Taconic TRF-45 Dk 4.5 ceramic-filled PTFE laminate 2-Layer High-Frequency PCB – 32mil (0.9mm) with Immersion Gold Finish

2-Layer TRF-45 High-Frequency PCB – 32mil (0.9mm) with Immersion Gold Finish

Product Introduction

We present our 2-Layer TRF-45 PCB – a high-performance, low-loss circuit board engineered for reliable RF and microwave applications. Fabricated with Taconic TRF-45 ceramic-filled PTFE laminate and finished with Immersion Gold (ENIG) , this 0.9mm (32mil) board delivers a stable dielectric constant (Dk 4.5 ±0.15 @ 10 GHz), low dissipation factor (Df 0.0035), and exceptional dimensional stability. The woven-glass reinforcement enables standard PTFE processing methods (shearing, drilling, plating), reducing lead times while maintaining high reliability for antenna and wireless communication systems.

Key Specifications

PCB Stackup (2-Layer Rigid)

Note: No blind vias – all interconnections are through-hole vias, simplifying fabrication and reducing cost.

PCB Statistics

Dimensions: 105 mm × 76 mm ±0.15 mm (1 piece)

Components: 42

Total Pads: 38 (25 thru-hole, 13 SMT on top, 0 on bottom)

Vias: 15

Nets: 2 (Simple, high-frequency signal paths)

Why TRF-45?

TRF-45 represents Taconic's next-generation low-loss, thermally stable laminate technology. As a ceramic-filled PTFE with woven-glass reinforcement, it offers superior dimensional stability compared to non-reinforced PTFE materials. The low and consistent Z-axis expansion across a wide temperature range (including lead-free soldering conditions) ensures reliable plated through-hole (PTH) integrity. Critically, TRF-45 can be sheared, drilled, and plated using standard PTFE woven fiberglass methods – no specialized processing required.

Key Features of TRF-45

Benefits of This 32mil TRF-45 PCB

Stable Dk Over Temperature: 4.5 ±0.15 ensures consistent impedance and phase response across operating conditions – critical for antenna and filter designs.

Low Loss Performance: Df of 0.0035 at 10 GHz minimizes signal attenuation for efficient RF transmission.

Dimensional Stability: Woven-glass reinforcement provides excellent X/Y stability with CTE of 9 ppm/°C – matched closely to copper.

Reliable PTH Integrity: Low and consistent Z-axis expansion (40 ppm/°C) reduces via cracking risk during soldering and thermal cycling.

Process-Friendly: Can be sheared, drilled, and plated using standard PTFE woven fiberglass methods – no exotic handling required.

Immersion Gold Finish: Provides a flat, solderable, oxidation-resistant surface for fine-pitch SMT components (13 top SMT pads). Green solder mask on top protects critical traces while leaving bottom exposed for optimal RF grounding.

Low Moisture Absorption: 0.06% ensures stable electrical performance in humid environments.

Quality Assurance

100% electrical testing prior to shipment

IPC-Class-2 compliance

Full Gerber RS-274-X acceptance

ISO 9001 certified production

Typical Applications

Satellite Radio Antennas (SiriusXM, DAB)

RFID Antennas (UHF, microwave bands)

GPS Antennas (navigation, timing)

Patch Antennas for wireless communications

Low-Profile RF Modules

Automotive Telematics Antennas

Ordering Information

Submit your Gerber RS-274-X files and fabrication drawings. We support prototype to volume production with global shipping. Contact us for:

Impedance control reports

Dk/Df test verification

Volume pricing and lead times