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Rogers RO3010 PCB 2-layer 1oz copper High-Frequency RF Substrate
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Rogers RO3010 PCB 2-layer 1oz copper High-Frequency RF Substrate
  • name
  • name

Rogers RO3010 PCB 2-layer 1oz copper High-Frequency RF Substrate

MOQ: 1 PIECE
Price: USD2 .99-6.99 per piece
Standard Packaging: VACUUM
Delivery Period: 8-9 WORKING DAY
Payment Method: T/T,Paypal
Supply Capacity: 50000 PIECE PER MONTH
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng Enterprise Limited
Certification
UL
Model Number
BIC-0273-V2.73
Board Material:
Polyimide 25µm
Board Thickness:
0.20 Mm
Surface/Inner Layer Cu Thickness:
35 µm
Surface Finish:
Immersion Gold
Coverlay Colour:
Black
Color Of Silkscreen:
White
Function:
100% Pass Electrical Test
Number Of Layers:
2
Minimum Order Quantity:
1 PIECE
Price:
USD2 .99-6.99 per piece
Packaging Details:
VACUUM
Delivery Time:
8-9 WORKING DAY
Payment Terms:
T/T,Paypal
Supply Ability:
50000 PIECE PER MONTH
Product Description

Announcing Our New Go-To Substrate for High-Performance RF Design - Rogers RO3010

 

We're excited to introduce RO3010, Rogers' latest laminate material perfectly tailored for pushing the boundaries of RF circuit design. This innovative substrate delivers unmatched thermal and electrical stability to help unleash your boldest innovations.

 

Dimensional Precision

With industry-leading dimensional stability from -40°C to 500°C, RO3010 ensures ultra-precise performance even under extreme operating conditions. Its ceramic-composite construction delivers Cohen's thermal expansion as low as 11-16ppm/°C, virtually eliminating warping concerns.

 

Pristine Signal Integrity

Dielectric constant of 10.2 and losses below 0.0022 up to 10GHz provide sparkling clean signal transmission. Complex multilayer circuits benefit from RO3010's ability to maintain tight impedance tolerances at high frequencies.

 

Advanced Thermal Management

Thermal conductivity of 0.95W/mK efficiently dissipates heat, protecting temperature-sensitive components. Its composition also withstands short thermal excursions outside rated ranges.

 

Cutting-Edge Manufacturing

Prototypes use our standard 35μm copper 2-layer stackup with 0.635mm RO3010 core. Multi-layer designs are happily accommodated as well. All boards receive IPC Class 2 processing including immersion silver finishing.

 

Contact the Experts

Push your designs to new frontiers with RO3010 as your foundation. Reach out for custom multilayer configurations, volume pricing or application support from our experienced engineering team. Let's help maximize your innovation's potential.

 

Rogers RO3010 PCB 2-layer 1oz copper High-Frequency RF Substrate 0

Tags: 

led circuit board

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products
PRODUCTS DETAILS
Products

Newly Shipped RF PCB

Rogers PCB Board

Taconic PCB Board

PTFE PCB Board

Flexible Printed Circuit

Multilayer PCB Board

High Temperature PCB

HDI PCB Board

Impedance Controlled PCB

PCB Prototypes

Blog

Arlon PCB Board

Hybrid PCB Board

FR-4 PCB Board

High Frequency PCB

F4B SERIES PCBS
Rogers RO3010 PCB 2-layer 1oz copper High-Frequency RF Substrate
  • name
  • name
Rogers RO3010 PCB 2-layer 1oz copper High-Frequency RF Substrate
MOQ: 1 PIECE
Price: USD2 .99-6.99 per piece
Standard Packaging: VACUUM
Delivery Period: 8-9 WORKING DAY
Payment Method: T/T,Paypal
Supply Capacity: 50000 PIECE PER MONTH
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng Enterprise Limited
Certification
UL
Model Number
BIC-0273-V2.73
Board Material:
Polyimide 25µm
Board Thickness:
0.20 Mm
Surface/Inner Layer Cu Thickness:
35 µm
Surface Finish:
Immersion Gold
Coverlay Colour:
Black
Color Of Silkscreen:
White
Function:
100% Pass Electrical Test
Number Of Layers:
2
Minimum Order Quantity:
1 PIECE
Price:
USD2 .99-6.99 per piece
Packaging Details:
VACUUM
Delivery Time:
8-9 WORKING DAY
Payment Terms:
T/T,Paypal
Supply Ability:
50000 PIECE PER MONTH
Product Description

Announcing Our New Go-To Substrate for High-Performance RF Design - Rogers RO3010

 

We're excited to introduce RO3010, Rogers' latest laminate material perfectly tailored for pushing the boundaries of RF circuit design. This innovative substrate delivers unmatched thermal and electrical stability to help unleash your boldest innovations.

 

Dimensional Precision

With industry-leading dimensional stability from -40°C to 500°C, RO3010 ensures ultra-precise performance even under extreme operating conditions. Its ceramic-composite construction delivers Cohen's thermal expansion as low as 11-16ppm/°C, virtually eliminating warping concerns.

 

Pristine Signal Integrity

Dielectric constant of 10.2 and losses below 0.0022 up to 10GHz provide sparkling clean signal transmission. Complex multilayer circuits benefit from RO3010's ability to maintain tight impedance tolerances at high frequencies.

 

Advanced Thermal Management

Thermal conductivity of 0.95W/mK efficiently dissipates heat, protecting temperature-sensitive components. Its composition also withstands short thermal excursions outside rated ranges.

 

Cutting-Edge Manufacturing

Prototypes use our standard 35μm copper 2-layer stackup with 0.635mm RO3010 core. Multi-layer designs are happily accommodated as well. All boards receive IPC Class 2 processing including immersion silver finishing.

 

Contact the Experts

Push your designs to new frontiers with RO3010 as your foundation. Reach out for custom multilayer configurations, volume pricing or application support from our experienced engineering team. Let's help maximize your innovation's potential.

 

Rogers RO3010 PCB 2-layer 1oz copper High-Frequency RF Substrate 0

Tags: 

led circuit board

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