Hybrid PCB on 20mil RO4003C and 4mil RO4350B with 1 oz copper board

In the fast-paced world of advanced electronics, innovation is the key to progress. Hybrid printed circuit boards (PCBs) have emerged as game-changers, revolutionizing traditional board designs by integrating multiple materials into a single circuit board. By leveraging the unique properties of substrates like FR-4, ceramic, flex, or metal core laminates, hybrid PCBs offer unmatched flexibility, enhanced performance, and a wide range of applications. In this article, we delve into the world of hybrid PCBs, focusing on the exceptional features and capabilities of RO4003C and RO4350B substrates.

Exploring Hybrid PCBs:
Hybrid PCBs, also known as mixed construction PCBs, redefine traditional board designs by combining different materials. By carefully selecting and integrating various substrates based on their characteristics, such as thermal management, signal integrity, and mechanical strength, engineers can achieve optimal performance for specific requirements.

Highlighting the Performance of RO4003C:
RO4003C is an outstanding substrate with exceptional characteristics that contribute to its high performance. With a dielectric constant (Dk) of 3.38 +/- 0.05 and a dissipation factor of 0.0027 at 10GHz, it ensures excellent high-frequency performance. RO4003C also offers thermal stability with a thermal coefficient of Dk of 40 ppm/°K and efficient heat dissipation with a thermal conductivity of 0.71W/mk. Its high glass transition temperature (Tg > 280°C TMA) ensures durability.

Empowering Reliability with RO4350B:
RO4350B is another impressive substrate that guarantees reliability in demanding applications. It has a dielectric constant (Dk) of 3.48 +/- 0.05 and a dissipation factor of 0.0037 at 10GHz, ensuring reliable signal transmission. RO4350B provides stability across temperature variations with a thermal coefficient of Dk of 50 ppm/°K and a coefficient of thermal expansion matched to copper. It exhibits remarkable thermal resistance with a decomposition temperature (Td) of 390°C TGA.

Introducing the PCB Stackup:
Our meticulously designed 6-layer rigid PCB stackup showcases the full potential of hybrid constructions. By combining copper layers, RO4003C and RO4350B cores, and RO4450F prepregs, this stackup ensures optimal signal integrity, mechanical strength, and thermal management. The strategic selection and arrangement of materials lay the foundation for diverse applications with superior performance.

Detailed PCB Construction:
Our hybrid PCBs have a finished board thickness of 1.6mm, striking a balance between durability and performance. The outer layers feature a 1oz (1.4 mils) copper weight, providing robustness. The boards have a minimum trace/space of 6/6 mils, enabling precise routing. With a minimum hole size of 0.4mm, they accommodate various component requirements. The boards offer reliable connectivity with a via plating thickness of 20 μm. Rigorous testing, including a 100% electrical test, ensures the quality and reliability of the boards.

Versatility for Various Applications:
Hybrid PCBs find applications in industries such as cellular base station antennas, automotive radar and sensors, RF identification tags, and direct broadcast satellite LNBs. Their ability to optimize performance for specific applications makes them indispensable for engineers pushing the boundaries of technology and innovation.

Superior Quality Standard and Global Availability:
Our hybrid PCBs adhere to the IPC-Class-2 quality standard, ensuring reliability and consistency. With global availability, we cater to customers worldwide, providing tailored hybrid PCB solutions to meet their specific requirements.

Conclusion:
Hybrid PCBs represent a significant advancement in advanced electronics. By harnessing the exceptional performance and versatility of RO4003C and RO4350B substrates, these PCBs unlock new possibilities for engineers to create groundbreaking designs. Embrace the power of hybrid PCBs and unlock the full potential of your next electronic masterpiece.

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