AGC Multi Material High-Volume TLX-6 DK 2.65 Fiberglass-Reinforced Microwave Substrate & Custom 2-Layer 3.5mil PCB Solution

Product Description

 

1. Introduction to TLX-6 High-Volume Antenna Material

 

TLX-6 is a PTFE fiberglass laminate from AGC Multi Material, designed as a high-volume antenna material that delivers proven reliability across a broad spectrum of RF applications. As part of the TLX product family, TLX-6 offers a dielectric constant (Dk) of 2.65 ± 0.04 and is available in a wide range of thicknesses and copper cladding options, making it a versatile workhorse for low-layer-count microwave designs.

 

What sets TLX-6 apart is its woven fiberglass reinforcement, which provides exceptional mechanical strength and dimensional stability in severe environments. This makes TLX-6 the material of choice for applications where substrates must endure extreme conditions:

 

Space Launch Vibration: Resistance to creep for PWBs bolted to housings experiencing high vibration levels.

 

High-Temperature Exposure: Withstands elevated temperatures in engine modules.

 

Radiation Resistance: Proven space heritage with low outgassing properties (see NASA outgassing data).

 

Extreme Maritime Environments: Resists harsh conditions aboard warship antennas.

 

Wide Temperature Ranges: Stable performance for altimeter substrates during flight.

 

With over 2.45 – 2.65 Dk range availability across the TLX product line, TLX-6 enables the manufacture of couplers, splitters, combiners, amplifiers, antennas, and other passive RF components.

 

2. Key Technical Specifications (TLX-6)

Property	Test Method	TLX-6 Value
Dielectric Constant (Dk) @ 10 GHz	IPC-650 2.5.5.3	2.65 ± 0.04
Dissipation Factor (Df) @ 1.9 GHz	IPC-650 2.5.5.5.1	0.0016
Dissipation Factor (Df) @ 10 GHz	IPC-650 2.5.5.5.1	0.0022
Dk Variation (-55°C to +125°C)	—	~ ± 2%

 

 

Outgassing Properties (NASA-Tested)

Property	Test Method	Units	TLX-6 Value
TML (Total Mass Loss)	ASTM E 595	%	0.09
CVCM (Collected Volatile Condensable Material)	ASTM E 595	%	<0.01
WVR (Water Vapor Regain)	ASTM E 595	%	0.06

 

 

As reported by NASA. TLX has a long space heritage and is used wherever woven fiberglass reinforcement is required.

 

3. Benefits & Advantages

TLX-6 offers a compelling combination of electrical, mechanical, and processing benefits:

 

Excellent PIM Performance: Measured at lower than -160 dBc (tested with 20W per channel @ 800 and 1800 MHz), ensuring clean signal transmission in demanding RF systems.

 

Low & Stable Dk: Tightly controlled dielectric constant (2.65 ± 0.04) with minimal variation across temperature, ensuring consistent circuit performance.

 

Low Dissipation Factor: Low loss at both 1.9 GHz (0.0016) and 10 GHz (0.0022), supporting high-efficiency designs.

 

Dimensionally Stable: Fiberglass reinforcement provides excellent mechanical stability and resistance to creep and cold flow.

 

Low Moisture Absorption: Minimizes dielectric property shifts in humid environments.

 

UL 94 V-0 Rating: Meets stringent flammability requirements.

 

Optimized Copper Adhesion: Surface treatment ensures strong copper bonding for reliable PCB fabrication.

 

Versatile Processing: Supports standard PCB manufacturing processes suitable for low-layer-count microwave designs.

 

 

4. Custom 2-Layer PCB Solution on TLX-6

Leveraging the exceptional properties of TLX-6, we offer the following precision-engineered 2-layer rigid PCB solution. This ultra-thin design is ideal for space-constrained, high-reliability RF and microwave applications.

 

 

PCB Construction Details

Parameter	Specification
Base Material	AGC TLX-6
Number of Layers	2
Finished Board Size	105 mm × 98 mm (±0.15 mm)
Finished Board Thickness	0.2 mm
Minimum Trace / Space	5 / 7 mils
Minimum Hole Size	0.3 mm (through-hole only; no blind vias)
Outer Layer Copper Weight	1 oz (35 μm)
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold (ENIG)
Top Silkscreen	White
Bottom Silkscreen	None
Top Solder Mask	None
Bottom Solder Mask	None
Electrical Testing	100% prior to shipment
Accepted Quality Standard	IPC-Class-2
Artwork Format	Gerber RS-274-X
Global Availability	Worldwide shipping

 

 

Design & Manufacturing Highlights

 

Ultra-Thin Profile: At just 0.2 mm finished thickness with a 3.5 mil (0.089 mm) core, this PCB offers an exceptionally low-profile, lightweight solution ideal for compact antenna arrays, couplers, and portable RF devices.

 

Fine-Feature Capability: Supports 5/7 mil trace/space and 0.3 mm micro-vias, enabling dense RF circuit layouts with excellent signal integrity.

 

Low-Loss Copper Layers: 1 oz (35 μm) copper on both sides provides high conductivity, while the optimized surface treatment ensures strong adhesion and reliable etching.

 

Reliable Interconnects: The Immersion Gold finish delivers a flat, oxidation-resistant, and highly solderable surface, ensuring robust component attachment and long-term reliability.

 

Excellent PTH Reliability: With 20 μm via plating and the material's low moisture absorption and dimensional stability, the PCB offers outstanding plated-through-hole integrity.

 

Strict Quality Control: Every board undergoes 100% electrical testing and is manufactured to IPC-Class-2 standards, guaranteeing consistent quality.

 

 

5. Typical Applications

TLX-6 is extensively used in a wide range of RF and microwave applications, including:

 

Radar Systems: Ground-based, airborne, and naval radar modules.

 

Mobile Communications: Base station antennas, filters, and combiners.

 

Microwave Test Equipment: Calibration fixtures and measurement devices.

 

Microwave Transmission Devices: Couplers, splitters, and power dividers.

 

Passive Components: Amplifiers, mixers, and filters.

 

Antenna Systems: Patch antennas, array antennas, and GPS/GNSS antennas.

 

Space & Defense: Satellite communication systems, warship antennas, and altimeter substrates.

 

 

6. Conclusion

As a specialized supplier of custom high-frequency circuit boards, we combine the proven performance of AGC TLX-6 – a high-volume, fiberglass-reinforced PTFE laminate with a long space heritage – with our precision manufacturing capabilities to deliver world-class PCB solutions. Our ultra-thin 2-layer offering fully leverages TLX-6's stable dielectric properties, low loss, excellent PIM performance, and mechanical robustness, ensuring your RF and microwave designs achieve the highest levels of performance and reliability.

 

Whether you are developing antennas for mobile communications, radar systems, satellite payloads, or defense electronics, our engineering team is ready to support your project. For technical consultations, samples, or volume orders, please contact us today. We look forward to being your trusted partner in high-frequency innovation.