AGC Multi Material High-Volume TLX-6 DK 2.65 Fiberglass-Reinforced Microwave Substrate & Custom 2-Layer 3.5mil PCB Solution
Contact Person : Sally Mao
Phone Number : 86-755-27374847
WhatsApp : +8618277967574
Product Description
When a substrate must survive the vibration of a space launch, the temperature extremes of an engine module, or the corrosive environment of a warship antenna, mechanical reinforcement is not optional—it is essential. Taconic TLX-8 is a PTFE fiberglass laminate engineered for exactly these conditions, combining reliable RF performance with the dimensional and mechanical stability that woven glass reinforcement provides.
TLX-8 is a high-volume antenna material offering reliability across a wide range of RF applications. Its versatility stems from a broad selection of available thicknesses and copper claddings, making it suitable for low-layer-count microwave designs. The woven fiberglass reinforcement delivers mechanical strength wherever a substrate experiences severe environments, while the PTFE-based dielectric ensures low loss and stable electrical performance. With a long space heritage, TLX-8 is used wherever woven fiberglass reinforcement is required.
| TLX-8 TYPICAL VALUES | |||||
| Property | Test Method | Unit | Value | Unit | Value |
| DK @10 GHz | IPC-650 2.5.5.3 | 2.55 | 2.55 | ||
| Df @1.9 GHz | IPC-650 2.5.5.5.1 | 0.0012 | 0.0012 | ||
| Df @10 GHz | IPC-650 2.5.5.5.1 | 0.0017 | 0.0017 | ||
| Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Flexural Strength(MD) | ASTM D 709 | psi | 28,900 | N/mm2 | |
| Flexural Strength(CD) | ASTM D 709 | psi | 20,600 | N/mm2 | |
| Tensile Strength(MD) | ASTM D 902 | psi | 35,600 | N/mm2 | |
| Tensile Strength(CD) | ASTM D 902 | psi | 27,500 | N/mm2 | |
| Elongation at Break(MD) | ASTM D 902 | % | 3.94 | % | 3.94 |
| Elongation at Break(CD) | ASTM D 902 | % | 3.92 | % | 3.92 |
| Young's Modulus(MD) | ASTM D 902 | kpsi | 980 | N/mm2 | |
| Young's Modulus(CD) | ASTM D 902 | kpsi | 1,200 | N/mm2 | |
| Young's Modulus(MD) | ASTM D 3039 | kpsi | 1,630 | N/mm2 | |
| Poisson's Ratio | ASTM D 3039 | 0.135 | N/mm | ||
| Peel Stength(1 oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 15 | N/mm | |
| Peel Stength(1 oz.RTF) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 17 | N/mm | |
| Peel Stength(½ oz.ed) | IPC-650 2.4.8.3(Elevated Temp.) | Ibs./linear inch | 14 | N/mm | |
| Peel Stength(½ oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 11 | N/mm | |
| Peel Stength(1 oz.rolled) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 13 | N/mm | 2.1 |
| Thermal Conductivity | ASTM F433/ASTM 1530-06 | W/M*K | 0.19 | W/M*K | 0.19 |
| Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(After Bake.) | mils/in. | 0.06 | mm/M | |
| Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.4(After Bake.) | mils/in. | 0.08 | mm/M | |
| Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.09 | mm/M | |
| Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.1 | mm/M | |
| Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm | 6.605 x 108 | Mohm | 6.605 x 108 |
| Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm | 3.550 x 106 | Mohm | 3.550 x 106 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm/cm | 1.110 x 1010 | Mohm/cm | 1.110 x 1010 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm/cm | 1.046 x 1010 | Mohm/cm | 1.046 x 1010 |
| CTE(X axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 21 | ppm/℃ | 21 |
| CTE(Y axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 23 | ppm/℃ | 23 |
| CTE(Z axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 215 | ppm/℃ | 215 |
| Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.25 | g/cm3 | 2.25 |
| Td(2% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 535 | ℃ | |
| Td(5% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 553 | ℃ | |
| Flammability Rating | UL-94 | V-0 | V-0 | ||
Note: TLX-8 exhibits approximately ±2% variation in Dk from -55°C to +125°C. For applications requiring greater temperature stability, Taconic TSMDS3 should be considered.
Applications
TLX-8 is a workhorse in the RF/microwave substrate world, with typical applications including:
The material's resistance to creep makes it particularly well suited to PWBs bolted to housings that encounter high levels of vibration during space launch. Its radiation resistance and low outgassing (listed on NASA's website for low outgassing materials) further support space applications.
Custom PCB Manufacturing on TLX-8
As a specialized manufacturer of high-frequency printed circuit boards, we offer comprehensive fabrication services using Taconic TLX-8 and other advanced materials. The following specification details a representative 2-layer rigid PCB implementation:
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PCB Construction Details:
| Parameter | Specification |
| Base Material | Taconic TLX-8 |
| Layer Count | 2-layer rigid |
| Board Dimensions | 45mm × 66.04mm per panel, ±0.15mm |
| Finished Thickness | 1.3mm |
| Copper Weight | 1 oz (1.4 mils) outer layers |
| Minimum Trace/Space | 6 / 9 mils |
| Minimum Hole Size | 0.4mm |
| Via Structure | No blind or buried vias |
| Via Plating Thickness | 20 μm |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Solder Mask | None (bare substrate) |
| Silkscreen | None |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Quality Standard | IPC-Class-2 |
Excellent PIM Performance:
TLX-8 delivers excellent PIM values in PCBs, measured at lower than -160 dBc using a manufactured PCB coupon with 20 watts per channel at 800 and 1800 MHz. This makes it well suited to sensitive receive paths in base station and radar antennas.
Low and Stable Dielectric Constant:
With a Dk of 2.55 ± 0.04 at 10 GHz, TLX-8 provides tightly controlled impedance and repeatable circuit performance. The material exhibits approximately ±2% variation in Dk from -55°C to +125°C, sufficient for most antenna and filter applications.
Low Dissipation Factor:
A dissipation factor of 0.0018 at 10 GHz minimizes signal attenuation in transmission lines, supporting efficient antenna feed networks and low-loss passive components.
Excellent Mechanical and Thermal Properties:
The woven fiberglass reinforcement provides mechanical strength and resistance to creep, making TLX-8 suitable for bolted assemblies subject to vibration. A CTE of 21 ppm/°C in X and 23 ppm/°C in Y (reasonably matched to copper) supports plated through-hole reliability, while the high Td (535°C at 2% weight loss) provides a wide processing window.
Low Moisture Absorption:
At 0.02%, TLX-8 absorbs very little moisture, maintaining stable electrical properties in humid environments—an essential attribute for outdoor and marine antenna applications.
Dimensional Stability:
Dimensional stability of 0.06/0.08 mm/M (MD/CD after bake) and 0.09/0.10 mm/M (MD/CD after thermal stress) supports tight registration tolerances and repeatable manufacturing yields.
Space Heritage and Environmental Resistance:
TLX-8 has a long space heritage, with radiation resistance and low outgassing properties suitable for satellite and launch vehicle applications. It also resists the extreme environments encountered at sea for warship antennas and the wide temperature ranges experienced by altimeter substrates during flight.
Quality and Availability
All boards are manufactured in compliance with IPC-Class-2 quality standards, ensuring robust reliability for commercial, industrial, and defense-related applications. 100% electrical testing is performed prior to shipment to guarantee functional integrity.
Our production capability extends to worldwide availability, with flexible shipping and logistics support for both prototype and volume requirements. We offer rapid turnaround and competitive pricing while maintaining strict process control.
For inquiries about custom stack-ups, panel sizes, alternative thicknesses, copper claddings, or other configurations, please contact our sales engineering team—we are ready to support your high-frequency circuit board requirements.
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