High DK 10.2 2-Layer F4BTMS1000 PCB built on 10mil substarte laminate with OSP Finish

2-Layer F4BTMS1000 PCB | 10mil Core | OSP Finish

Product Overview

We are pleased to present this newly customized 2-layer rigid PCB built on Wangling's F4BTMS1000 aerospace-grade, high-reliability PTFE composite laminate. As an upgraded member of the F4BTMS series, this material incorporates a significant amount of ceramic filler with ultra-thin, ultra-fine glass fiber reinforcement, delivering exceptional electrical and mechanical performance for mission-critical RF and microwave applications.

The board measures 79.6mm x 45mm (single piece) with a finished thickness of 0.4mm (including 10mil core + 2 x 35μm copper) and dimensional tolerance of ±0.15mm. Minimum trace and space are 5/6 mils, with a minimum finished hole size of 0.2mm. No blind vias are used in this construction.

This design features no solder mask and no silkscreen on both sides—an intentional choice to eliminate parasitic losses and ensure optimal RF performance. The OSP (Organic Solderability Preservative) surface finish provides a flat, copper-preserving coating that ensures excellent solderability while maintaining low loss for high-frequency signals. Every board undergoes 100% electrical testing prior to shipment and conforms to IPC-Class-2 quality standards. Gerber files are supplied in RS-274-X format, and worldwide shipping is available.

PCB General Specifications

Material Advantages: F4BTMS1000

The F4BTMS series represents a significant technological breakthrough over the previous F4BTM series, achieved through advanced material formulation and manufacturing process improvements. The material is enriched with a large quantity of uniformly distributed special nano-ceramics and reinforced with ultra-thin, ultra-fine glass fiber cloth, resulting in substantially enhanced performance and a broader range of dielectric constants.

The use of minimal ultra-thin glass fiber reinforcement—combined with abundant ceramic loading—achieves several critical benefits:

Minimized glass weave effects on electromagnetic wave propagation

Reduced dielectric loss for cleaner signal transmission

Enhanced dimensional stability across varying conditions

Lower X/Y/Z anisotropy for more isotropic material behavior

Higher usable frequency range (stable performance to 40GHz and beyond)

Improved electrical strength and higher thermal conductivity

This makes F4BTMS1000 an aerospace-grade, high-reliability material suitable for space-vehicle and airborne equipment, capable of replacing comparable imported laminates.

The F4BTMS1000 comes standard with RTF (Reverse-Treated Foil) low-roughness copper, which reduces conductor loss while maintaining excellent peel strength. The material also features outstanding radiation resistance—maintaining stable dielectric and mechanical properties after irradiation exposure—and low outgassing performance meeting space-application vacuum requirements.

F4BTMS1000 Material Properties

PCB Stackup & Construction

The board features a thin, high-performance 2-layer stackup:

Top Copper (Layer 1): 1 oz (35μm) – RTF low-roughness copper

Dielectric Core: F4BTMS1000 – 10mil (0.254mm)

Bottom Copper (Layer 2): 1 oz (35μm) – RTF low-roughness copper

Total Finished Thickness: 0.4mm

Minimum trace and space are 5/6 mils, with a minimum finished hole size of 0.2mm. Via plating thickness is 20μm, and no blind vias are used. The design supports 42 components, 78 total pads (41 thru-hole, 37 top SMT), 36 vias, and 2 nets.

Both solder mask and silkscreen are omitted on both sides, preserving the bare dielectric surface for optimal RF performance and minimizing signal loss.

Typical Applications

Aerospace equipment – space and cabin-mounted systems

Microwave and RF circuits

Radar and military radar systems

Feed networks

Phase-sensitive antennas and phased array antennas

Satellite communication systems

Additional Capabilities

The F4BTMS1000 is compatible with standard PTFE circuit board processing techniques. It is suitable for multilayer and high-backplane fabrication and exhibits excellent machinability for dense hole patterns and fine-line circuits.

For enhanced thermal management or shielding, the F4BTMS series can also be supplied with aluminum-backed (F4BTMS1000-AL) or copper-backed (F4BTMS1000-CU) constructions. Optional 50Ω embedded resistor foil (nickel-phosphorus alloy, 0.2μm thickness, 50±5Ω/sq) is also available for select F4BTMS grades.

Standard panel sizes include 305×460mm (12"×18"), 460×610mm (18"×24"), and 610×920mm (24"×36"), with custom dimensions available upon request.

All PCBs are 100% electrically tested and shipped with a Certificate of Conformance per IPC-6012. For Gerber review, stackup confirmation, or volume pricing, please contact our technical sales team.