MOQ: | 1 PIECE |
Price: | USD2 .99-6.99 per piece |
Standard Packaging: | VACUUM |
Delivery Period: | 8-9 WORKING DAY |
Payment Method: | T/T,Paypal |
Supply Capacity: | 50000 PIECE PER MONTH |
Introducing AD250C: The Electrical Substrate That Packs a Punch!
Hey there, folks! Are you on the hunt for an absolutely awesome electrical substrate that brings top-notch performance and unbeatable reliability to the table? Well, look no further 'cause we've got just the thing for you: AD250C! This bad boy is all set to rock your electronic world with its incredible features, versatile applications, sweet advantages, and a couple of things to keep in mind. Let's dive right in and discover what makes AD250C so freakin' fantastic!
Electrical Properties | AD250C | Units | Test Conditions | Test Method | |
PIM (30mil/60mil) | -159/-163 | dBc | Reflected 43 dBm swept tones at 1900 MHz, S1/S1 | Rogers Internal 50 ohm | |
Dielectric Constant (process) | 2.52 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 (IPC TM-650 2.5.5.3) |
Dielectric Constant (design) | 2.50 | - | C-24/23/50 | 10 GHz | Microstrip Differential Phase Length |
Dissipation Factor (process) | 0.0013 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 |
Thermal Coefficient of Dielectric Constant | -117 | ppm/ºC | 0°C to 100°C | 10 GHz | IPC TM-650 2.5.5.5 |
Volume Resistivity | 4.8 x 108 | Mohm-cm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
Surface Resistivity | 4.1 x 107 | Mohm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
Electrical Strength (dielectric strength) | 979 | V/mil | - | - | IPC TM-650 2.5.6.2 |
Dielectric Breakdown | >40 | kV | D-48/50 | X/Y direction | IPC TM-650 2.5.6 |
Thermal Properties | |||||
Decomposition Temperature (Td) | >500 | ˚C | 2hrs @ 105˚C | 5% Weight Loss | IPC TM-650 2.3.40 |
Coefficient of Thermal Expansion - x | 47 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
Coefficient of Thermal Expansion - y | 29 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
Coefficient of Thermal Expansion - z | 196 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
Thermal Conductivity | 0.33 | W/mK | - | Z direction | ASTM D5470 |
Time to Delamination | >60 | minutes | as-received | 288˚C | IPC TM-650 2.4.24.1 |
Copper Peel Strength after Thermal Stress | 2.6 (14.8) |
N/mm (lbs/in) | 10s @288˚C | 35 μm foil | IPC TM-650 2.4.8 |
Flexural Strength (MD/CMD) | 8.8/6.4 (60.7/44.1) | MPa (ksi ) | 25°C ± 3°C | - | ASTM D790 |
Tensile Strength (MD/CMD) | 6.0/5.6 (41.4/38.6) | MPa (ksi ) | 23°C/50% RH | - | ASTM D3039/D3039-14 |
Flex Modulus (MD/CMD) | 885/778 (6,102/5,364) | MPa (ksi ) | 25°C ± 3°C | - | IPC-TM-650 Test Method 2.4.4 |
Dimensional Stability (MD/CMD) | 0.02/0.06 | mils/inch | after etch + bake | - | IPC-TM-650 2.4.39a |
Physical Properties | |||||
Flammability | V-0 | - | - | - | UL-94 |
Moisture Absorption | 0.04 | % | E1/105 +D48/50 | - | IPC TM-650 2.6.2.1 |
Density | 2.28 | g/cm3 | C-24/23/50 | - | ASTM D792 |
Specific Heat Capacity | 0.813 | J/g°K | 2 hours at 105°C | - | ASTM E2716 |
Unleashing Mind-Blowing Performance:
Applications That'll Blow Your Mind:
AD250C is a true all-rounder, ready to kick some serious electronic butt in a range of applications, including:
Advantages That'll Make Your Jaw Drop:
A Few Things to Keep in Mind:
Now, before you jump headfirst into the AD250C frenzy, here are a couple of things to remember:
So, there you have it, folks! AD250C is the electrical substrate that's ready to rock your electronic world. It's got the performance, versatility, and advantages to deliver a knockout punch to your projects. Get ready to unleash the power of AD250C and take your electronics to a whole new level!
Just a friendly reminder: The information provided is based on available product specifications. For detailed technical info and specific application requirements, be sure to check out the product datasheet and reach out to the manufacturer.
Bicheng takes no responsibility for any variations or discrepancies in specifications. Rock on!
MOQ: | 1 PIECE |
Price: | USD2 .99-6.99 per piece |
Standard Packaging: | VACUUM |
Delivery Period: | 8-9 WORKING DAY |
Payment Method: | T/T,Paypal |
Supply Capacity: | 50000 PIECE PER MONTH |
Introducing AD250C: The Electrical Substrate That Packs a Punch!
Hey there, folks! Are you on the hunt for an absolutely awesome electrical substrate that brings top-notch performance and unbeatable reliability to the table? Well, look no further 'cause we've got just the thing for you: AD250C! This bad boy is all set to rock your electronic world with its incredible features, versatile applications, sweet advantages, and a couple of things to keep in mind. Let's dive right in and discover what makes AD250C so freakin' fantastic!
Electrical Properties | AD250C | Units | Test Conditions | Test Method | |
PIM (30mil/60mil) | -159/-163 | dBc | Reflected 43 dBm swept tones at 1900 MHz, S1/S1 | Rogers Internal 50 ohm | |
Dielectric Constant (process) | 2.52 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 (IPC TM-650 2.5.5.3) |
Dielectric Constant (design) | 2.50 | - | C-24/23/50 | 10 GHz | Microstrip Differential Phase Length |
Dissipation Factor (process) | 0.0013 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 |
Thermal Coefficient of Dielectric Constant | -117 | ppm/ºC | 0°C to 100°C | 10 GHz | IPC TM-650 2.5.5.5 |
Volume Resistivity | 4.8 x 108 | Mohm-cm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
Surface Resistivity | 4.1 x 107 | Mohm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
Electrical Strength (dielectric strength) | 979 | V/mil | - | - | IPC TM-650 2.5.6.2 |
Dielectric Breakdown | >40 | kV | D-48/50 | X/Y direction | IPC TM-650 2.5.6 |
Thermal Properties | |||||
Decomposition Temperature (Td) | >500 | ˚C | 2hrs @ 105˚C | 5% Weight Loss | IPC TM-650 2.3.40 |
Coefficient of Thermal Expansion - x | 47 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
Coefficient of Thermal Expansion - y | 29 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
Coefficient of Thermal Expansion - z | 196 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
Thermal Conductivity | 0.33 | W/mK | - | Z direction | ASTM D5470 |
Time to Delamination | >60 | minutes | as-received | 288˚C | IPC TM-650 2.4.24.1 |
Copper Peel Strength after Thermal Stress | 2.6 (14.8) |
N/mm (lbs/in) | 10s @288˚C | 35 μm foil | IPC TM-650 2.4.8 |
Flexural Strength (MD/CMD) | 8.8/6.4 (60.7/44.1) | MPa (ksi ) | 25°C ± 3°C | - | ASTM D790 |
Tensile Strength (MD/CMD) | 6.0/5.6 (41.4/38.6) | MPa (ksi ) | 23°C/50% RH | - | ASTM D3039/D3039-14 |
Flex Modulus (MD/CMD) | 885/778 (6,102/5,364) | MPa (ksi ) | 25°C ± 3°C | - | IPC-TM-650 Test Method 2.4.4 |
Dimensional Stability (MD/CMD) | 0.02/0.06 | mils/inch | after etch + bake | - | IPC-TM-650 2.4.39a |
Physical Properties | |||||
Flammability | V-0 | - | - | - | UL-94 |
Moisture Absorption | 0.04 | % | E1/105 +D48/50 | - | IPC TM-650 2.6.2.1 |
Density | 2.28 | g/cm3 | C-24/23/50 | - | ASTM D792 |
Specific Heat Capacity | 0.813 | J/g°K | 2 hours at 105°C | - | ASTM E2716 |
Unleashing Mind-Blowing Performance:
Applications That'll Blow Your Mind:
AD250C is a true all-rounder, ready to kick some serious electronic butt in a range of applications, including:
Advantages That'll Make Your Jaw Drop:
A Few Things to Keep in Mind:
Now, before you jump headfirst into the AD250C frenzy, here are a couple of things to remember:
So, there you have it, folks! AD250C is the electrical substrate that's ready to rock your electronic world. It's got the performance, versatility, and advantages to deliver a knockout punch to your projects. Get ready to unleash the power of AD250C and take your electronics to a whole new level!
Just a friendly reminder: The information provided is based on available product specifications. For detailed technical info and specific application requirements, be sure to check out the product datasheet and reach out to the manufacturer.
Bicheng takes no responsibility for any variations or discrepancies in specifications. Rock on!