Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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Rogers RO3003 ceramic-filled PTFE composites 8-layer rigid 0.5oz PCB ENIG mutilayer circuit board

Rogers RO3003 ceramic-filled PTFE composites 8-layer rigid 0.5oz PCB ENIG mutilayer circuit board

  • Rogers RO3003 ceramic-filled PTFE composites 8-layer rigid 0.5oz PCB ENIG mutilayer circuit board
Rogers RO3003 ceramic-filled PTFE composites 8-layer rigid 0.5oz PCB ENIG mutilayer circuit board
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-267-V3.94
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD9.99-99.99
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
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Detailed Product Description
Board Material: FR-4 + Polyimide 25µm Shengyi 60℃ Board Thickness: 1.4mm
Surface Cu Thickness: 35 µm Inner Iayer Cu Thicknes: 18 µm
Surface Finish: Immersion Gold Coverlay Colour: Yellow Coverlayer / Green Solder Mask
Color Of Silkscreen: White Function: 100% Pass Electrical Test

At the core of our PCB lies the utilization of Rogers RO3003 ceramic-filled PTFE composites, renowned for their exceptional quality and reliability. Optimal signal transmission and unwavering stability are ensured by a dielectric constant of 3.0 at 10 GHz and 23°C. Furthermore, minimal power loss is guaranteed with an impressively low dissipation factor of 0.001 at 10 GHz and 23°C, allowing for maximum efficiency in every application. Flawless operation within a temperature range of -40℃ to +85℃ solidifies this PCB's reputation for unwavering reliability, even in the harshest environments.


Rogers RO3003 ceramic-filled PTFE composites 8-layer rigid 0.5oz PCB ENIG mutilayer circuit board 0


The meticulous 8-layer stackup configuration has set new standards for functionality and versatility. Precision-engineered copper layers, measuring 18 μm in thickness, seamlessly integrate into the stackup, facilitating optimal conductivity. Robust adhesion and structural integrity are achieved with thin bondply 2929 layers, measuring 0.076 mm. The Rogers 3003 substrates, with a thickness of 0.127 mm, enhance the board's strength and resilience, providing a solid foundation for exceptional performance.


Every aspect of the construction has been carefully considered, resulting in a PCB that excels in form and function. With dimensions measuring 237mm x 70.1mm, this compact yet powerful board offers a perfect balance between size and capability. Intricate circuit designs are made possible by the minimum trace and space width of 4/4 mils, pushing the boundaries of innovation. Seamless integration with a wide range of components is achieved with a minimum hole size of 0.4mm, opening up possibilities for diverse applications.


Specifications Values
Board Dimensions 237mm x 70.1mm (+/- 0.15mm)
Minimum Trace/Space 4/4 mils
Minimum Hole Size 0.4mm
Blind Vias L5-L8
Finished Board Thickness 1.0mm
Finished Cu Weight 0.5 oz (0.7 mils) inner layers <br> 1 oz (1.4 mils) outer layers
Via Plating Thickness 1 mil
Surface Finish Immersion Gold
Top Silkscreen White
Bottom Silkscreen White
Top Solder Mask Green
Bottom Solder Mask Green


Connectivity options are elevated to new heights with blind vias L5-L8, providing versatile communication channels between layers. The finished thickness of 1.0mm strikes a harmonious balance between durability and space efficiency. Optimal conductivity throughout the board is ensured with the presence of 0.5 oz (0.7 mils) copper weight in the inner layers and 1 oz (1.4 mils) copper weight in the outer layers. Every electrical connection is meticulously crafted, maintaining a via plating thickness of 1 mil, guaranteeing reliable performance.


Aesthetics and protection go hand in hand with our carefully designed surface finish. Impeccable protection and seamless soldering are facilitated by the immersion gold coating. The top and bottom silkscreens, elegantly displayed in classic white, provide clear labeling and identification of components, enhancing the board's usability. The green solder masks on both surfaces provide durability and safeguard against external elements, ensuring longevity and reliability.


With a total of 190 integrated components and 248 pads, ample connectivity options are offered for a wide range of applications. Dedicated pads for through-hole components amount to 151, while 73 top surface-mounted pads and 24 bottom surface-mounted pads cater to specific needs. Enhanced versatility and connectivity are achieved with the inclusion of 219 vias. Seamlessly communicating through 125 interconnected nets, the components form a cohesive system, ensuring optimal performance.


The renowned IPC-Class-2 quality standard is strictly adhered to, exemplifying our commitment to excellence. Each PCB undergoes a rigorous 100% electrical test, guaranteeing flawless functionality and adherence to the highest quality standards. With our globally available shipment, customers from all corners of the world can experience the exceptional features and performance of this PCB.


For any technical inquiries or further information, unparalleled support and guidance are provided by our dedicated sales representative, Sally Mao. Reach out to Sally at, and she will ensure your needs are addressed.


Experience the future of PCB technology with our cutting-edge creation. Unlock new possibilities and elevate your projects to new heights with our exceptional PCB. Reliability, performance, and versatility like never before await you.

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
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