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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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RF-35 PCB 20mil (0.508 mm) Double sided with Immersion Tin 35 μm Copper

RF-35 PCB 20mil (0.508 mm) Double sided with Immersion Tin 35 μm Copper

  • RF-35 PCB  20mil (0.508 mm) Double sided with Immersion Tin 35 μm Copper
  • RF-35 PCB  20mil (0.508 mm) Double sided with Immersion Tin 35 μm Copper
RF-35 PCB  20mil (0.508 mm) Double sided with Immersion Tin 35 μm Copper
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-251-V3.28
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD9.99-99.99
Packaging Details: Vacuum
Delivery Time: 7 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
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Detailed Product Description
Board Material: Polyimide (PI) 25um ITEQ 60℃ Board Thickness: 0.1mm +/-10%
Surface Cu Thickness: 35 Um (1 Oz) Surface Finish: Immersion Gold
Coverlay Colour: Yellow Color Of Silkscreen: White
Function: 100% Pass Electrical Test

Substrate Material

Taconic RF-35 substrate is a member of the Taconic ORCER family and is constructed with a PTFE ceramic woven glass composite material. The tightly-controlled weave of glass reinforcement threads stabilizes mechanical properties while the PTFE matrix maintains an exceptionally smooth surface ideal for high frequency use.

 

With a dielectric constant of just 3.5 and minuscule dissipation factor of 0.0018 measured precisely at 1.9GHz, RF-35 exhibits outstanding electrical performance in this key frequency band where losses really matter. Its breakdown voltage of 41kV also far exceeds the voltage handling needed in most PCB-based radio applications.

 

  • Dielectric Constant at 1.9GHz: 3.5, maintaining optimal signal integrity.
  • Dissipation Factor at 1.9GHz: 0.0018, minimizing signal loss and distortion.
  • Dielectric Breakdown: 41 kV, ensuring safety and reliability.
  • Coefficient of Thermal Expansion (CTE): x-y CTE 19 ppm/°C, 24 ppm/°C, z CTE 64 ppm/°C, providing dimensional stability under varying temperature conditions.

 

Board Construction

A simple yet effective 2-layer stacked design layers 35um copper on each side of a 20mil thick RF-35 core. Meticulously rolled to a finished board thickness of 0.6mm, this uniform stackup enables reliable impedance control for transmission lines running at GHz speeds.

 

Capability for 6/4mil trace/space parameters and 0.3mm micro-vias allows dense packing components and circuitry into each unique 115x59mm board footprint. With 25 surface mount and plated through-hole positions available and a total pad count of 168, complex network designs can be realized.

 

Functions:

The 2-Layer PCB serves as a key component in electronic circuits, providing essential functions such as:

  • Signal Transmission: Efficiently transfers signals between different components, ensuring seamless communication within the circuit.
  • Power Distribution: Distributes power evenly throughout the circuit, delivering the required voltage and current to various components.
  • Mechanical Support: Acts as a sturdy foundation, providing mechanical support and protection against external stresses and vibrations.
  • Component Mounting: Offers a secure platform for mounting and soldering electronic components, ensuring proper alignment and connection.

 

Advantages:

  • Excellent signal integrity up to 2GHz from low-Dk, low loss RF-35 substrate
  • Enabled GHz circuit densities with 6/4 mil trace/spacing rule
  • Global supply chain simplifies large-scale procurement
  • IPC Class 2 workmanship ensures quality and reliability
  • Cost-effective for volume production runs

 

Disadvantages:

  • Limited to basic 2-layer design complexity
  • Fixed board size of 115x59mm may not accommodate all components
  • Not suitable for systems requiring embedded passives or interlayer connectivity
  • Higher cost than mainstream FR-4 PCBs for non-RF applications
  • Substrate material availability could impact lead times versus standard laminates

 

Applications:

  • Power Amplifiers: Provides a reliable platform for power amplifier circuits, ensuring efficient amplification of signals.
  • Filters and Couplers: Enables the implementation of filters and couplers for signal conditioning and frequency manipulation.
  • Passive Components: Supports the integration of passive components such as resistors, capacitors, and inductors.

 

Contact Information:
For any technical inquiries or further information, please contact Sally Mao at sales@bichengpcb.com.

 

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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