| MOQ: | 1PCS |
| Price: | 0.99-99USD/PCS |
| Standard Packaging: | Packing |
| Delivery Period: | 2-10 working days |
| Payment Method: | T/T, Paypal |
| Supply Capacity: | 50000pcs |
2-Layer RT/duroid 5870 High-Frequency PCB – 10mil (0.3mm) with ENIG Finish
Product Introduction
We present our 2-Layer RT/duroid 5870 PCB – an ultra-thin, high-performance circuit board engineered for demanding stripline, microstrip, and millimeter-wave applications. Fabricated with Rogers RT/duroid 5870 glass microfiber-reinforced PTFE laminate and finished with Electroless Nickel Immersion Gold (ENIG) , this 0.3mm (10mil) board delivers an exceptionally low and stable dielectric constant (Dk 2.33 ±0.02 @ 10 GHz) and ultra-low dissipation factor (Df 0.0012). The randomly oriented glass microfibers ensure isotropic electrical properties and uniform Dk from panel to panel – critical for phase-sensitive designs up to Ku-band and beyond.
Key Specifications
| Parameter | Details |
| Base Material | Rogers RT/duroid 5870 (Glass microfiber-reinforced PTFE) |
| Layer Count | 2 Layers (Double-sided) |
| Finished Thickness | 0.3 mm (10 mil) |
| Copper Weight | 1 oz (35 μm) on both outer layers |
| Min Trace/Space | 5 / 6 mils |
| Min Hole Size | 0.4 mm (Mechanical drilling) |
| Via Plating Thickness | 20 μm |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Solder Mask | None (Top & Bottom) |
| Silkscreen | None (Top & Bottom) |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Accepted Standard | IPC-Class-2 |
| Availability | Worldwide |
PCB Stackup (2-Layer Rigid)
| Layer | Material | Thickness |
| Top Copper | 1 oz (35 μm) | – |
| Substrate | Rogers RT/duroid 5870 | 0.254 mm (10 mil) |
| Bottom Copper | 1 oz (35 μm) | – |
Note: No blind vias – all interconnections are through-hole vias. No solder mask or silkscreen ensures minimal signal interference for critical RF paths.
PCB Statistics
Dimensions: 85 mm × 36 mm ±0.15 mm (1 piece)
Components: 36
Total Pads: 56 (32 thru-hole, 24 SMT on top, 0 on bottom)
Vias: 28
Nets: 2
Why RT/duroid 5870?
RT/duroid 5870 is a glass microfiber-reinforced PTFE composite designed for exacting high-frequency circuits. Unlike woven-glass reinforced materials, the randomly oriented microfibers eliminate Dk variation caused by glass weave effects – delivering exceptional dielectric constant uniformity from panel to panel and across frequency. With the lowest electrical loss of any reinforced PTFE material, RT/duroid 5870 extends its usefulness to Ku-band, K-band, and millimeter-wave frequencies while remaining easily machinable using standard PTFE fabrication methods.
Key Features of RT/duroid 5870
| Parameter | Value |
| Dielectric Constant (Dk) | 2.33 ±0.02 @ 10 GHz |
| Dissipation Factor (Df) | 0.0012 @ 10 GHz |
| Temperature Coefficient of Dk (TCDk) | -115 ppm/°C |
| Moisture Absorption | 0.02% (ultra-low) |
| CTE – X axis | 22 ppm/°C |
| CTE – Y axis | 28 ppm/°C |
| CTE – Z axis | 173 ppm/°C |
| Isotropic | Yes (random microfiber reinforcement) |
Benefits of This 10mil RT/duroid 5870 PCB
Ultra-Low & Stable Dk (2.33 ±0.02): Tight tolerance ensures predictable impedance and phase matching – critical for phased arrays and beamforming networks.
Lowest Loss Reinforced PTFE: Df of 0.0012 at 10 GHz – extends performance to Ku-band and millimeter-wave (up to 100 GHz+).
No Glass Weave Effect: Randomly oriented microfibers eliminate Dk variation associated with woven-glass PTFE – ideal for long differential pairs and phase-sensitive circuits.
Uniform Panel-to-Panel: Consistent electrical properties simplify high-volume production without per-panel tuning.
Ultra-Thin 10mil Profile: Enables compact, low-profile designs and controlled impedance with narrow trace widths.
Process-Friendly: Easily cut, sheared, and machined to shape. Resistant to all solvents and reagents used in etching or plating edges and holes.
ENIG Finish: Provides a flat, solderable, oxidation-resistant surface for fine-pitch SMT components (24 top pads). No solder mask preserves RF performance on exposed traces.
High Moisture Resistance: 0.02% moisture absorption ensures stable electrical performance in humid environments.
Quality Assurance
100% electrical testing prior to shipment
IPC-Class-2 compliance
Full Gerber RS-274-X acceptance
ISO 9001 certified production
Typical Applications
Commercial Airline Broadband Antennas (In-Flight Connectivity)
Microstrip & Stripline Circuits (High-frequency filters, couplers, power dividers)
Millimeter-Wave Applications (5G NR FR2, E-band, V-band)
Radar Systems (Automotive, defense, weather)
Guidance Systems (Missile, drone, navigation)
Point-to-Point Digital Radio Antennas (Backhaul, microwave links)
Satellite Communication Downconverters
Test & Measurement Fixtures (Up to 100 GHz)
| MOQ: | 1PCS |
| Price: | 0.99-99USD/PCS |
| Standard Packaging: | Packing |
| Delivery Period: | 2-10 working days |
| Payment Method: | T/T, Paypal |
| Supply Capacity: | 50000pcs |
2-Layer RT/duroid 5870 High-Frequency PCB – 10mil (0.3mm) with ENIG Finish
Product Introduction
We present our 2-Layer RT/duroid 5870 PCB – an ultra-thin, high-performance circuit board engineered for demanding stripline, microstrip, and millimeter-wave applications. Fabricated with Rogers RT/duroid 5870 glass microfiber-reinforced PTFE laminate and finished with Electroless Nickel Immersion Gold (ENIG) , this 0.3mm (10mil) board delivers an exceptionally low and stable dielectric constant (Dk 2.33 ±0.02 @ 10 GHz) and ultra-low dissipation factor (Df 0.0012). The randomly oriented glass microfibers ensure isotropic electrical properties and uniform Dk from panel to panel – critical for phase-sensitive designs up to Ku-band and beyond.
Key Specifications
| Parameter | Details |
| Base Material | Rogers RT/duroid 5870 (Glass microfiber-reinforced PTFE) |
| Layer Count | 2 Layers (Double-sided) |
| Finished Thickness | 0.3 mm (10 mil) |
| Copper Weight | 1 oz (35 μm) on both outer layers |
| Min Trace/Space | 5 / 6 mils |
| Min Hole Size | 0.4 mm (Mechanical drilling) |
| Via Plating Thickness | 20 μm |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Solder Mask | None (Top & Bottom) |
| Silkscreen | None (Top & Bottom) |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Accepted Standard | IPC-Class-2 |
| Availability | Worldwide |
PCB Stackup (2-Layer Rigid)
| Layer | Material | Thickness |
| Top Copper | 1 oz (35 μm) | – |
| Substrate | Rogers RT/duroid 5870 | 0.254 mm (10 mil) |
| Bottom Copper | 1 oz (35 μm) | – |
Note: No blind vias – all interconnections are through-hole vias. No solder mask or silkscreen ensures minimal signal interference for critical RF paths.
PCB Statistics
Dimensions: 85 mm × 36 mm ±0.15 mm (1 piece)
Components: 36
Total Pads: 56 (32 thru-hole, 24 SMT on top, 0 on bottom)
Vias: 28
Nets: 2
Why RT/duroid 5870?
RT/duroid 5870 is a glass microfiber-reinforced PTFE composite designed for exacting high-frequency circuits. Unlike woven-glass reinforced materials, the randomly oriented microfibers eliminate Dk variation caused by glass weave effects – delivering exceptional dielectric constant uniformity from panel to panel and across frequency. With the lowest electrical loss of any reinforced PTFE material, RT/duroid 5870 extends its usefulness to Ku-band, K-band, and millimeter-wave frequencies while remaining easily machinable using standard PTFE fabrication methods.
Key Features of RT/duroid 5870
| Parameter | Value |
| Dielectric Constant (Dk) | 2.33 ±0.02 @ 10 GHz |
| Dissipation Factor (Df) | 0.0012 @ 10 GHz |
| Temperature Coefficient of Dk (TCDk) | -115 ppm/°C |
| Moisture Absorption | 0.02% (ultra-low) |
| CTE – X axis | 22 ppm/°C |
| CTE – Y axis | 28 ppm/°C |
| CTE – Z axis | 173 ppm/°C |
| Isotropic | Yes (random microfiber reinforcement) |
Benefits of This 10mil RT/duroid 5870 PCB
Ultra-Low & Stable Dk (2.33 ±0.02): Tight tolerance ensures predictable impedance and phase matching – critical for phased arrays and beamforming networks.
Lowest Loss Reinforced PTFE: Df of 0.0012 at 10 GHz – extends performance to Ku-band and millimeter-wave (up to 100 GHz+).
No Glass Weave Effect: Randomly oriented microfibers eliminate Dk variation associated with woven-glass PTFE – ideal for long differential pairs and phase-sensitive circuits.
Uniform Panel-to-Panel: Consistent electrical properties simplify high-volume production without per-panel tuning.
Ultra-Thin 10mil Profile: Enables compact, low-profile designs and controlled impedance with narrow trace widths.
Process-Friendly: Easily cut, sheared, and machined to shape. Resistant to all solvents and reagents used in etching or plating edges and holes.
ENIG Finish: Provides a flat, solderable, oxidation-resistant surface for fine-pitch SMT components (24 top pads). No solder mask preserves RF performance on exposed traces.
High Moisture Resistance: 0.02% moisture absorption ensures stable electrical performance in humid environments.
Quality Assurance
100% electrical testing prior to shipment
IPC-Class-2 compliance
Full Gerber RS-274-X acceptance
ISO 9001 certified production
Typical Applications
Commercial Airline Broadband Antennas (In-Flight Connectivity)
Microstrip & Stripline Circuits (High-frequency filters, couplers, power dividers)
Millimeter-Wave Applications (5G NR FR2, E-band, V-band)
Radar Systems (Automotive, defense, weather)
Guidance Systems (Missile, drone, navigation)
Point-to-Point Digital Radio Antennas (Backhaul, microwave links)
Satellite Communication Downconverters
Test & Measurement Fixtures (Up to 100 GHz)