RO4360G2 2-layer rigid PCB 20mil with Immersion Gold low loss, glass-reinforced, hydrocarbon ceramic-filled material

RO4360G2 laminates from Rogers Corporation are revolutionizing the field of high-frequency circuit materials. These low loss, glass-reinforced, hydrocarbon ceramic-filled thermoset laminates offer an exceptional combination of performance and processing capabilities. With a dielectric constant (Dk) of 6.15 and lead-free process compatibility, RO4360G2 laminates provide an ideal solution for demanding applications that require high-speed signal transmission and reliable performance.

Features that Set RO4360G2 Apart:

1. Impressive Electrical Performance:

• Dielectric constant of 6.15+/- 0.15 at 10 GHz/23°C, enabling high-frequency signal integrity.
• Dissipation factor of 0.0038 at 10 GHz/23°C, ensuring low signal loss and high data transmission efficiency.

2. Temperature and Thermal Stability:

• Td> 407°C and high glass transition temperature (Tg) greater than 280 °C TMA, making RO4360G2 laminates suitable for challenging environments and high-temperature applications.
• High thermal conductivity of 0.75 W/mK helps dissipate heat effectively, improving overall performance and reliability.
• Low Z-axis coefficient of thermal expansion at 28 ppm/°C minimizes the risk of interconnection failures and enhances overall reliability.
• Copper-matched coefficient of thermal expansion (-55 to 288 °C) ensures excellent dimensional stability in multi-layer board constructions.

3. Processing Flexibility and Cost Efficiency:

• RO4360G2 laminates exhibit similar processing characteristics to FR-4, enabling smooth integration into existing manufacturing processes and reducing production costs.
• Better rigidity compared to other materials enhances processability in multi-layer board constructions, resulting in improved yields and cost savings.
• The compatibility with lead-free processes and 94V-0 flammability rating ensures compliance with environmental regulations and safety standards.

Design Flexibility and Reliability:

1. RO4360G2 laminates offer design flexibility, allowing for the realization of intricate and high-performance PCB layouts.
2. Plated through-hole reliability ensures robust connections and reliable signal transmission.
3. Automated assembly compatibility supports efficient and streamlined manufacturing processes.
4. Environmentally friendly lead-free process compatibility aligns with sustainable practices and industry regulations.
5. Efficient supply chain and short lead times make RO4360G2 laminates a cost-effective material option for high-performance PCB designs.

PCB Stackup and Construction Details:

• The recommended PCB stackup for RO4360G2 laminates is a 2-layer rigid configuration.
• Copper_layer_1 - 35 μm
• RO4360G2 Substrate - 20 mil (0.508 mm)
• Copper_layer_2 - 35 μm
• The PCB construction details, including dimensions, minimum trace/space, hole size, finished board thickness, copper weight, via plating thickness, surface finish, solder mask, and electrical testing, ensure compliance with IPC-Class-2 standards and reliable performance.

Typical Applications:

• Base Station Power Amplifiers: RO4360G2 laminates deliver excellent electrical properties, making them well-suited for high-power applications in base station amplifiers.
• Small Cell Transceivers: With their low loss characteristics, superior thermal stability, and reliable performance, RO4360G2 laminates are an ideal choice for small cell transceiver designs.

RO4360G2 laminates from Rogers Corporation offer a compelling solution for advanced PCB designs that demand high-frequency performance, thermal stability, and reliable signal transmission. With their unique combination of features, RO4360G2 laminates empower engineers to push the boundaries of high-speed communication systems while maintaining cost efficiency and manufacturing flexibility.