteristics and its ability to prevent leakage currents, ensuring unwavering reliability and safe operation across a spectrum of electronic applications.


PIM Performance: Empowering Seamless Signal Quality
RO4730G3 delivers an outstanding Passive Intermodulation (PIM) performance, achieving a remarkable -165 dBc value at 1900 MHz and 43 dBm output power. This attribute positions it as the material of choice for wireless communication systems, where minimizing intermodulation distortion is critical to ensure pristine signal quality and reduce interference.


Mechanical Strength and Stability: Durability Redefined
In addition to its electrical prowess, RO4730G3 showcases impressive mechanical strength. With a flexural strength of 181 Mpa (26.3 kpsi) in the MD direction and 139 Mpa (20.2 kpsi) in the CMD direction at room temperature, it guarantees the durability and reliability of electronic assemblies, even in demanding operating conditions.


Other Key Properties: Versatility Unleashed
RO4730G3 presents a host of additional remarkable properties. It exhibits a low moisture absorption rate of 0.093% and a high thermal conductivity of 0.45 W/mK at 50℃, ensuring effective moisture resistance and efficient heat dissipation. Its coefficient of thermal expansion ranges from 14.4 to 35.2 ppm/℃ in the X, Y, and Z directions, enabling reliable performance across a wide temperature range. With a glass transition temperature (Tg) surpassing 280℃ and a decomposition temperature (Td) of 411℃, RO4730G3 fearlessly thrives in high-temperature environments without compromising its structural integrity. Moreover, its density of 1.58 gm/cm3 enables lightweight and compact designs, fostering innovation and versatility.


Flammability and Lead-Free Compatibility: Safety Meets Sustainability
RO4730G3 proudly holds a V-0 rating according to the UL 94 flammability standard, ensuring excellent flame resistance. It also stands as a paragon of environmental responsibility, being lead-free process compatible, complying with industry regulations, and embodying safe and sustainable manufacturing practices.


RO4730G3 emerges as a high-performance dielectric material, empowering advanced electronics with its exceptional electrical, mechanical, thermal, and dimensional properties. With its remarkable dielectric constantTitle: RO4730G3 Unveiled: Empowering Advanced Electronics with Revolutionary Dielectric Material


Property RO4730G3 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.5 Z   10 GHz 23℃ IPC-TM-650
Dielectric Constant,εDesign 2.98 Z   1.7 GHz to 5 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0028 Z   10 GHz 23℃ IPC-TM-650
        2.5 GHz  
Thermal Coefficient of ε +34 Z ppm/℃ -50 ℃to 150℃ IPC-TM-650
Dimensional Stability <0.4 X, Y mm/m after etech +E2/150 ℃ IPC-TM-650 2.4.39A
Volume Resistivity (0.030") 9 X 107   MΩ.cm COND A IPC-TM-650
Surface Resistivity (0.030") 7.2 X 105   COND A IPC-TM-650
PIM -165   dBc 50 ohm 0.060" 43 dBm 1900 MHz
Electrical Strength (0.030") 730 Z V/mil   IPC-TM-650
Flexural Strength MD 181 (26.3)   Mpa (kpsi) RT ASTM D790
CMD 139 (20.2)        
Moisure Absorption 0.093 - % 48/50 IPC-TM-650 ASTM D570
Thermal Conductivity 0.45 Z W/mK 50℃ ASTM D5470
Coefficient of Thermal Expansion 15.9
ppm/℃ -50 ℃to 288℃ IPC-TM-650
Tg >280     IPC-TM-650 2.4.24
Td 411     ASTM D3850
Density 1.58   gm/cm3   ASTM D792
Copper Peel Stength 4.1   pli 1oz,LoPro EDC IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

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Shenzhen Bicheng Electronics Technology Co., Ltd

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Fax: 86-755-27374947

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