6-Layer Rigid-flex circuits 1.0mm Thick (4-layer flex with air gap) S1000-2M Rigid - 0.565 mm (22.2mil) R-F777 0.075mm

Comprehensive Exploration of Rigid-Flex Circuits: Unveiling the Fusion of Rigidity and Flexibility

Introduction:
Rigid-flex circuits have emerged as an ingenious solution that seamlessly integrates both rigidity and flexibility, opening up a plethora of possibilities for electronic applications. This article dives deep into the world of rigid-flex circuits, offering an in-depth understanding of their key features, with a specific focus on the S1000-2M (FR-4) and R-F777 (Polyimide) materials. Additionally, it provides a detailed analysis of a sample PCB stackup, delves into construction nuances, presents insightful statistics, sheds light on accepted standards, and explores an array of typical applications.

Unveiling the World of Rigid-Flex Circuits:
Rigid-flex circuits are engineered to harmoniously combine the structural integrity of rigid boards with the adaptability of flexible circuits. The manufacturing process involves meticulously creating separate flexible circuits and rigid boards, which are then seamlessly bonded together. The integration is achieved through the utilization of plated-through holes, establishing essential electrical connections between the flexible and rigid sections.

Key Features of S1000-2M (FR-4):

• S1000-2M (FR-4) laminate takes the spotlight as a lead-free compatible material.
• It boasts an impressive Tg180℃ (DSC) and exhibits full compatibility with UV blocking and AOI.
• Exceptional heat resistance and a reduced Z-axis CTE ensure enhanced reliability.
• Notably, S1000-2M (FR-4) exhibits excellent through-hole reliability and Anti-CAF performance.
• The material showcases low water absorption while offering excellent mechanical processability.

Key Features of R-F777 (Polyimide):

• R-F777 (Polyimide) material steals the show with its diverse thickness options: 25μm, 50μm, and 75μm.
• Copper types, including ED copper and RA copper, present a range of thickness options: 12μm, 18μm, and 35μm.
• The material showcases a Coefficient of Thermal Expansion (CTE) ranging from 18.5-19.7 ppm/K.
• With an impressive Tg value of 350℃, R-F777 (Polyimide) exhibits exceptional soldering resistance within the range of 280-350℃.
• It holds a UL 94V-0 flammability rating, ensuring high safety standards.

PCB Stackup: An In-Depth Look at a 6-Layer Rigid-Flex PCB (4-Layer Flex with Air Gap):

• The article provides meticulous specifications of layer thickness and materials used in the stackup.
• PCB Construction Details:
• Detailed specifications of board dimensions, trace/space, and hole sizes are presented.
• The article sheds light on the finished board thickness and flex part thickness, ensuring accuracy in design considerations.
• Finished copper weight, via plating thickness, and surface finish are meticulously discussed.
• Silkscreen colors, solder mask colors, and the importance of electrical testing are addressed.

PCB Statistics:
The article offers valuable insights into component count, pad count, via count, and network connections, aiding in design optimization.

Artwork and Standard:
The article emphasizes the utilization of Gerber RS-274-X as the accepted artwork format.
IPC-Class-2 stands as the industry standard for ensuring high-quality PCB production.

Worldwide Availability:
The global availability of the featured PCBs is emphasized, ensuring accessibility for designers worldwide.

Typical Applications:
The article explores a diverse range of potential applications, including computer systems, communication devices, automotive electronics, and more.

Conclusion:
Rigid-flex circuits present an innovative solution that merges rigidity and flexibility seamlessly, unlocking countless possibilities in electronic design. A comprehensive understanding of their key features, stackup configurations, construction details, and statistical insights empowers designers to harness their full potential for specific applications. With the availability of materials like S1000-2M (FR-4) and R-F777 (Polyimide) worldwide, designers can explore a wide range of options to bring their visions to life.

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