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Taconic TLX-8 High-Volume Fiberglass Reinforced Microwave Substrate and Custom both sided clad copper 50mil thick PCB with ENIG

Brand Name: Taconic Model Number: TLX-8

Product Description

 

When a substrate must survive the vibration of a space launch, the temperature extremes of an engine module, or the corrosive environment of a warship antenna, mechanical reinforcement is not optional—it is essential. Taconic TLX-8 is a PTFE fiberglass laminate engineered for exactly these conditions, combining reliable RF performance with the dimensional and mechanical stability that woven glass reinforcement provides.

 

TLX-8 is a high-volume antenna material offering reliability across a wide range of RF applications. Its versatility stems from a broad selection of available thicknesses and copper claddings, making it suitable for low-layer-count microwave designs. The woven fiberglass reinforcement delivers mechanical strength wherever a substrate experiences severe environments, while the PTFE-based dielectric ensures low loss and stable electrical performance. With a long space heritage, TLX-8 is used wherever woven fiberglass reinforcement is required.

 

 

TLX-8 TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK @10 GHz IPC-650 2.5.5.3   2.55   2.55
Df @1.9 GHz IPC-650 2.5.5.5.1   0.0012   0.0012
Df @10 GHz IPC-650 2.5.5.5.1   0.0017   0.0017
Dielectric Breakdown IPC-650 2.5.6 kV >45 kV >45
Moisture Absorption IPC-650 2.6.2.1 % 0.02 % 0.02
Flexural Strength(MD) ASTM D 709 psi 28,900 N/mm2  
Flexural Strength(CD) ASTM D 709 psi 20,600 N/mm2  
Tensile Strength(MD) ASTM D 902 psi 35,600 N/mm2  
Tensile Strength(CD) ASTM D 902 psi 27,500 N/mm2  
Elongation at Break(MD) ASTM D 902 % 3.94 % 3.94
Elongation at Break(CD) ASTM D 902 % 3.92 % 3.92
Young's Modulus(MD) ASTM D 902 kpsi 980 N/mm2  
Young's Modulus(CD) ASTM D 902 kpsi 1,200 N/mm2  
Young's Modulus(MD) ASTM D 3039 kpsi 1,630 N/mm2  
Poisson's Ratio ASTM D 3039   0.135 N/mm  
Peel Stength(1 oz.ed) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 15 N/mm  
Peel Stength(1 oz.RTF) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 17 N/mm  
Peel Stength(½ oz.ed) IPC-650 2.4.8.3(Elevated Temp.) Ibs./linear inch 14 N/mm  
Peel Stength(½ oz.ed) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 11 N/mm  
Peel Stength(1 oz.rolled) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 13 N/mm 2.1
Thermal Conductivity ASTM F433/ASTM 1530-06 W/M*K 0.19 W/M*K 0.19
Dimensional Stability(MD) IPC-650 2.4.39 Sec.5.5(After Bake.) mils/in. 0.06 mm/M  
Dimensional Stability(CD) IPC-650 2.4.39 Sec.5.4(After Bake.) mils/in. 0.08 mm/M  
Dimensional Stability(MD) IPC-650 2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.09 mm/M  
Dimensional Stability(CD) IPC-650 2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.1 mm/M  
Surface Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) Mohm 6.605 x 108 Mohm 6.605 x 108
Surface Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) Mohm 3.550 x 106 Mohm 3.550 x 106
Volume Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) Mohm/cm 1.110 x 1010 Mohm/cm 1.110 x 1010
Volume Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) Mohm/cm 1.046 x 1010 Mohm/cm 1.046 x 1010
CTE(X axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 21 ppm/℃ 21
CTE(Y axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 23 ppm/℃ 23
CTE(Z axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 215 ppm/℃ 215
Density(Specific Gravity) ASTM D 792 g/cm3 2.25 g/cm3 2.25
Td(2% Weight Loss) IPC-650 2.4.24.6(TGA) 535  
Td(5% Weight Loss) IPC-650 2.4.24.6(TGA) 553  
Flammability Rating UL-94   V-0   V-0

 

Note: TLX-8 exhibits approximately ±2% variation in Dk from -55°C to +125°C. For applications requiring greater temperature stability, Taconic TSMDS3 should be considered.

 

 

Applications

TLX-8 is a workhorse in the RF/microwave substrate world, with typical applications including:

  1. Radar Systems – Ground-based, airborne, and marine radar front-ends
  2. Mobile Communications – Base station antennas and RF front-end modules
  3. Microwave Test Equipment – Stable, repeatable test fixtures and calibration standards
  4. Microwave Transmission Devices – Waveguides, transitions, and feed networks
  5. Couplers, Splitters, Combiners, and Amplifiers – Passive and active RF components
  6. Antennas – Including warship antennas, altimeter substrates, and space-borne arrays

 

 

The material's resistance to creep makes it particularly well suited to PWBs bolted to housings that encounter high levels of vibration during space launch. Its radiation resistance and low outgassing (listed on NASA's website for low outgassing materials) further support space applications.

 

 

Custom PCB Manufacturing on TLX-8

As a specialized manufacturer of high-frequency printed circuit boards, we offer comprehensive fabrication services using Taconic TLX-8 and other advanced materials. The following specification details a representative 2-layer rigid PCB implementation:

 

Taconic TLX-8 High-Volume Fiberglass Reinforced Microwave Substrate and Custom both sided clad copper 50mil thick PCB with ENIG

 

PCB Construction Details:

Parameter Specification
Base Material Taconic TLX-8
Layer Count 2-layer rigid
Board Dimensions 45mm × 66.04mm per panel, ±0.15mm
Finished Thickness 1.3mm
Copper Weight 1 oz (1.4 mils) outer layers
Minimum Trace/Space 6 / 9 mils
Minimum Hole Size 0.4mm
Via Structure No blind or buried vias
Via Plating Thickness 20 μm
Surface Finish ENIG (Electroless Nickel Immersion Gold)
Solder Mask None (bare substrate)
Silkscreen None
Electrical Test 100% prior to shipment
Artwork Format Gerber RS-274-X
Quality Standard IPC-Class-2

 

 

Excellent PIM Performance:

TLX-8 delivers excellent PIM values in PCBs, measured at lower than -160 dBc using a manufactured PCB coupon with 20 watts per channel at 800 and 1800 MHz. This makes it well suited to sensitive receive paths in base station and radar antennas.

 

Low and Stable Dielectric Constant:
With a Dk of 2.55 ± 0.04 at 10 GHz, TLX-8 provides tightly controlled impedance and repeatable circuit performance. The material exhibits approximately ±2% variation in Dk from -55°C to +125°C, sufficient for most antenna and filter applications.

 

Low Dissipation Factor:
A dissipation factor of 0.0018 at 10 GHz minimizes signal attenuation in transmission lines, supporting efficient antenna feed networks and low-loss passive components.

 

Excellent Mechanical and Thermal Properties:
The woven fiberglass reinforcement provides mechanical strength and resistance to creep, making TLX-8 suitable for bolted assemblies subject to vibration. A CTE of 21 ppm/°C in X and 23 ppm/°C in Y (reasonably matched to copper) supports plated through-hole reliability, while the high Td (535°C at 2% weight loss) provides a wide processing window.

 

Low Moisture Absorption:
At 0.02%, TLX-8 absorbs very little moisture, maintaining stable electrical properties in humid environments—an essential attribute for outdoor and marine antenna applications.

 

Dimensional Stability:
Dimensional stability of 0.06/0.08 mm/M (MD/CD after bake) and 0.09/0.10 mm/M (MD/CD after thermal stress) supports tight registration tolerances and repeatable manufacturing yields.

 

Space Heritage and Environmental Resistance:
TLX-8 has a long space heritage, with radiation resistance and low outgassing properties suitable for satellite and launch vehicle applications. It also resists the extreme environments encountered at sea for warship antennas and the wide temperature ranges experienced by altimeter substrates during flight.

 

 

Quality and Availability

All boards are manufactured in compliance with IPC-Class-2 quality standards, ensuring robust reliability for commercial, industrial, and defense-related applications. 100% electrical testing is performed prior to shipment to guarantee functional integrity.

 

Our production capability extends to worldwide availability, with flexible shipping and logistics support for both prototype and volume requirements. We offer rapid turnaround and competitive pricing while maintaining strict process control.

 

For inquiries about custom stack-ups, panel sizes, alternative thicknesses, copper claddings, or other configurations, please contact our sales engineering team—we are ready to support your high-frequency circuit board requirements.

 

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