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Metal Core PCB Built On Copper Base With Lead Free

Metal Core PCB Built On Copper Base With Lead Free

MOQ: 1
Price: USD40~50
Standard Packaging: Vacuum
Delivery Period: 5-6 working days
Payment Method: T/T, Paypal
Supply Capacity: 45000 pieces per month
Detail Information
Place of Origin
China
Brand Name
Bicheng Enterprise Limited
Certification
UL
Model Number
BIC-0586-V5.86
Board Material:
Aluminum PCB, MCPCB ITEQ 150℃
Board Thickness:
1.20 Mm +/-0.1
Surface Cu Thickness:
280 Um (8 Oz)
Surface Finish:
OSP
Solder Mask Colour:
N/A
Color Of Silkscreen:
N/A
Function:
100% Pass Electrical Test
Minimum Order Quantity:
1
Price:
USD40~50
Packaging Details:
Vacuum
Delivery Time:
5-6 working days
Payment Terms:
T/T, Paypal
Supply Ability:
45000 pieces per month
Product Description

General Profile

 


Metal core PCB is thermal management circuit board used in LED lighting which
needs fast cooling dissipation. The metal core can be aluminum (aluminum core
PCB) and copper (copper core PCB), even iron base. The fastest speed of heat
transfer is on copper which is designed in the form of thermoelectric separation.

 

 

 

Advantages

 


1) Effective heat dissipation reduces the operating temperature of the module
    and prolongs the service life;
2) Power density and reliability are improved up 10%;
3) Reduce the dependence of heat sinks and other hardware (including thermal
    interface materials);
4) Reduce the volume of the product;
5) Reduce the cost of hardware and assembly;
6) Optimization combination of power circuit and control circuit;
7) Replace the fragile ceramic substrate and obtain a better mechanical durability;
8) Reduce the operating temperature of the equipment;

 

 

 

Applications

 


LED lighting, Switch regulator, DC/AC converter, Communication electronic
equipment, A filter electric circuit, Office automation equipment, Motor driver,
Motor controller, Automobile etc.

 

 

 

Metal Core PCB Capability

NO. Parameter Value
1 Type of Metal Core Aluminum, Copper, Iron
2 Model of Metal Core A1100, A5052, A6061, A6063, C1100
3 Surface Finish HASL, Immersion Gold, Immersion Silver, OSP
4 Thickness of Surface plating HASL: Sn>2.54µm, ENIG: Au 0.025-0.1µm, Ni 2.5-5µm
5 Layer Count 1-4 Layers
6 Maximum of Board Size 23" x 46" (584mm×1168mm)
7 Mininum of Board Size 0.1969" x 0.1969" (5mm×5mm)
8 Board Thickness 0.0157" x 0.2362" (0.4-6.0mm)
9 Copper Thickness

0.5OZ(17.5µm),1OZ(35µm),

2OZ(70µm),3OZ(105µm),

4OZ(140µm) to 10oz (350µm)

10 Minimum Track Width 5mil (0.127mm)
11 Minimum Space 5mil (0.127mm)
12 Minimum Hole Size 0.0197" (0.5mm)
13 Maximum Hole Size No limit
14 Minimum Holes Punched PCB thickness <1.0mm: 0.0394" (1.0mm)
PCB thikness 1.2-3.0mm: 0.0591" (1.5mm)
15 PTH Wall Thickness >20µm
16 Tolerance of PTH ±0.00295" (0.075mm)
17 Tolerance of NPTH ±0.00197" (0.05mm)
18 Deviation of Hole Position ±0.00394" (0.10mm)
19 Outline Tolerance Routing: ±0.00394" (0.1mm)
Punching: ±0.00591" (0.15mm)
20 Angle of V-cut 30°, 45°, 60°
21 V-cut Size 0.1969" x 47.24" (5mm×1200mm)
22 Thickness of V-cut Board 0.0236" x 0.1181" (0.6-3mm)
23 Tolerance of V-cut Angle ±5º
24 V-CUT Verticality ≤0.0059" (0.15mm)
25 Minimum Square Slots Punched PCB thickness < 1.0mm: 0.0315" x 0.0315" (0.8 x 0.8mm)
PCB thickness 1.2-3.0mm: 0.0394" x 0.0394" (1.0 x 1.0mm)
26 Minimum BGA PAD 0.01378" (0.35mm)
27 Minimum Width of Solder Mask Bridge. 8mil (0.2032mm)
28 Minimum Thickness of Solder Mask >13µm (0.013mm)
29 Insulation Resistance 1012ΩNormal
30 Peel-off Strength 2.2N/mm
31 Solder float 260℃ 3min
32 E-test Voltage 50-250V
33 Thermal Conductivity 0.8-8W/M.K
34 Warp or Twist ≤0.5%
35 Flammability FV-0
36 Minimum Height of Component indicator 0.0059"(0.15mm)
37 Minimum Open Solder Mask on Pad 0.000394" (0.01mm)

 

Metal Core PCB Built On Copper Base With Lead Free 0

Metal Core PCB Built On Copper Base With Lead Free 1

products
PRODUCTS DETAILS
Metal Core PCB Built On Copper Base With Lead Free
MOQ: 1
Price: USD40~50
Standard Packaging: Vacuum
Delivery Period: 5-6 working days
Payment Method: T/T, Paypal
Supply Capacity: 45000 pieces per month
Detail Information
Place of Origin
China
Brand Name
Bicheng Enterprise Limited
Certification
UL
Model Number
BIC-0586-V5.86
Board Material:
Aluminum PCB, MCPCB ITEQ 150℃
Board Thickness:
1.20 Mm +/-0.1
Surface Cu Thickness:
280 Um (8 Oz)
Surface Finish:
OSP
Solder Mask Colour:
N/A
Color Of Silkscreen:
N/A
Function:
100% Pass Electrical Test
Minimum Order Quantity:
1
Price:
USD40~50
Packaging Details:
Vacuum
Delivery Time:
5-6 working days
Payment Terms:
T/T, Paypal
Supply Ability:
45000 pieces per month
Product Description

General Profile

 


Metal core PCB is thermal management circuit board used in LED lighting which
needs fast cooling dissipation. The metal core can be aluminum (aluminum core
PCB) and copper (copper core PCB), even iron base. The fastest speed of heat
transfer is on copper which is designed in the form of thermoelectric separation.

 

 

 

Advantages

 


1) Effective heat dissipation reduces the operating temperature of the module
    and prolongs the service life;
2) Power density and reliability are improved up 10%;
3) Reduce the dependence of heat sinks and other hardware (including thermal
    interface materials);
4) Reduce the volume of the product;
5) Reduce the cost of hardware and assembly;
6) Optimization combination of power circuit and control circuit;
7) Replace the fragile ceramic substrate and obtain a better mechanical durability;
8) Reduce the operating temperature of the equipment;

 

 

 

Applications

 


LED lighting, Switch regulator, DC/AC converter, Communication electronic
equipment, A filter electric circuit, Office automation equipment, Motor driver,
Motor controller, Automobile etc.

 

 

 

Metal Core PCB Capability

NO. Parameter Value
1 Type of Metal Core Aluminum, Copper, Iron
2 Model of Metal Core A1100, A5052, A6061, A6063, C1100
3 Surface Finish HASL, Immersion Gold, Immersion Silver, OSP
4 Thickness of Surface plating HASL: Sn>2.54µm, ENIG: Au 0.025-0.1µm, Ni 2.5-5µm
5 Layer Count 1-4 Layers
6 Maximum of Board Size 23" x 46" (584mm×1168mm)
7 Mininum of Board Size 0.1969" x 0.1969" (5mm×5mm)
8 Board Thickness 0.0157" x 0.2362" (0.4-6.0mm)
9 Copper Thickness

0.5OZ(17.5µm),1OZ(35µm),

2OZ(70µm),3OZ(105µm),

4OZ(140µm) to 10oz (350µm)

10 Minimum Track Width 5mil (0.127mm)
11 Minimum Space 5mil (0.127mm)
12 Minimum Hole Size 0.0197" (0.5mm)
13 Maximum Hole Size No limit
14 Minimum Holes Punched PCB thickness <1.0mm: 0.0394" (1.0mm)
PCB thikness 1.2-3.0mm: 0.0591" (1.5mm)
15 PTH Wall Thickness >20µm
16 Tolerance of PTH ±0.00295" (0.075mm)
17 Tolerance of NPTH ±0.00197" (0.05mm)
18 Deviation of Hole Position ±0.00394" (0.10mm)
19 Outline Tolerance Routing: ±0.00394" (0.1mm)
Punching: ±0.00591" (0.15mm)
20 Angle of V-cut 30°, 45°, 60°
21 V-cut Size 0.1969" x 47.24" (5mm×1200mm)
22 Thickness of V-cut Board 0.0236" x 0.1181" (0.6-3mm)
23 Tolerance of V-cut Angle ±5º
24 V-CUT Verticality ≤0.0059" (0.15mm)
25 Minimum Square Slots Punched PCB thickness < 1.0mm: 0.0315" x 0.0315" (0.8 x 0.8mm)
PCB thickness 1.2-3.0mm: 0.0394" x 0.0394" (1.0 x 1.0mm)
26 Minimum BGA PAD 0.01378" (0.35mm)
27 Minimum Width of Solder Mask Bridge. 8mil (0.2032mm)
28 Minimum Thickness of Solder Mask >13µm (0.013mm)
29 Insulation Resistance 1012ΩNormal
30 Peel-off Strength 2.2N/mm
31 Solder float 260℃ 3min
32 E-test Voltage 50-250V
33 Thermal Conductivity 0.8-8W/M.K
34 Warp or Twist ≤0.5%
35 Flammability FV-0
36 Minimum Height of Component indicator 0.0059"(0.15mm)
37 Minimum Open Solder Mask on Pad 0.000394" (0.01mm)

 

Metal Core PCB Built On Copper Base With Lead Free 0

Metal Core PCB Built On Copper Base With Lead Free 1

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