Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

Home ProductsNewly Shipped RF PCB

RO4360G2 2-layer rigid PCB 20mil with Immersion Gold low loss, glass-reinforced, hydrocarbon ceramic-filled material

RO4360G2 2-layer rigid PCB 20mil with Immersion Gold low loss, glass-reinforced, hydrocarbon ceramic-filled material

  • RO4360G2 2-layer rigid PCB 20mil with Immersion Gold low loss, glass-reinforced, hydrocarbon ceramic-filled material
  • RO4360G2 2-layer rigid PCB 20mil with Immersion Gold low loss, glass-reinforced, hydrocarbon ceramic-filled material
RO4360G2 2-layer rigid PCB 20mil with Immersion Gold low loss, glass-reinforced, hydrocarbon ceramic-filled material
Product Details:
Place of Origin: China
Brand Name: Bicheng Enterprise
Certification: UL
Model Number: BIC-280-V2.80
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 2.99-9.99 PER PIECE
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Western Union
Supply Ability: 45000 pieces per month
Contact Now
Detailed Product Description
Number Of Layers: 2 Board Material: PET 25µm
Surface Cu Thickness: 1.0 Board Thickness: 0.15 Mm +/-10%
Surface Finish: Immersion Gold Solder Mask Color: Yellow Top / White Bottom
Colour Of Component Legend: Black Test: 100% Electrical Test Prior Shipment

RO4360G2 laminates from Rogers Corporation are revolutionizing the field of high-frequency circuit materials. These low loss, glass-reinforced, hydrocarbon ceramic-filled thermoset laminates offer an exceptional combination of performance and processing capabilities. With a dielectric constant (Dk) of 6.15 and lead-free process compatibility, RO4360G2 laminates provide an ideal solution for demanding applications that require high-speed signal transmission and reliable performance.


Features that Set RO4360G2 Apart:

1. Impressive Electrical Performance:

  • Dielectric constant of 6.15+/- 0.15 at 10 GHz/23°C, enabling high-frequency signal integrity.
  • Dissipation factor of 0.0038 at 10 GHz/23°C, ensuring low signal loss and high data transmission efficiency.


2. Temperature and Thermal Stability:

  • Td> 407°C and high glass transition temperature (Tg) greater than 280 °C TMA, making RO4360G2 laminates suitable for challenging environments and high-temperature applications.
  • High thermal conductivity of 0.75 W/mK helps dissipate heat effectively, improving overall performance and reliability.
  • Low Z-axis coefficient of thermal expansion at 28 ppm/°C minimizes the risk of interconnection failures and enhances overall reliability.
  • Copper-matched coefficient of thermal expansion (-55 to 288 °C) ensures excellent dimensional stability in multi-layer board constructions.

3. Processing Flexibility and Cost Efficiency:

  • RO4360G2 laminates exhibit similar processing characteristics to FR-4, enabling smooth integration into existing manufacturing processes and reducing production costs.
  • Better rigidity compared to other materials enhances processability in multi-layer board constructions, resulting in improved yields and cost savings.
  • The compatibility with lead-free processes and 94V-0 flammability rating ensures compliance with environmental regulations and safety standards.


Design Flexibility and Reliability:

  1. RO4360G2 laminates offer design flexibility, allowing for the realization of intricate and high-performance PCB layouts.
  2. Plated through-hole reliability ensures robust connections and reliable signal transmission.
  3. Automated assembly compatibility supports efficient and streamlined manufacturing processes.
  4. Environmentally friendly lead-free process compatibility aligns with sustainable practices and industry regulations.
  5. Efficient supply chain and short lead times make RO4360G2 laminates a cost-effective material option for high-performance PCB designs.


PCB Stackup and Construction Details:

  • The recommended PCB stackup for RO4360G2 laminates is a 2-layer rigid configuration.
  • Copper_layer_1 - 35 μm
  • RO4360G2 Substrate - 20 mil (0.508 mm)
  • Copper_layer_2 - 35 μm
  • The PCB construction details, including dimensions, minimum trace/space, hole size, finished board thickness, copper weight, via plating thickness, surface finish, solder mask, and electrical testing, ensure compliance with IPC-Class-2 standards and reliable performance.

Typical Applications:

  • Base Station Power Amplifiers: RO4360G2 laminates deliver excellent electrical properties, making them well-suited for high-power applications in base station amplifiers.
  • Small Cell Transceivers: With their low loss characteristics, superior thermal stability, and reliable performance, RO4360G2 laminates are an ideal choice for small cell transceiver designs.


RO4360G2 laminates from Rogers Corporation offer a compelling solution for advanced PCB designs that demand high-frequency performance, thermal stability, and reliable signal transmission. With their unique combination of features, RO4360G2 laminates empower engineers to push the boundaries of high-speed communication systems while maintaining cost efficiency and manufacturing flexibility.

Quality Policy
Bicheng has developed series of management procedures and approaches to assure that PCBs are in compliance with the customers' requirements, inclusive of selection of the vendors, work in progress (WIP) inspection, outgoing delivery inspection and customer service etc.
Evaluation and Audit of Suppliers
Suppliers have to be evaluated by Bicheng. In addition, Bicheng will appraise and rank suppliers every year to guarantee the materials supplied are meeting Bicheng’s requirements. Furthermore, Bicheng continuously develop suppliers and supervise them to improve their quality and environment management basing on the systems of ISO9001 & ISO14001.
Contract Evaluation
Bicheng shall review and verify customer's requirements to make sure that we have the capability to satisfy customers' requirements including specifications, delivery and other demands prior to accepting an order.
Making, audit and control of manufacturing data.
When customers' design data and specifications are provided to our market department, Bicheng has to verify all the requirements. Then, convert the design data into manufacturing data by CAM. Finally, a manufacturing instruction (MI) is generated according to the real manufacturing process and technologies for manufacturing department as the basis for actual fabrication. MI must be reviewed by independent engineers and QA engineers before issue.
Incoming Material Quality Control
All materials have to be inspected before warehousing. We established a series of strict inspection procedure and instruction to control the incoming materials. Furthermore, various precise inspecting instruments and apparatus guarantee the capability to judge the material good or not. We issue material with first in first out principle, and give out “alarm” for the material that will reach the shelf life to ensure the materials are used up before expiry.
Control of Production Process
Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled.
Final Control and Inspection
All PCBs have to be gone through the open and short test as well as visual inspection after passed the specified physical tests. We own various advanced test equipment including customized, probe flying test machines to guarantee that each PCB is 100% tested.
Product Delivery Audit
We set up a dedicated FQA department to inspect the PCB products according to the customer's specifications and requirements by sampling. Qualified PCBs are going to be packed.
FQA also has to carry out a 100% audit of the warehouse packing and shipping products, including product number, customer number, product quantity, shipping address and so on prior to shipment.
Customer Service
We sets up a professional customer service team to proactively communicate with customers and timely deal with the customers' feedbacks. We highly focus on customers' needs and to understand customers’ demands, timely to adjust the policy of customer service and PCB product requirements.
RO4360G2 2-layer rigid PCB 20mil with Immersion Gold low loss, glass-reinforced, hydrocarbon ceramic-filled material 0
RO4360G2 2-layer rigid PCB 20mil with Immersion Gold low loss, glass-reinforced, hydrocarbon ceramic-filled material 1

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Mobile Site Privacy PolicyChina pcb board Supplier. Copyright © 2016 - 2024 All Rights Reserved. Developed by ECER