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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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RF-10 Printed Circuit Board 10mil 20mil 60mil Taconic RF-10 High Frequency PCB Low Loss High DK RF PCB

RF-10 Printed Circuit Board 10mil 20mil 60mil Taconic RF-10 High Frequency PCB Low Loss High DK RF PCB

  • RF-10 Printed Circuit Board 10mil 20mil 60mil Taconic RF-10 High Frequency PCB Low Loss High DK RF PCB
  • RF-10 Printed Circuit Board 10mil 20mil 60mil Taconic RF-10 High Frequency PCB Low Loss High DK RF PCB
  • RF-10 Printed Circuit Board 10mil 20mil 60mil Taconic RF-10 High Frequency PCB Low Loss High DK RF PCB
  • RF-10 Printed Circuit Board 10mil 20mil 60mil Taconic RF-10 High Frequency PCB Low Loss High DK RF PCB
  • RF-10 Printed Circuit Board 10mil 20mil 60mil Taconic RF-10 High Frequency PCB Low Loss High DK RF PCB
RF-10 Printed Circuit Board 10mil 20mil 60mil Taconic RF-10 High Frequency PCB Low Loss High DK RF PCB
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-181-V1.09
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 9.99-99.99
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Western Union
Supply Ability: 45000 pieces per month
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Detailed Product Description
Number Of Layers: 2 Glass Epoxy: RF-10
Final Foil: 1 Oz Final Height Of PCB: 0.3 Mm ±10%
Surface Finish: Immersion Gold Solder Mask Color: Green
Colour Of Component Legend: White Test: 100% Electrical Test Prior Shipment

RF-10 Printed Circuit Board Low Loss High DK RF PCB 10mil 20mil 60mil Taconic RF-10 High Frequency PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
 
General Description
Taconic's RF-10 laminates are composites of ceramic filled PTFE and woven fiberglass, which have the advantage of high dielectric constant (10.2 10GHz) and low dissipation factor (0.0025 10GHz). Thin woven fiberglass reinforcement is used to offer both low dielectric loss and improved rigidity for ease of handling and improved dimensional stability for multilayer circuits.
 
RF-10 high frequency materials are engineered to provide a cost effective substrates, responding to a need in RF applications for size reduction. It bonds well to smooth low profile copper too. The low dissipation combined with the use of very smooth copper results in optimal insertion losses at higher frequency where skin effect losses play a substantial role.
 
Features Benefits
1. Excellent adhesion to smooth coppers
2. Excellent dimensional stability
3. Excellent price/performance ratio
4. High thermal conductivity for enhanced thermal management
5. High DK for RF circuit size reduction
6. Low 0.0025 loss tangent @ 10 GHz
7. Low X, Y, Z expansion
8. Tight DK tolerance (10.2 +/-0.3)
 
RF-10 Printed Circuit Board 10mil 20mil 60mil Taconic RF-10 High Frequency PCB Low Loss High DK RF PCB 0
RF-10 Printed Circuit Board 10mil 20mil 60mil Taconic RF-10 High Frequency PCB Low Loss High DK RF PCB 1
 
Typical Applications
1. Aircraft Collision Avoidance Systems
2. GPS Antennas
3. Microstrip Patch Antennas
4. Passive Components (filters, couplers, power dividers)
5. Satellite Components
 
Our PCB Capability (RF-10)

PCB Material:Composites of Ceramic Filled PTFE and Woven Fiberglass
Designation:RF-10
Dielectric constant:10.2
Dissipation Factor0.0025 10GHz
Layer count:Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm )
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 
RF-10 Typical Values

PropertyTest MethodUnitValueUnitValue
Dk @ 10 GHzIPC-650 2.5.5.5.1 Mod. 10.2 ± 0.3 10.2 ± 0.3
Df @ 10 GHzIPC-650 2.5.5.5.1 Mod. 0.0025 0.0025
TcK† (-55 to 150 °C)IPC-650 2.5.5.6ppm/°C-370ppm/°C-370
Moisture AbsorptionIPC-650 2.6.2.1%0.08%0.08
Peel Strength (1 oz. RT copper)IPC-650 2.4.8 (solder)lbs/in10N/mm1.7
Volume ResistivityIPC-650 2.5.17.1Mohm/cm6.0 x 107Mohm/cm6.0 x 107
Surface ResistivityIPC-650 2.5.17.1Mohm1.0 x 108Mohm1.0 x 108
Flexural Strength (MD)IPC - 650 - 2.4.4psi14,000N/mm296.53
Flexural Strength (CD)IPC - 650 - 2.4.4psi10,000N/mm268.95
Tensile Strength (MD)IPC - 650 - 2.4.19psi8,900N/mm262.57
Tensile Strength (CD)IPC - 650 - 2.4.19psi5,300N/mm237.26
Dimensional StabilityIPC-650 2.4.39 (After Etch)% (25 mil-MD)-0.0032% (25 mil-CD)-0.0239
Dimensional StabilityIPC-650 2.4.39 (After Bake)% (25 mil-MD)-0.0215% (25 mil-CD)-0.0529
Dimensional StabilityIPC-650 2.4.39 (After Stress)% (25 mil-MD)-0.0301% (25 mil-CD)-0.0653
Dimensional StabilityIPC-650 2.4.39 (After Etch)% (60 mil-MD)-0.0027% (60 mil-CD)-0.0142
Dimensional StabilityIPC-650 2.4.39 (After Bake)% (60 mil-MD)-0.1500% (60 mil-CD)-0.0326
Dimensional StabilityIPC-650 2.4.39 (After Stress)% (60 mil-MD)-0.0167% (60 mil-CD)-0.0377
Density (Specific Gravity)IPC-650-2.3.5g/cm32.77g/cm32.77
Specific HeatIPC-650-2.4.50J/g°C0.9J/g°C0.9
Thermal Conductivity (Unclad)IPC-650-2.4.50W/M*K0.85W/M*K0.85
CTE (X -Y axis) (50 to 150 °C)IPC-650 2.4.41ppm/°C16-20ppm/°C16-20
CTE (Z axis) (50 to 150 °C)IPC-650 2.4.41ppm/°C25ppm/°C25
Flammability RatingInternal V-0 V-0
 
 
RF-10 Printed Circuit Board 10mil 20mil 60mil Taconic RF-10 High Frequency PCB Low Loss High DK RF PCB 2

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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