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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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Rogers RF and Microwave PCB on 60mil 1.524mm AD250C Substrates With Immersion Gold

Rogers RF and Microwave PCB on 60mil 1.524mm AD250C Substrates With Immersion Gold

  • Rogers RF and Microwave PCB on 60mil 1.524mm AD250C Substrates With Immersion Gold
  • Rogers RF and Microwave PCB on 60mil 1.524mm AD250C Substrates With Immersion Gold
  • Rogers RF and Microwave PCB on 60mil 1.524mm AD250C Substrates With Immersion Gold
Rogers RF and Microwave PCB on 60mil 1.524mm AD250C Substrates With Immersion Gold
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-208-V5.9
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 9.99-99.99
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T
Supply Ability: 50000 pieces per month
Contact Now
Detailed Product Description
Base Material: AD250C Final Height Of PCB: 1.6mm ±0.16
Final Foil External: 1 Oz Surface Finish: ENIG
Solder Mask Color: N/A Colour Of Component Legend: N/A
TEST: 100% Electrical Test Prior Shipment

Rogers RF and Microwave PCB on 60mil 1.524mm AD250C Substrates With Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

This is a type of double layer high frequency PCB built on Rogers AD250C antenna grade materials with dielectric constant of 2.50 and 0.0013 dissipation factor. It is 60mil thick with 1oz copper on both sides, no solder mask and silkscreen. It’s designed with 90mm by 90mm and immersion gold on pads.The boards are fabricated strictly as per IPC-Class-II and 100% electrical tested before delivery. 25 boards are vacuum packed for shipment.

 

PCB Specifications

PCB SIZE 90mm x 90mm=1 piece
BOARD TYPE High Frequency PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components N/A
LAYER STACKUP copper ------- 35um(1 oz)+plate top layer
AD250C 1.524mm
copper ------- 35um(1 oz)+plate bot layer
TECHNOLOGY  
Minimum Trace and Space: 80 mil
Minimum / Maximum Holes: 1.0 mm / 2.8 mm
Number of Different Holes: 2
Number of Drill Holes: 9
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: AD250C 1.524mm
Final foil external: 2.0 oz
Final foil internal: 2.0 oz
Final height of PCB: 1.6 mm ±0.1
PLATING AND COATING  
Surface Finish Immersion Gold, 73.6%
Solder Mask Apply To: Both sides
Solder Mask Color: N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 1.0mm.
FLAMIBILITY RATING 94V-0
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

Rogers RF and Microwave PCB on 60mil 1.524mm AD250C Substrates With Immersion Gold 0

 

Features & Benefits

1. Very low loss PTFE and ceramic filled composite (0.0014 loss tangent at 10GHz)

2. Dielectric constant (Dk) of 2.50 +/-0.04

3. Low profile copper for lower conductive losses

4. Higher antenna efficiencies

5. Low PIM for antenna applications

6. Powerful PCB capabilities support your research and development, sales and marketing;

7. 16000㎡ workshop; 30000㎡ output capability per month; 8000 types of PCB's per month;

8. ISO9001, ISO14001, IATF16949, ISO13485, UL Certified factory.

9. Delivery on time higher than 98% on-time-delivery rate;

10. Prototype PCB capability to Volume Production capability;

 

Typical Applications

1.Cellular infrastructure base station antenna

2. Automotive telematics antenna systems

3. Commercial satellite radio antenna

 

PCB Capability (2022)

Parameter Value
 Layer Counts  1-32
 Substrate Materials RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; RT/duroid 5880LZ; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350; TC600; DiClad 880, DiClad 870, DiClad 527; IsoClad 917; Nelco N4000, N9350, N9240; SCGA-500 GF220, SCGA-500 GF255, SCGA-500 GF265, SCGA-500 GF300; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
 Maximum Size  Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
 Board Outline Tolerance  ±0.0059" (0.15mm)
 PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)  ±8%
Thickness Tolerance(t<0.8mm)  ±10%
 Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
 Minimum Track 0.003" (0.075mm)
 Minimum Space  0.003" (0.075mm)
 Outer Copper Thickness  35µm--350µm (1oz-10oz)
 Inner Copper Thickness  17µm--350µm (0.5oz - 10oz)
 Drill Hole(Mechanical) 0.0079" - 0.25" (0.2mm--6.35mm)
 Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
 Registration (Mechanical) 0.00197" (0.05mm)
 Aspect Ratio  12:1
 Solder Mask Type  LPI
 Min Soldermask Bridge 0.00315" (0.08mm)
 Min Soldermask Clearance 0.00197" (0.05mm)
 Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance  ±10%
 Surface Finish HASL,HASL LF,ENIG,Immersion Tin,Immersion Silver, OSP, Gold Finger, Pure gold plated etc.

 

Rogers RF and Microwave PCB on 60mil 1.524mm AD250C Substrates With Immersion Gold 1

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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